KR101022928B1 - Radiating Package Module in Exothermic Element - Google Patents

Abstract

The heat dissipation package module of the heating element according to the present invention is a heat conduction element mounted on one surface of the heat conduction plate having a female threaded groove portion, a heat pipe having a screw threaded coupling portion and the male screw-shaped coupling portion between the groove portion and the coupling portion The heat dissipation reliability of the heat dissipation package may be maintained and structural reliability may be improved, including an adhesive applied and a heat dissipation unit connected to one side of the heat pipe.

Heating element, light emitting element, heat conduction plate, heat pipe, adhesive, polymer core

Description

Radiating Package Module in Heating Element {Radiating Package Module in Exothermic Element}

The present invention relates to a heat dissipation package module of a heat generating element.

The light quantity of the light emitting device is very sensitive to the design of the heat dissipation package. Considering that 60% ~ 80% of the applied power is actually emitted as heat, the heat dissipation design of the heat dissipation package is very important in the field of luminous efficiency and thermal reliability of the light emitting device. In addition, in the case of a package module mounted with a heat generating element other than the light emitting element, the efficiency of the module is greatly influenced by the heat dissipation capability of the designed heat dissipation package module.

In general, a heat dissipation package module of a heat generating element uses a forced air cooling method, and as a part of the heat dissipation package module, a heat sink, a heat pipe, a fan, a blower, etc. It has been used depending on.

In addition, a thermal interface material (TIM) is used between the heating element and the heat sink to minimize thermal resistance generated in the empty space. In addition, the heat dissipation package module itself has improved heat transfer characteristics by connecting heat dissipation parts by using solder paste or heat dissipation grease on its connection to minimize thermal resistance between the heat dissipation parts.

Conventional heat dissipation package module has generally been composed of a heat generating element, a heat conduction plate for mounting the heat generating element, a heat pipe for transferring the heat released, and a heat dissipation unit for dissipating the transferred heat to the outside.

At this time, in order to assemble the heat pipe and the heat pipe to which the heating element is fixed, the heat pipe is forcibly pressed into the heat conductive plate, and then a press method is used. This forced indentation damages the surface of the heat pipe, so there is a risk of leakage of the heat pipe during the reliability test. When solder paste is used as the adhesive, when the heat pipe and the heat conduction plate are combined in the reflow process, It is known that the adhesive state causes a problem.

Accordingly, the heat dissipation package module has caused a problem of cracking in high temperature reliability, shock and vibration tests. In particular, a crack occurs between the solder paste material and the heat pipe, or the solder paste material and the heat conduction plate due to external vibration, resulting in a problem that the life of the package is shortened by increasing the thermal resistance at the contact surface.

The present invention was devised to solve the above problems, and aims to improve structural reliability through a change in bonding shape, rather than a simple bonding method by solder paste or heat dissipation grease.

In addition, the present invention, the groove portion of the heat conduction plate and the coupling portion of the heat pipe has a spiral shape and screwed, the groove portion of the heat conduction plate and the coupling portion of the heat pipe has a fine pattern and further includes a polymer core in the solder paste or heat dissipation grease. The purpose is to propose a heat dissipation package that can improve both heat dissipation reliability and structural reliability.

In the heat dissipation package module of the heating element according to a preferred embodiment of the present invention, a heat conduction element mounted on one surface of the heat generating element has a female threaded groove portion, a heat pipe having a male screw-shaped coupling portion inserted into the groove portion, and the groove portion; The adhesive is applied between the coupling portion, and characterized in that it comprises a heat dissipation portion connected to one side of the heat pipe.

In addition, the present invention is characterized in that the groove portion penetrates from one side of the heat conductive plate to the other side.

In addition, the present invention is characterized in that the engaging portion is a round screw shape.

A heat dissipation package module of a heating element according to another preferred embodiment of the present invention, the heat conduction element is mounted on one surface of the heat conduction plate having a female threaded groove portion, the heat pipe is screw-inserted into the groove portion has a male thread-shaped coupling portion, the An adhesive applied between the groove part and the coupling part, a polymer core mixed with the adhesive, and a heat dissipation part connected to one side of the heat pipe, wherein one of the surfaces of the groove part or the surface of the coupling part has a fine pattern formed thereon It features.

In addition, the present invention is characterized in that the fine pattern is formed in the same direction as the screw shape.

In the heat dissipation package module of the heating element according to another preferred embodiment of the present invention, the heat generating element is mounted on one surface and has a female screw-shaped groove portion having a first fine pattern formed on the surface of the groove portion, screw inserting the groove portion A heat pipe having a male threaded joint and having a second micropattern formed on the surface of the joint, an adhesive applied between the groove and the joint, a polymer core mixed with the adhesive, and heat radiation connected to one side of the heat pipe It is characterized by including a wealth.

In addition, the first fine pattern and the second fine pattern is formed in the same direction as the screw shape, characterized in that formed in the same position.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to this, the terms or words used in this specification and claims are not to be interpreted in a conventional and dictionary sense, and the inventors may appropriately define the concept of terms in order to best describe their own invention. It should be interpreted as meaning and concept corresponding to the technical idea of the present invention based on the principle that the present invention.

The present invention can improve the structural reliability of the heat dissipation package through structural change by adopting a screw coupling method instead of a simple forced press-fit method.

In addition, the present invention can maintain the heat transfer characteristics and improve the structural reliability of the heat dissipation package by bonding using an adhesive including a polymer core between the heat conduction plate and the heat pipe so as not to generate heat resistance between the heat dissipation parts.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments associated with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as much as possible, even if displayed on different drawings. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a heat dissipation package module of a heat generating device according to a preferred embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line A-A 'of the heat conduction plate included in the heat dissipation package module, and FIG. A perspective view of a heat pipe screwed with the heat conducting plate.

Referring to Figure 1 describes the heat dissipation package module 100 according to a preferred embodiment of the present invention.

The heat dissipation package module 100 according to the present embodiment includes a heat conduction plate 20 mounted on one surface of the heat generating element 10 and having a groove, a heat pipe 30 having a coupling part screwed into the groove, the groove and the groove. Adhesive is applied between the coupling portion, and characterized in that it comprises a heat dissipation portion 40 connected to one side of the heat pipe (30).

Here, the heat generating element 10 refers to a device that generates heat to the outside when the device is operating, such as a light emitting device. In particular, the light emitting device refers to a device for converting electrical energy into light energy, and the light emitting device may be an integrated circuit chip (LED) such as a light emitting diode (LED) and an injection laser diode (ILD). Can be. Among light emitting devices, LEDs are widely used in various fields because they are inexpensive and operate in a wide temperature range, and have recently been widely used for automobile lighting as well as general lighting.

In addition, the heat conduction plate 20 mounts the heating element 10 on one surface. The heat conduction plate 20 fixes and supports the heat generating element 10, and transmits heat generated from the heat generating element 10 to the heat pipe 30.

The heat pipe 30 absorbs heat transferred through the heat conduction plate 20 and transfers the heat to the heat dissipation unit 40. The heat pipe 30 is divided into a method of transferring heat through evaporation and condensation by including a working fluid inside the pipe and a method of transferring heat consisting of a material having a very high thermal conductivity without including the working fluid inside the pipe. . In the heat pipe according to the present invention, both types of the above-described methods may be employed.

In addition, the adhesive may be a solder paste and a heat-dissipating grease, for example, is applied between the groove portion of the heat conductive plate 20 and the coupling portion of the heat pipe 30 to prevent the void space generated between the groove portion and the coupling portion heat conductive plate And improves the thermal conductivity of the heat pipe. In addition, the adhesive cured through the reflow process bonds the heat conduction plate and heat pipe more firmly.

Finally, as shown in FIG. 1, the heat dissipation part 40 has a fin shape and serves to discharge heat transferred through the heat pipe to the outside. However, the heat dissipation unit 40 is not limited to the fin shape shown in FIG. 1, and may be configured to further include a cooling fan.

Referring to Figure 2 describes the heat conducting plate according to a preferred embodiment of the present invention in detail.

As shown in FIG. 2, the heat conduction plate 20 has a female portion groove 21.

Here, the groove portion 21 may be formed in the central direction from one side forming the thickness direction of the heat conductive plate. The groove portion 21 is a region where the coupling portion 31 of the heat pipe 30, which will be described later, is screwed into the coupling portion.

At this time, the groove portion 21 may be formed so as to penetrate a portion in the central direction of the heat conduction plate 20, but in order to widen the contact area between the heat pipe 30 and the heat conduction plate 20 completely from one side to the other side in the thickness direction. It is preferably formed through.

In addition, the groove portion 21 has a female screw shape. Herein, the female screw shape refers to a shape in which a screw line is formed inside the groove portion. Due to the shape, the heat pipe 30 having the male threaded coupling portion 31 to be described later can be more firmly coupled to the heat conducting plate 20 when screwed.

On the other hand, the shape of the thread, such as the pitch of the female thread or the depth of the screw thread, preferably corresponds to the shape of the male screw so that the male screw and the screw coupling easily formed in the coupling portion 31 of the heat pipe 30 to be described later easily occurs.

Referring to Figure 3 in detail the heat pipe according to the preferred embodiment of the present invention.

As shown in FIG. 3, the heat pipe 30 has a male threaded coupling portion 31.

Here, the coupling portion 31 is formed on one side of the heat pipe 30, the length thereof preferably corresponds to the length of the groove portion 21 of the heat conduction plate described above. In addition, the coupling part 31 may be formed at an intermediate point of the heat pipe 30, but is preferably formed from an intermediate point of the heat pipe 30 to one end. Accordingly, the degree of heat pipe 30 positioned on the heat conduction plate 20 can be adjusted.

In addition, the engaging portion 31 has a male screw shape. Here, the male screw shape refers to a shape having a thread on the surface of the pipe (thread is formed out of the screw bone).

At this time, unlike the simple rolling coupling, the groove 21 and the coupling portion 31 of the heat pipe 30 of the heat conduction plate 20 are screw-coupled to reduce the frequency of cracks generated in the coupling process, and the groove 21 ), The contact area between the coupling portion 31 can be widened, and the thermal conductivity is improved.

Meanwhile, the male screw shape may have various shapes such as a triangular screw, a square screw, and a tooth screw. At this time, the male screw shape preferably has a round screw shape so as to widen the contact surface, so that the screw coupling of the groove portion 21 and the coupling portion 31 can be performed without friction.

4 is a cross-sectional view of the heat conductive plate according to another preferred embodiment of the present invention taken along the line A-A ', FIG. 5 is a perspective view of a heat pipe screwed to the heat conductive plate, and FIG. 6 is a groove of the heat conductive plate. It is sectional drawing which shows the shape which the heat pipe couple | bonded with.

Hereinafter, the heat dissipation package module of the heat generating element according to another embodiment of the present invention will be described with reference to FIGS. 4 to 6. However, detailed description of the same configuration as the heat dissipation package described with reference to FIGS. 1 to 3 will be omitted.

Referring to Figure 4 describes the heat conducting plate according to a preferred embodiment of the present invention in detail.

Here, the thermal conductive plate 20 may have a female threaded groove 21, and may further include a fine pattern 22 on the surface of the female screw.

At this time, the fine pattern 22 refers to a fine groove formed inside the female screw surface. Since the microgroove may have various shapes such as triangle, rectangle, and circle, the shape of the micropattern is not limited. In addition, the fine pattern 22 is preferably formed continuously with a shape of a solid line or broken line on the female screw surface.

Here, the fine pattern 22 is preferably formed in the same direction as the moving direction of the female screw, as shown in FIG. The female thread has a constant twist angle and is formed inside the surface. In this case, when the fine pattern is also formed with the same angle as the twist angle of the female screw, the fine pattern may be formed in the same direction as the thread of the female screw. In addition, a plurality of fine patterns 22 may be formed on one thread by adjusting the width of the fine patterns 22 and adjusting a gap between adjacent fine patterns.

Meanwhile, the micropattern 22 may be formed by mechanical etching, and may be embedded by an adhesive including a polymer core described later in the process of coupling the coupling portion 31 and the groove portion 21 of the heat pipe 30. When the adhesive is embedded in the micropattern, the thermal conductivity is improved, and the groove portion 21 of the heat conductive plate 20 and the coupling portion 31 of the heat pipe 30 are more strongly coupled.

In addition, when the coupling portion 31 of the heat pipe 30 having a male screw shape is screwed into the groove portion, the adhesive and the polymer core (not shown) are naturally inserted into the fine pattern 22.

In this case, the polymer core may be a spherical particle composed of a core made of a polymer and a contact layer surrounding the core. Here, the core is made of a polymer and excellent in stress relaxation ability, and the contact layer is formed of a metal plated layer to have thermal conductivity. The polymer and metal plating layer constituting the core are not limited to a specific type, but the connection layer is preferably composed of gold and nickel having excellent thermal conductivity.

In addition, the diameter of the polymer core is not limited, and various sizes of polymer cores may be applied to this embodiment. However, it is preferable to adopt a polymer core having a corresponding size in consideration of the size of the micro pattern so that the polymer core can be inserted into the micro pattern 22 described above.

Therefore, while the thermal conductivity transferred from the heat conduction plate 20 to the heat pipe 30 is maintained by inserting the polymer core into the micropattern 22, the crack generated in the heat conduction plate 20 proceeds toward the female screw surface. The polymer core absorbs the shock that is changed or delayed and continues to be applied to the heat conducting plate 20, thereby slowing the progress of the crack.

A heat pipe according to a preferred embodiment of the present invention will be described in detail with reference to FIG. 5 as follows.

Here, the heat pipe 30 has a male threaded coupling portion 31, and further includes a fine pattern 32 on the surface of the male screw.

In this case, the fine pattern 32 of the male screw surface may have the same shape as the fine pattern 22 of the groove portion 21 formed in the above-described thermal conductive plate 20 and may be formed in the same manner. In addition, the fine pattern 32 formed on the male screw surface of the coupling portion 31 is a polymer to the fine pattern 32 of the coupling portion 31, such that the polymer core is inserted into the fine pattern 22 of the groove portion 21. The core can be inserted and fixed.

Such a polymer core also changes or retards the propagation direction of cracks generated in the heat pipe 30 and absorbs the impact applied to the heat pipe 30.

Meanwhile, since the micropattern 22 formed on the female screw surface and the micropattern 32 formed on the male screw surface may be formed through separate mechanical etching, they may have different shapes. However, even if it has a separate shape, it is preferable that it is formed in the same direction as the screw shape as described above with reference to FIG.

6 is a cross-sectional view showing a shape in which the coupling portion 31 of the heat pipe 30 is screwed to the groove portion 21 of the thermal conductive plate 20. Referring to Figure 6 describes the screw coupling shape of the groove portion 21 and the coupling portion 31 as follows.

At this time, both the groove portion 21 and the coupling portion 31 may be implemented to have a fine pattern on the surface. That is, the first fine pattern 22 is formed on the surface of the groove 21, and the second fine pattern 32 is formed on the surface of the coupling part 31. In this case, the polymer cores may be inserted into and fixed to the first fine patterns 22 and the second fine patterns 32, respectively.

On the other hand, the polymer core 51 may be positioned between the surface of the coupling portion 31 and the surface of the groove 21 in which the micropattern is not formed, and the stress relaxation ability is still maintained to alleviate the shock applied to the heat dissipation package. It plays a role.

In addition, as shown in FIG. 6, the first fine patterns 22 and the second fine patterns 32 may be formed in the same direction as the screw shape and may be formed at corresponding positions. Accordingly, the polymer core 51 may be located between the fine patterns 22 and 32.

At this time, since the polymer core 51 is inserted evenly between the micropatterns 22 and 32, the polymer core 51 may delay cracks generated in the groove 21 or the coupling part 31, and reduce the impact applied to the heat dissipation package. Can be.

Meanwhile, FIG. 6 shows that three fine patterns 32 are formed on the unit threads of the coupling part 31, but this is just an example, and the size of the polymer core 51 included in the adhesive 50 is also illustrated. By varying the degree of etching according to the size of the fine pattern 32 can be adjusted.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 is a perspective view showing a heat dissipation package module of a heating element according to a preferred embodiment of the present invention.

2 is a cross-sectional view taken along the line AA ′ of the thermal conductive plate according to the preferred embodiment of the present invention.

3 is a perspective view of a heat pipe according to a preferred embodiment of the present invention.

4 is a cross-sectional view taken along the line AA ′ of the thermal conductive plate according to another exemplary embodiment of the present invention.

5 is a perspective view of a heat pipe according to another preferred embodiment of the present invention.

6 is a cross-sectional view illustrating a shape in which a coupling portion of a heat pipe is screwed to a groove portion of a thermal conductive plate according to an exemplary embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10: heating element 20: heat conduction plate

21: groove portion 22: fine pattern

30: heat pipe 31: coupling portion

32: fine pattern 40: heat dissipation unit

50: adhesive 51: polymer core

Claims (7)

A heat conduction plate mounted on one surface of the heat generating element and having a female threaded groove; A heat pipe screwed into the groove and having a coupling portion having a male screw shape; An adhesive applied between the groove portion and the coupling portion; And A heat dissipation package module of a heat generating element comprising a heat dissipation unit connected to one side of the heat pipe. The method according to claim 1, The heat dissipation package module of the heat generating element, characterized in that the groove penetrates from one side of the heat conduction plate to the other side. The method according to claim 1, The coupling portion of the heat dissipation package module, characterized in that the round screw shape. A heat conduction plate mounted on one surface of the heat generating element and having a female threaded groove; A heat pipe screwed into the groove and having a coupling portion having a male screw shape; An adhesive applied between the groove portion and the coupling portion; A polymer core mixed with the adhesive; And It includes a heat dissipation unit connected to one side of the heat pipe, Any one of the surface of the groove portion or the surface of the coupling portion is a heat dissipation package module, characterized in that the fine pattern is formed. The method according to claim 4, The fine pattern is a heat dissipation package module, characterized in that formed in the same direction as the screw shape. A heat conduction plate mounted on one surface of the heat generating element, the groove having a female screw shape, and having a first fine pattern formed on a surface of the groove; A heat pipe screwed into the groove, the heat pipe having a male screw coupling portion, and having a second fine pattern formed on a surface of the coupling portion; An adhesive applied between the groove portion and the coupling portion; A polymer core mixed with the adhesive; And A heat dissipation package module of a heat generating element comprising a heat dissipation unit connected to one side of the heat pipe. The method according to claim 6, The first micropattern and the second micropattern may be formed in the same direction in the female screw shape and the male screw shape, respectively, and the first micropattern and the second micropattern may be formed at positions corresponding to each other. Heat dissipation package module of the heating element.

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