KR101629757B1 - Led lamp using gold-plated thermal conductivity chip - Google Patents

Led lamp using gold-plated thermal conductivity chip Download PDF

Info

Publication number
KR101629757B1
KR101629757B1 KR1020150165180A KR20150165180A KR101629757B1 KR 101629757 B1 KR101629757 B1 KR 101629757B1 KR 1020150165180 A KR1020150165180 A KR 1020150165180A KR 20150165180 A KR20150165180 A KR 20150165180A KR 101629757 B1 KR101629757 B1 KR 101629757B1
Authority
KR
South Korea
Prior art keywords
gold
film
via hole
copper
pcb assembly
Prior art date
Application number
KR1020150165180A
Other languages
Korean (ko)
Inventor
이영섭
Original Assignee
주식회사 테크엔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테크엔 filed Critical 주식회사 테크엔
Priority to KR1020150165180A priority Critical patent/KR101629757B1/en
Application granted granted Critical
Publication of KR101629757B1 publication Critical patent/KR101629757B1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F21Y2101/02—

Abstract

The present invention relates to an LED lamp using a gold-plated thermal-conductive chip having a via hole (240) formed between a lower copper foil surface (230) and an LED element thermal terminal (19) bonded copper foil surface (222) of a PCB assembly (50) upper copper foil surface (220) with which each LED element thermal terminal (19) mounted on the a PCB assembly (50) upper copper foil surface (220) of an LED lamp comes in contact. A copper (Cu) film (250) is formed on the internal diameter, and a gold-plated thermal-conductive chip (300), which has a silver (Ag) core coated with a gold (Au) film, is inserted into the copper film (250) by using a pressurizing press. By inserting a gold-plated thermal-conductive chip (300) between the upper copper foil surface and the lower copper foil surface of the PCB assembly (50) and utilizing the chip as a heat transfer means, high heat generated in the LED element can be rapidly radiated.

Description

{LED LAMP USING GOLD-PLATED THERMAL CONDUCTIVITY CHIP}

The present invention relates to a large-sized LED lighting device using an LED device as a light source, and more particularly, to maximize heat dissipation effect of an LED lighting device by effectively transferring high heat radiated through a thermal terminal of an LED device mounted on the LED lighting device to a heat- And a LED lighting lamp using a gold-plated heat-dissipating chip.

LED street light and security light, which are called meca of modern lighting, are positioned as high efficient lighting.

However, in order to maintain a constant luminous efficiency and life span of an excellent LED light source in terms of life and efficiency, it is a fundamental problem of an LED lighting lamp to effectively dissipate the high heat radiated from the heat terminal of the LED.

An example of a heat dissipating structure for efficiently discharging heat generated from an LED is disclosed in Korean Patent No. 10-0975970 filed by the applicant of the present invention and entitled " Large-sized lamp with power LED "and Korean Patent No. 10-1558889" LED using high- A lighting system and a heat radiation system ".

1 and 2, FIG. 1 shows a process of manufacturing a heat transfer medium 310 of the registered patent No. 10-0975970. As shown in FIG. 1, the FR- (FR-4 PCB) 200 having a copper (Cu) thin layer and a solder pad for fixing a lead frame of the power LED 100 to the upper copper surface of the double- And a plurality of through holes 232a, 232b, and 232c (not shown) are formed on the double-sided board (FR-4 PCB) Through holes 230 are formed in the multi-through holes so as to be in contact with the thermal terminals of the power LEDs through the non-solder cream solder, And discharging the generated high heat to the heat discharging body provided on the lower copper foil face.

 As shown in FIG. 2, the LED assembly is mounted on the upper copper (Cu) foil and the heat sink is mounted on the lower copper (Cu) foil, as shown in FIG. Two via holes 240 are formed so as to penetrate from a top copper (Cu) thin surface to a bottom copper (Cu) foil where LEDs of a double-sided substrate (FR-4 PCB) A heat transfer medium 300 having one side thereof is brought into contact with the heat dissipation point 19 of the LED and another side thereof is brought into contact with the lower surface of the copper foil through the heat transfer medium 300 coated with silver (Ag) Is a heat dissipation system in contact with the coupled heat sink (400) to discharge the high heat generated at the heat radiation point (19) of the LED through the heat sink (400).

However, in the above-mentioned "large lighting lamp having a power LED", it is difficult to manufacture the multi-through hole 230 through the non-pouring cream solder to fix it as a heat transfer medium, There is an inefficiency that the heat transfer resistance is increased due to the reduction of the cross sectional area as a heat transfer medium in the part. In the LED lighting heat dissipation system having the high efficiency heat transfer medium, the cream solder is filled in the via hole 240 penetrated through the PCB substrate, It is difficult to manufacture a heat transfer medium to be coated with a silver film. Therefore, a countermeasure against this problem is in serious demand. Particularly recently, the size of an LED device has been changed from 4.5 x 4.5 to 3.5 x 3.5 due to the compactness of the LED device And the width of the thermal terminal of the LED device is reduced from 1.6 mm to 1.3 mm. Therefore, it is necessary to maximize the thermal conductivity of the heat transfer medium .

That is, it is inevitable to reduce the diameter of the via hole (through hole) corresponding to the thermal terminal (LED element heat dissipation point). Accordingly, since the diameter of the heat transfer medium interposed in the via hole must also be reduced, a compact 3.5 × 3.5 standard The heat transfer medium on the PCB substrate of the LED lighting using the LED element is an environment in which the high heat generated from the LED can be smoothly discharged by using a material having better thermal conductivity than the conventional one.

Therefore, in order to overcome difficulties in manufacturing a conventional heat transfer medium and to improve thermal conductivity, a cream solder of a specific component is interposed in a via hole (through hole), and then a tin chip free of solder or silver coating in a via hole (through hole) (Ag) material having the best thermal conductivity, and a heat dissipation system interposed therebetween by forming a copper (Cu) film on the via-hole coated with the conductive material. (Cu) coated on the surface of the LED, thereby causing a problem in the improvement of the heat conduction efficiency of the heat dissipating system which is discharged from the thermal terminal of the LED element to the heat dissipating member. In order to solve this problem, It is necessary to develop the heat dissipation system.

Registered Patent No. 10-0975970 "Large illuminated lamp with power LED" Registered Patent No. 10-1558889 "LED lighting heat dissipation system using high efficiency heat transfer medium"

Accordingly, it is an object of the present invention to provide a semiconductor device and a method of manufacturing the same, which are capable of effectively dissipating heat generated from an LED device mounted on a double- And to provide a highly efficient heat dissipation system that is free from voids between the heat transfer media and can be easily combined.

In order to achieve the above object, the present invention provides a method of manufacturing an LED lighting device, including a PCB assembly (50), a PCB assembly (50), a PCB assembly (50) on which a thermal terminal (19) A via hole 240 is formed between the copper foil surface 222 of the LED element thermal terminal 19 and the lower copper foil surface 230,

A copper (Cu) film 250 is formed on the inner diameter of the via hole 240,

In the copper film 250, a gold-plated thermally conductive chip 300 coated with a gold (Au) film is mounted on a silver (Ag) core by a pressing press. (Au) film coated on a silver (Ag) core between the lower copper surface of the PCB assembly 50 where the upper copper surface of the PCB assembly 50 and the heat dissipator 400 are coupled, So that the high heat generated in the LED element can be dissipated rapidly.

Further, it is preferable that the thickness of the copper film 250 is 25 to 35 占 퐉, and the diameter of the via hole 240 is 1.3 to 1.6 mm.

The via hole 240 may form a funnel-shaped inclined portion on the lower end side of the PCB assembly 50 to which the heat discharging body 400 is coupled.

 The heat conduction chip 300 preferably has a gold (Au) film 320 of 7 to 12 μm formed on the silver (Ag) core 310 by plating.

The height of the gold-plated heat conduction chip 300 interposed in the via hole formed in the copper film 250 is 0.15 mm to 0.25 mm higher than the thickness of the PCB assembly 50 and the diameter is 0.05 mm By 0.15 mm.

A PCB assembly (50) in which a thermal terminal of an LED element mounted on an upper copper surface of a double-sided board constituting an LED lighting lamp is coupled to a PCB assembly (50) A thermal conductive chip 300 is formed by forming a gold (Au) film having good ductility and good conductivity in a silver (Ag) core having a good thermal conductivity in a via hole formed with a copper (Cu) film penetrating through a PCB assembly 50, The price is increased, but the efficiency and lifetime of the LED lamp can be improved by maximizing the heat transfer rate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a process for manufacturing a heat transfer medium of the prior art; Fig.
2 is a PCB assembly in which a conventional thermal transfer medium is interposed.
3 is a cross-sectional view of a via hole of a PCB according to the present invention, with a gold-plated heat conduction chip interposed therebetween.
4 is a cross-sectional view of the gold-plated heat conduction chip interposed in the via hole of FIG. 3 in a compressed state.
FIG. 5 is a cross-sectional view of a LED chip mounted on a PCB on which a gold-plated heat conductive chip is pressed.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 and 5 are schematic views illustrating a configuration of a lower copper surface 230 on which the upper copper surface 222 of the PCB assembly 50 and the heat sink 400 are coupled, Sectional view illustrating the structure of the heat conduction chip 300 connected to the heat conduction chip 300 according to an embodiment of the present invention.

The LED thermal terminal 19 of the PCB assembly 50 shown in FIG. 5 is connected between the upper copper foil surface 222 of the PCB assembly 50 where the thermal contact terminals 19 are in surface contact with the lower copper foil surface 230 to which the heat discharging body 400 is coupled The heat conduction chip 300 quickly conducts the high heat generated from the LED to the heat sink 400 attached to the lower copper surface 230 of the assembly 50 to effectively dissipate the high heat generated from the LED.

The construction of the thermal conductive chip 300 will be described in detail.

The thermally conductive chip 300 is electrically connected to the LED thermal terminal bonded copper surface 222 of the upper copper surface 220 of the PCB assembly 50 and the copper The heat conductive chip 300 is disposed on a via hole 240 formed with a copper (Cu) film 250 and transmits heat generated from the LED to the heat sink 400. The heat conductive chip 300 is made of gold (Au) (Au) film may be formed by a method in which a thin gold (Au) thin film is surrounded by a core of silver (Ag) material and pressed, but it is preferably formed by electroplating .

The copper film 250 formed in the via hole 240 is electrically connected to the LED thermal terminal bonding copper surface 222 and the lower side copper surface 230 of the upper copper surface 220 of the PCB assembly 50 by the heat conductive means, And the heat accumulated between the upper side and the globe 50 is conducted to the heat radiator coupled to the lower copper surface 230 of the PCB assembly 50.

The thermal conductive chip 300 interposed in the space of the copper film 250 is electrically connected to the thermal terminal 19 of the LED element and the heat sink 400 coupled to the lower copper surface 230 of the PCB assembly 50 And functions as a passageway for conducting the high heat generated in the LED element to the heat sink 400 by being connected.

The structure of the thermal conductive chip 300 will be described in detail.

The heat conducting chip 300 corresponds to the heat transfer medium 300 interposed in the via hole 240 of the applicant's patent registration No. 10-1558889 of the present applicant,

The heat transfer medium 300 of Patent Registration No. 10-1558889 includes two via holes each having a diameter of 0.8 mm in the PCB assembly 50 to form a heat transfer medium 300 between the upper copper surface and the lower copper surface of the PCB assembly, And the cream solder formed by mixing the tin (Sn) and silver (Ag) into the via hole plated with the copper film on the via hole and heating the tin (Sn) The heat transfer medium 300 is formed.

Two via holes of 0.8 mm in diameter are formed in the PCB assembly 50 to form a heat transfer medium 300 between the upper copper surface and the lower copper foil surface of the PCB assembly 50 where the heat radiation points of the LEDs are in contact with the heat transfer medium 300 The reason for the formation of the via hole is to form a via hole having a diameter of 1.6 mm because the thermal terminal standard of the 4.5 × 4.5 LED device is 1.6 mm. However, when the diameter of the via hole exceeds 0.8 mm, (Gravity) of the via hole because it can not stay in the via hole.

In order to provide a space for attaching the thermally conductive chip 300 interposed between the upper copper surface of the PCB assembly 50 where the thermal terminal 19 of the LED element of the present invention is in contact and the lower copper surface of the heat sink 400, First, a via hole 240 is formed,

It is preferable that the via hole is larger than the diameter of a via hole (two formed by limiting the diameter to 0.8 mm) of the prior art Patent No. 10-1558889, but it is preferable that the via hole is formed to have a diameter of 1.3 mm. ) Is applied is 3.5 x 3.5 standard LED element having a thermal terminal width of 1.3 mm.

The copper film 250 is formed on the via hole 240 by Cu plating and the copper film 250 is electrically connected to the thermal terminal 19 of the LED element of the upper copper surface 220 of the PCB assembly 50, And the lower copper foil surface 230 to which the heat sink 220 and the heat discharging body 400 are coupled.

An effective heat transfer system between the thermal terminal 19 of the LED element in contact with the upper copper surface 222 of the PCB assembly 50 and the heat sink 400 coupled to the lower copper surface 230 of the PCB assembly 50 It is preferable that the thermally conductive chip 300 interposed in the space of the copper film 250 of the via hole 240 is formed in a column shape and made of silver having good thermal conductivity.

In addition, it is preferable that the thermal conductive chip 300 interposed in the space of the copper film 250 of the via hole 240 and the copper film 250 be in contact with each other without a gap.

The thermal conductive chip 300 interposed in the space between the copper film 250 and the copper film 250 has a good thermal conductivity and is provided on the inner surface of the copper conductive film 250 so as to be inserted into the copper film 250 without a gap The core is formed of silver (Ag), and the circumferential surface of the thermally conductive chip 300, which is an area of the copper film 250, is formed of a gold (Au) film having good ductility and good electrical properties.

In this case, a method of forming a gold (Au) film on the silver (Ag) core is a method of forming an electroplated or gold (Au) thin plate by coating it on a silver (Ag) core.

It is an important technology to fill the space of the copper film 250 of the via hole 240 without a gap and the thermal conductive chip 300 having the Au film formed thereon is inserted into the via hole The diameter of the thermally conductive chip 300 in which the gold (Au) film is formed may be smaller than the diameter of the copper layer 250 in the via hole 240, The height of the heat conductive chip 300 formed with the Au film is naturally inserted into the space of the copper film 250 of the via hole 240 after the height of the gold conductive film is formed longer than the thickness of the PCB assembly 50 Au is formed on the outer surface of the thermally conductive chip 300 by pressing the thermally conductive chip 300 having the Au film on the upper and lower ends of the PCB assembly 50. As a result, When the thermally conductive chip 300 having the film is completely filled in the copper film 250 of the via hole 240 without a gap All.

The diameter of the via hole 240 is 1.3 to 1.6 mm for the multi-use, but the dimensions of the compacted LED element are 1.3 mm for the thermal terminal 19, so that the diameter of the via hole 240 is also 1.3 mm And the copper film 250 to be plated on the inner diameter of the via hole 240 is preferably 25 to 35 mu m, and preferably 30 mu m.

In this case, it is preferable that the diameter of the thermally conductive chip 300 in which the gold (Au) film is formed is smaller than the diameter of the via hole 240, preferably 1.15 to 1.25 mm, preferably 0.05 to 0.15 mm, but 1.2 mm More preferably, the height of the thermally conductive chip 300 on which the gold (Au) film is formed is higher than the thickness of the PCB assembly 50 of 1.6 mm, preferably 1.75 to 1.85 mm, preferably 0.15 to 0.25 mm, More preferably 1.8 mm.

On the other hand, since it is difficult to quickly insert the gold (Au) film thermally conductive chip 300 having a diameter 0.1 mm smaller than the diameter of the via hole 240 into the copper-plated via hole 240, It is preferable to form an inclined portion 241 having a funnel shape and the position of the inclined portion is formed on both sides of the via hole 240 on the side of the copper foil on the lower side of the PCB assembly.

This is because if the inclined portion is formed on the upper copper foil surface of the PCB assembly, the reader terminals 12 and 15 formed on both sides of the thermal terminal 19 of the LED element contacting the upper copper foil surface are connected to electrically short-circuit.

The fabrication cost of the thermally conductive chip 300 having the gold (Au) film formed on the silver (Ag) core is about 800,000 won for 30,000 high-price fabs (Ag chips) compared to the thermal conductive chips 300 made of silver The reason why gold (Au) film is formed on the silver (Ag) core despite the fact that the gold (Au) film is 300,000 won for 30,000 chips) (Ag) chip can be filled in the copper film 250 of the via hole 240 without a gap due to physical properties of the Au film.

That is, a thermally conductive chip 300 having a gold (Au) film formed on a silver (Ag) core is inserted into the copper film 250 of the via hole 240 to form a gold (Au) film on the outer surface of the thermally conductive chip 300 The thermally conductive chip 300 having the gold (Au) film formed by the good ductility and good physical properties is physically and completely bonded to the copper film 250 without a gap. As a result, the gold (Au) The thermal conductivity chip 300 formed with the gold (Au) film to be pressed and interposed in the copper film 250 of the via hole 240 has a lower thermal conductivity than the entirety of silver (Ag) A heat transfer system is formed by compressing and filling a thermally conductive chip 300 formed with a gold (Au) film into the copper film 250 of the via hole 240, though it is expensive.

Hereinafter, a process of forming a heat transfer system on the PCB assembly 50 will be described.

 The via hole 240 is formed between the copper foil surface 222 bonded to the LED thermal terminal 19 of the upper copper foil surface 220 of the PCB assembly 50 and the lower copper foil surface 230 to which the heat discharging body 400 is bonded to a press punching machine .

The cross-sectional shape of the via hole 240 is preferably circular, and it is preferable that the via hole 240 has a circular shape in terms of ease of operation when the thermally conductive chip 300 is interposed in the via hole.

The penetrating via hole 240 forms a copper film 250 by copper plating on the inside diameter.

A thermally conductive chip 300 in which a gold film to be interposed is formed in the copper film 250 of the via hole 240 is formed by plating a silver (Ag) core with electroplating or gold (Au) And is preferably electroplated.

The thickness of the gold (Au) film is preferably 7 to 12 탆, more preferably 10 탆. As the thickness of the gold (Au) film becomes thicker, the thermally conductive chip 300 formed with the gold film tends to be filled in the via-hole copper film without a gap. On the other hand, the economical efficiency is lowered. This is because a thickness of 10 mu m is sufficient.

A method of interposing a thermally conductive chip 300 having a gold (Au) film in the inner space of the copper film of the via hole 240 is as follows.

The thermally conductive chip 300 having the gold (Au) film formed by electroplating is inserted into the via hole 240 formed with the copper film 250 by an automatic machine. Preferably, as shown in FIG. 3, The thermally conductive chip 300 having a diameter smaller than the diameter of the via hole formed in the copper film 250 and having a gold (Au) film higher than the thickness of the PCB assembly 50 in a state where the lower copper- .

4, a thermally conductive chip 300 having a gold (Au) film inserted in a space inside the copper film 250 of the via hole 240 is pressed at the top and bottom of the PCB assembly to form a gold So that the thermally conductive chip 300 is closely packed in the copper film 250 of the via hole 240 without a gap.

As shown in FIG. 5, an LED element or the like is mounted on the PCB assembly 50 to which the gold-plated thermally conductive chip 300 is pressed, thereby forming an illumination lamp circuit.

The LED lighting lamp manufacturing process using the gold-plated heat conduction chip of the present invention,

The PCB assembly 50 of the LED lighting or the like and the LED thermal terminals 19 mounted on the upper copper surface 220 of the PCB assembly 50 are in contact with the thermal terminal 19 of the LED element of the upper copper- A via hole 240 is formed between the lower copper foil surface 222 and the lower copper foil surface 230,

The copper film 250 is formed by copper plating between the LED thermal terminal bonding copper surface 222 and the lower copper foil surface 230 of the copper foil surface 220 of the PCB assembly 50 of the via hole 240 In addition,

A thermally conductive chip 300 having a silver (Au) film formed on a silver (Ag) core by inserting a thermally conductive chip 300 having a gold (Au) And serves as a heat transfer path between the upper / lower copper foil surfaces of the assembly 50.

It is preferable that the diameter of the via hole 240 is 1.3 mm and the copper film 250 is 25 to 35 μm thick by copper plating.

The gold-plated thermally conductive chip 300 preferably has a smaller diameter than the inner diameter of the copper layer 250 and a height higher than that of the double-sided board. The gold-plated thermally conductive chip 300 is easily inserted into the via- It is preferable to form a funnel-shaped slope part 241 on the lower end side of the PCB assembly 50 to which the heat sink 400 is coupled.

The gold-plated thermally conductive chip 300 preferably has a gold (Au) film formed by plating on a silver (Ag) core by a thickness of 7 to 12 μm. The height of the gold-plated thermally conductive chip 300 is 0.15 mm And the diameter of the gold-plated heat conduction chip 300 is preferably smaller than the diameter of the via hole formed with the copper film 250 by 0.05 mm to 0.15 mm.

A method of interposing the gold-plated thermally conductive chip 300 in the via hole formed with the copper film 250 is a method of inserting the gold-plated thermally conductive chip 300 through the inclined portion with the lower end of the PCB assembly 50 to which the heat- It is preferable to press the thermally conductive chip 300 with a press.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the scope of claims and equivalents thereof.

(50) --- PCB assembly (200) --- Double-sided board
(210) --- intermediate layer (220) of FR-4 material --- upper copper foil surface
(221) --- Lead frame bonding of LED element Copperface
(222) --- Thermal terminal bonding copper surface of LED element
(230) --- Lower copper foil surface (240) --- Via hole
(250) --- copper film (300) --- gold-plated heat conduction chip
(Au) layer 320 - Ag (Ag) core
(400) --- heat sink

Claims (9)

In a LED lighting lamp which radiates heat using a gold-plated heat conduction chip,
A PCB assembly 50 of LED lighting or the like and a thermal terminal 19 of each LED element mounted on the upper copper surface 220 of the PCB assembly 50 are connected to the LED element thermal terminal 19 of the upper copper- A via hole 240 is formed between the surface 222 and the lower copper foil surface 230. The via hole 240 is formed with a funnel-shaped inclined portion on the lower end side of the PCB assembly 50 to which the heat discharging body 400 is coupled,
A copper (Cu) film 250 is formed on the inner diameter of the via hole 240,
In the copper film 250, a gold-plated thermally conductive chip 300 coated with a gold (Au) film is inserted into a silver (Ag)
The gold plating thermal conductive chip 300 in the copper film 250 is formed by bonding the gold-plated thermally conductive chip 300 having a diameter smaller than the diameter of the via hole formed with the copper film 250 and having a height larger than the thickness of the PCB assembly 50, And then the gold-plated thermally conductive chip 300 is pressed and formed on the upper and lower ends of the PCB assembly 50 to form the LED lighting lamp using the gold-plated thermally conductive chip.
The method according to claim 1,
And the thickness of the copper film 250 is 25 to 35 占 퐉.
delete The method according to claim 1,
And the diameter of the via hole 240 is 1.3 mm to 1.6 mm.
delete delete The method according to claim 1,
The thickness of the gold (Au) film 320 of the gold-plated heat conduction chip 300 is 7 to 12 占 퐉.
The method according to claim 1,
The height of the gold-plated thermally conductive chip 300 inserted into the via hole formed with the copper film 250 is 0.15 mm to 0.25 mm higher than the thickness of the PCB assembly 50.
The method according to claim 1,
Wherein the diameter of the gold-plated thermally conductive chip 300 inserted into the via hole formed with the copper film 250 is smaller than the diameter of the via hole formed with the copper film 250 by 0.05 mm to 0.15 mm.
KR1020150165180A 2015-11-25 2015-11-25 Led lamp using gold-plated thermal conductivity chip KR101629757B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020150165180A KR101629757B1 (en) 2015-11-25 2015-11-25 Led lamp using gold-plated thermal conductivity chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150165180A KR101629757B1 (en) 2015-11-25 2015-11-25 Led lamp using gold-plated thermal conductivity chip

Publications (1)

Publication Number Publication Date
KR101629757B1 true KR101629757B1 (en) 2016-06-13

Family

ID=56191441

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020150165180A KR101629757B1 (en) 2015-11-25 2015-11-25 Led lamp using gold-plated thermal conductivity chip

Country Status (1)

Country Link
KR (1) KR101629757B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101963738B1 (en) * 2017-11-16 2019-03-29 (주)제이엔텍 Led lighting apparatus
KR20200064373A (en) 2018-11-29 2020-06-08 주식회사 씨에이피코리아 LED security light with improved heat dissipation function

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050045558A (en) * 2003-11-12 2005-05-17 주식회사 에이팩 A heatsink and its manufaturing method
KR100975970B1 (en) 2009-11-27 2010-08-13 주식회사 테크엔 The large illuminations with power led
KR20140095751A (en) * 2013-01-25 2014-08-04 정연보 Metal printed circuit board, assembly substrate for light emitting diode, assembly body for light emitting diode using the same
JP5569210B2 (en) * 2010-07-21 2014-08-13 住友ベークライト株式会社 Light source device
KR101558889B1 (en) 2015-06-10 2015-10-13 주식회사 테크엔 Led lamp a radiation systems using a high-efficiency thermal conductivity chip
KR101570053B1 (en) * 2015-07-28 2015-11-19 주식회사 테크엔 Led street light with variable color temperature according to weather changes

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050045558A (en) * 2003-11-12 2005-05-17 주식회사 에이팩 A heatsink and its manufaturing method
KR100975970B1 (en) 2009-11-27 2010-08-13 주식회사 테크엔 The large illuminations with power led
JP5569210B2 (en) * 2010-07-21 2014-08-13 住友ベークライト株式会社 Light source device
KR20140095751A (en) * 2013-01-25 2014-08-04 정연보 Metal printed circuit board, assembly substrate for light emitting diode, assembly body for light emitting diode using the same
KR101558889B1 (en) 2015-06-10 2015-10-13 주식회사 테크엔 Led lamp a radiation systems using a high-efficiency thermal conductivity chip
KR101570053B1 (en) * 2015-07-28 2015-11-19 주식회사 테크엔 Led street light with variable color temperature according to weather changes

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101963738B1 (en) * 2017-11-16 2019-03-29 (주)제이엔텍 Led lighting apparatus
KR20200064373A (en) 2018-11-29 2020-06-08 주식회사 씨에이피코리아 LED security light with improved heat dissipation function

Similar Documents

Publication Publication Date Title
US8163603B2 (en) Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
US8062912B2 (en) Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing
US7948076B2 (en) Semiconductor chip assembly with post/base heat spreader and vertical signal routing
US8525214B2 (en) Semiconductor chip assembly with post/base heat spreader with thermal via
US8279607B2 (en) Cooling module assembly method
US9018667B2 (en) Semiconductor chip assembly with post/base heat spreader and dual adhesives
KR20190018812A (en) Semiconductor package and electronic device having the same
US20100190297A1 (en) Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post
US8148747B2 (en) Semiconductor chip assembly with post/base/cap heat spreader
KR101629757B1 (en) Led lamp using gold-plated thermal conductivity chip
EP3268995B1 (en) Light emitting device cooling
US6671176B1 (en) Method of cooling heat-generating electrical components
KR101558889B1 (en) Led lamp a radiation systems using a high-efficiency thermal conductivity chip
US8110446B2 (en) Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
JP2011096830A (en) Semiconductor device
KR101629762B1 (en) Led lamp manufacturing method using gold-plated thermal conductivity chip
KR100616413B1 (en) Light emitting diode and method of manufacturing the same
US20100052005A1 (en) Semiconductor chip assembly with post/base heat spreader and conductive trace
KR101558894B1 (en) Led lamp manufacturing method using a high-efficiency thermal conductivity chip
CN109524374B (en) LED light-emitting module
US20050284607A1 (en) Cooling-assisted, heat-generating electrical component and method of manufacturing same

Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20190605

Year of fee payment: 4