KR101629762B1 - Led lamp manufacturing method using gold-plated thermal conductivity chip - Google Patents

Led lamp manufacturing method using gold-plated thermal conductivity chip Download PDF

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Publication number
KR101629762B1
KR101629762B1 KR1020150165181A KR20150165181A KR101629762B1 KR 101629762 B1 KR101629762 B1 KR 101629762B1 KR 1020150165181 A KR1020150165181 A KR 1020150165181A KR 20150165181 A KR20150165181 A KR 20150165181A KR 101629762 B1 KR101629762 B1 KR 101629762B1
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South Korea
Prior art keywords
gold
copper
via hole
film
pcb assembly
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KR1020150165181A
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Korean (ko)
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이영섭
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영남엘이디 주식회사
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
    • F21S2/005—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction of modular construction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • F21Y2101/02—

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to an LED element thermal terminal junction copper foil of a PCB assembly (50) on an upper copper foil surface (220) to which a thermal terminal (19) of each LED element mounted on a copper foil surface (220) A first step of forming a via hole 240 between the surface 222 and the lower copper foil surface 230,
A second step of forming the copper film 250 by copper plating on the inner diameter of the via hole 240,
And a third step of inserting a gold-plated thermally conductive chip 300 coated with a gold (Au) film on the copper (Ag) core in the copper film 250. In this method, The gold-plated thermally conductive chip 300 is inserted between the upper copper foil surface and the lower copper foil surface to serve as heat transfer means, thereby rapidly dissipating heat generated from the LED element.

Description

TECHNICAL FIELD [0001] The present invention relates to a LED lamp manufacturing method using a gold-plated heat conduction chip,

The present invention relates to a large-sized LED lighting device using an LED device as a light source, and more particularly, to maximize heat dissipation effect of an LED lighting device by effectively transferring high heat radiated through a thermal terminal of an LED device mounted on the LED lighting device to a heat- The present invention relates to a method of manufacturing an LED lighting lamp using a gold-plated heat-dissipating chip.

LED street light and security light, which are called meca of modern lighting, are positioned as high efficient lighting.

However, in order to maintain a constant luminous efficiency and life span of an excellent LED light source in terms of life and efficiency, it is a fundamental problem of an LED lighting lamp to effectively dissipate the high heat radiated from the heat terminal of the LED.

An example of a heat dissipating structure for efficiently discharging heat generated from an LED is disclosed in Korean Patent No. 10-0975970 filed by the applicant of the present invention and entitled " Large-sized lamp with power LED "and Korean Patent No. 10-1558889" LED using high- A lighting system and a heat radiation system ".

1 and 2, FIG. 1 shows a process of manufacturing a heat transfer medium 310 of the registered patent No. 10-0975970. As shown in FIG. 1, the FR- (FR-4 PCB) 200 having a copper (Cu) thin layer and a solder pad for fixing a lead frame of the power LED 100 to the upper copper surface of the double- And a plurality of through holes 232a, 232b, and 232c (not shown) are formed on the double-sided board (FR-4 PCB) Through holes 230 are formed in the multi-through holes so as to be in contact with the thermal terminals of the power LEDs through the non-solder cream solder, And discharging the generated high heat to the heat discharging body provided on the lower copper foil face.

 As shown in FIG. 2, the LED assembly is mounted on the upper copper (Cu) foil and the heat sink is mounted on the lower copper (Cu) foil, as shown in FIG. Two via holes 240 are formed so as to penetrate from a top copper (Cu) thin surface to a bottom copper (Cu) foil where LEDs of a double-sided substrate (FR-4 PCB) A heat transfer medium 300 having one side thereof is brought into contact with the heat dissipation point 19 of the LED and another side thereof is brought into contact with the lower surface of the copper foil through the heat transfer medium 300 coated with silver (Ag) Is a heat dissipation system in contact with the coupled heat sink (400) to discharge the high heat generated at the heat radiation point (19) of the LED through the heat sink (400).

However, in the above-mentioned "large lighting lamp having a power LED", it is difficult to manufacture the multi-through hole 230 through the non-pouring cream solder to fix it as a heat transfer medium, There is an inefficiency that the heat transfer resistance is increased due to the reduction of the cross sectional area as a heat transfer medium in the part. In the LED lighting heat dissipation system having the high efficiency heat transfer medium, the cream solder is filled in the via hole 240 penetrated through the PCB substrate, It is difficult to manufacture a heat transfer medium to be coated with a silver film. Therefore, a countermeasure against this problem is in serious demand. Particularly recently, the size of an LED device has been changed from 4.5 x 4.5 to 3.5 x 3.5 due to the compactness of the LED device And the width of the thermal terminal of the LED device is reduced from 1.6 mm to 1.3 mm. Therefore, it is necessary to maximize the thermal conductivity of the heat transfer medium .

That is, it is inevitable to reduce the diameter of the via hole (through hole) corresponding to the thermal terminal (LED element heat dissipation point). Accordingly, since the diameter of the heat transfer medium interposed in the via hole must also be reduced, a compact 3.5 × 3.5 standard The heat transfer medium on the PCB substrate of the LED lighting using the LED element is an environment in which the high heat generated from the LED can be smoothly discharged by using a material having better thermal conductivity than the conventional one.

Therefore, in order to overcome difficulties in manufacturing a conventional heat transfer medium and to improve thermal conductivity, a cream solder of a specific component is interposed in a via hole (through hole), and then a tin chip free of solder or silver coating in a via hole (through hole) (Ag) material having the best thermal conductivity, and a heat dissipation system interposed therebetween by forming a copper (Cu) film on the via-hole coated with the conductive material. (Cu) coated on the surface of the LED, thereby causing a problem in the improvement of the heat conduction efficiency of the heat dissipating system which is discharged from the thermal terminal of the LED element to the heat dissipating member. In order to solve this problem, It is necessary to develop the heat dissipation system.

Registered Patent No. 10-0975970 "Large illuminated lamp with power LED" Registered Patent No. 10-1558889 "LED lighting heat dissipation system using high efficiency heat transfer medium"

Accordingly, it is an object of the present invention to provide a semiconductor device and a method of manufacturing the same, which are capable of effectively dissipating heat generated from an LED device mounted on a double- And to provide a highly efficient heat dissipation system that is free from voids between the heat transfer media and can be easily combined.

In order to achieve the above object, the present invention provides a method of manufacturing an LED lighting device, including a PCB assembly (50), a PCB assembly (50), a PCB assembly (50) on which a thermal terminal (19) A first step of forming a via hole 240 between the LED element thermal terminal bonding copper surface 222 and the lower copper foil surface 230 of the LED element,

A second step of forming the copper film 250 by copper plating on the inner diameter of the via hole 240,

And a third step of inserting a thermally conductive chip (300) coated with a gold (Au) film on a silver (Ag) core in the copper film (250) (Au) film coated on a silver (Ag) core between the lower copper surface of the PCB assembly 50 where the upper copper surface of the PCB assembly 50 and the heat dissipator 400 are coupled, So that the high heat generated in the LED element can be dissipated rapidly.

A method of inserting a gold (Au) coated thermally conductive chip 300 into the silver (Ag) core of the third step is to have a diameter smaller than the diameter of the via hole formed with the copper film 250 and higher than the thickness of the PCB assembly 50 A third step of interposing the large thermal conductive chip 300 in the via hole formed in the copper film 250 and a third step of inserting the thermal conductive chip 300 protruding into the via hole into the third- 2 < / RTI >

Also, in the first step, the thickness of the copper film 250 is preferably 25 to 35 占 퐉, and the diameter of the via hole 240 is preferably 1.3 to 1.6 mm.

The via hole 240 formed in the first step may form a funnel-shaped inclined portion on the lower end side of the PCB assembly 50 to which the heat discharging body 400 is coupled.

 It is preferable that the gold (Au) film 320 is formed on the silver (Ag) core 310 by plating and the thickness of the gold (Au) film is made 7 to 12 μm Do.

The height of the thermally conductive chip 300 in the third stage is preferably 0.15 mm to 0.25 mm higher than the thickness of the PCB assembly 50 and the diameter is preferably 0.05 mm to 0.15 mm smaller than the diameter of the via hole formed with the copper film 250 Do.

The method of interposing the thermally conductive chip 300 in the via hole formed with the copper film 250 of the third stage is to insert the PCB assembly 50 with the lower end of the PCB assembly 50 to which the heat sink is coupled upward, It is preferable that the thermally conductive chip 300 protruded in the via hole is pressed by a press.

A PCB assembly (50) in which a thermal terminal of an LED element mounted on an upper copper surface of a double-sided board constituting an LED lighting lamp is coupled to a PCB assembly (50) A thermal conductive chip 300 is formed by forming a gold (Au) film having good ductility and good conductivity in a silver (Ag) core having a good thermal conductivity in a via hole formed with a copper (Cu) film penetrating through a PCB assembly 50, The price is increased, but the efficiency and lifetime of the LED lamp can be improved by maximizing the heat transfer rate.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a process for manufacturing a heat transfer medium of the prior art; Fig.
2 is a PCB assembly in which a conventional thermal transfer medium is interposed.
3 is a cross-sectional view of a via hole of a PCB according to the present invention, with a gold-plated heat conduction chip interposed therebetween.
4 is a cross-sectional view of the gold-plated heat conduction chip interposed in the via hole of FIG. 3 in a compressed state.
FIG. 5 is a cross-sectional view of a LED chip mounted on a PCB on which a gold-plated heat conductive chip is pressed.
6 is a flow chart of a method of manufacturing an LED lighting lamp using a gold-plated thermally conductive chip according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

4 and 5 are schematic views illustrating a configuration of a lower copper surface 230 on which the upper copper surface 222 of the PCB assembly 50 and the heat sink 400 are coupled, Sectional view illustrating the structure of the heat conduction chip 300 connected to the heat conduction chip 300 according to an embodiment of the present invention.

The LED thermal terminal 19 of the PCB assembly 50 shown in FIG. 5 is connected between the upper copper foil surface 222 of the PCB assembly 50 where the thermal contact terminals 19 are in surface contact with the lower copper foil surface 230 to which the heat discharging body 400 is coupled The heat conduction chip 300 quickly conducts the high heat generated from the LED to the heat sink 400 attached to the lower copper surface 230 of the assembly 50 to effectively dissipate the high heat generated from the LED.

The construction of the thermal conductive chip 300 will be described in detail.

The thermally conductive chip 300 is electrically connected to the LED thermal terminal bonded copper surface 222 of the upper copper surface 220 of the PCB assembly 50 and the copper The heat conductive chip 300 is disposed on a via hole 240 formed with a copper (Cu) film 250 and transmits heat generated from the LED to the heat sink 400. The heat conductive chip 300 is made of gold (Au) (Au) film may be formed by a method in which a thin gold (Au) thin film is surrounded by a core of silver (Ag) material and pressed, but it is preferably formed by electroplating .

The copper film 250 formed in the via hole 240 is electrically connected to the LED thermal terminal bonding copper surface 222 and the lower side copper surface 230 of the upper copper surface 220 of the PCB assembly 50 by the heat conductive means, And the heat accumulated between the upper side and the globe 50 is conducted to the heat radiator coupled to the lower copper surface 230 of the PCB assembly 50.

The thermal conductive chip 300 interposed in the space of the copper film 250 is electrically connected to the thermal terminal 19 of the LED element and the heat sink 400 coupled to the lower copper surface 230 of the PCB assembly 50 And functions as a passageway for conducting the high heat generated in the LED element to the heat sink 400 by being connected.

The structure of the thermal conductive chip 300 will be described in detail.

The heat conducting chip 300 corresponds to the heat transfer medium 300 interposed in the via hole 240 of the applicant's patent registration No. 10-1558889 of the present applicant,

The heat transfer medium 300 of Patent Registration No. 10-1558889 includes two via holes each having a diameter of 0.8 mm in the PCB assembly 50 to form a heat transfer medium 300 between the upper copper surface and the lower copper surface of the PCB assembly, And the cream solder formed by mixing the tin (Sn) and silver (Ag) into the via hole plated with the copper film on the via hole and heating the tin (Sn) The heat transfer medium 300 is formed.

Two via holes of 0.8 mm in diameter are formed in the PCB assembly 50 to form a heat transfer medium 300 between the upper copper surface and the lower copper foil surface of the PCB assembly 50 where the heat radiation points of the LEDs are in contact with the heat transfer medium 300 The reason for the formation of the via hole is to form a via hole having a diameter of 1.6 mm because the thermal terminal standard of the 4.5 × 4.5 LED device is 1.6 mm. However, when the diameter of the via hole exceeds 0.8 mm, (Gravity) of the via hole because it can not stay in the via hole.

In order to provide a space for attaching the thermally conductive chip 300 interposed between the upper copper surface of the PCB assembly 50 where the thermal terminal 19 of the LED element of the present invention is in contact and the lower copper surface of the heat sink 400, First, a via hole 240 is formed,

It is preferable that the via hole is larger than the diameter of a via hole (two formed by limiting the diameter to 0.8 mm) of the prior art Patent No. 10-1558889, but it is preferable that the via hole is formed to have a diameter of 1.3 mm. ) Is applied is 3.5 x 3.5 standard LED element having a thermal terminal width of 1.3 mm.

The copper film 250 is formed on the via hole 240 by Cu plating and the copper film 250 is electrically connected to the thermal terminal 19 of the LED element of the upper copper surface 220 of the PCB assembly 50, And the lower copper foil surface 230 to which the heat sink 220 and the heat discharging body 400 are coupled.

An effective heat transfer system between the thermal terminal 19 of the LED element in contact with the upper copper surface 222 of the PCB assembly 50 and the heat sink 400 coupled to the lower copper surface 230 of the PCB assembly 50 It is preferable that the thermally conductive chip 300 interposed in the space of the copper film 250 of the via hole 240 is formed in a column shape and made of silver having good thermal conductivity.

In addition, it is preferable that the thermal conductive chip 300 interposed in the space of the copper film 250 of the via hole 240 and the copper film 250 be in contact with each other without a gap.

The thermal conductive chip 300 interposed in the space between the copper film 250 and the copper film 250 has a good thermal conductivity and is provided on the inner surface of the copper conductive film 250 so as to be inserted into the copper film 250 without a gap The core is formed of silver (Ag), and the circumferential surface of the thermally conductive chip 300, which is an area of the copper film 250, is formed of a gold (Au) film having good ductility and good electrical properties.

In this case, a method of forming a gold (Au) film on the silver (Ag) core is a method of forming an electroplated or gold (Au) thin plate by coating it on a silver (Ag) core.

It is an important technology to fill the space of the copper film 250 of the via hole 240 without a gap and the thermal conductive chip 300 having the Au film formed thereon is inserted into the via hole The diameter of the thermally conductive chip 300 in which the gold (Au) film is formed may be smaller than the diameter of the copper layer 250 in the via hole 240, The height of the heat conductive chip 300 formed with the Au film is naturally inserted into the space of the copper film 250 of the via hole 240 after the height of the gold conductive film is formed longer than the thickness of the PCB assembly 50 Au is formed on the outer surface of the thermally conductive chip 300 by pressing the thermally conductive chip 300 having the Au film on the upper and lower ends of the PCB assembly 50. As a result, When the thermally conductive chip 300 having the film is completely filled in the copper film 250 of the via hole 240 without a gap All.

The diameter of the via hole 240 is 1.3 to 1.6 mm for the multi-use, but the dimensions of the compacted LED element are 1.3 mm for the thermal terminal 19, so that the diameter of the via hole 240 is also 1.3 mm And the copper film 250 to be plated on the inner diameter of the via hole 240 is preferably 25 to 35 mu m, and preferably 30 mu m.

In this case, it is preferable that the diameter of the thermally conductive chip 300 in which the gold (Au) film is formed is smaller than the diameter of the via hole 240, preferably 1.15 to 1.25 mm, preferably 0.05 to 0.15 mm, but 1.2 mm More preferably, the height of the thermally conductive chip 300 on which the gold (Au) film is formed is higher than the thickness of the PCB assembly 50 of 1.6 mm, preferably 1.75 to 1.85 mm, preferably 0.15 to 0.25 mm, More preferably 1.8 mm.

On the other hand, since it is difficult to quickly insert the gold (Au) film thermally conductive chip 300 having a diameter 0.1 mm smaller than the diameter of the via hole 240 into the copper-plated via hole 240, It is preferable to form an inclined portion 241 having a funnel shape and the position of the inclined portion is formed on both sides of the via hole 240 on the side of the copper foil on the lower side of the PCB assembly.

This is because if the inclined portion is formed on the upper copper foil surface of the PCB assembly, the reader terminals 12 and 15 formed on both sides of the thermal terminal 19 of the LED element contacting the upper copper foil surface are connected to electrically short-circuit.

The fabrication cost of the thermally conductive chip 300 having the gold (Au) film formed on the silver (Ag) core is about 800,000 won for 30,000 high-price fabs (Ag chips) compared to the thermal conductive chips 300 made of silver The reason why gold (Au) film is formed on the silver (Ag) core despite the fact that the gold (Au) film is 300,000 won for 30,000 chips) (Ag) chip can be filled in the copper film 250 of the via hole 240 without a gap due to physical properties of the Au film.

That is, a thermally conductive chip 300 having a gold (Au) film formed on a silver (Ag) core is inserted into the copper film 250 of the via hole 240 to form a gold (Au) film on the outer surface of the thermally conductive chip 300 The thermally conductive chip 300 having the gold (Au) film formed by the good ductility and good physical properties is physically and completely bonded to the copper film 250 without a gap. As a result, the gold (Au) The thermal conductivity chip 300 formed with the gold (Au) film to be pressed and interposed in the copper film 250 of the via hole 240 has a lower thermal conductivity than the entirety of silver (Ag) A heat transfer system is formed by compressing and filling a thermally conductive chip 300 formed with a gold (Au) film into the copper film 250 of the via hole 240, though it is expensive.

Hereinafter, a process of forming a heat transfer system on the PCB assembly 50 will be described.

 The via hole 240 is formed between the copper foil surface 222 bonded to the LED thermal terminal 19 of the upper copper foil surface 220 of the PCB assembly 50 and the lower copper foil surface 230 to which the heat discharging body 400 is bonded to a press punching machine .

The cross-sectional shape of the via hole 240 is preferably circular, and it is preferable that the via hole 240 has a circular shape in terms of ease of operation when the thermally conductive chip 300 is interposed in the via hole.

The penetrating via hole 240 forms a copper film 250 by copper plating on the inside diameter.

A thermally conductive chip 300 in which a gold film to be interposed is formed in the copper film 250 of the via hole 240 is formed by plating a silver (Ag) core with electroplating or gold (Au) And is preferably electroplated.

The thickness of the gold (Au) film is preferably 7 to 12 탆, more preferably 10 탆. As the thickness of the gold (Au) film becomes thicker, the thermally conductive chip 300 formed with the gold film tends to be filled in the via-hole copper film without a gap. On the other hand, the economical efficiency is lowered. This is because a thickness of 10 mu m is sufficient.

A method of interposing a thermally conductive chip 300 having a gold (Au) film in the inner space of the copper film of the via hole 240 is as follows.

The thermally conductive chip 300 having the gold (Au) film formed by electroplating is inserted into the via hole 240 formed with the copper film 250 by an automatic machine. Preferably, as shown in FIG. 3, The thermally conductive chip 300 having a diameter smaller than the diameter of the via hole formed in the copper film 250 and having a gold (Au) film higher than the thickness of the PCB assembly 50 in a state where the lower copper- .

4, a thermally conductive chip 300 having a gold (Au) film inserted in a space inside the copper film 250 of the via hole 240 is pressed at the top and bottom of the PCB assembly to form a gold So that the thermally conductive chip 300 is closely packed in the copper film 250 of the via hole 240 without a gap.

As shown in FIG. 5, an LED element or the like is mounted on the PCB assembly 50 to which the gold-plated thermally conductive chip 300 is pressed, thereby forming an illumination lamp circuit.

6 shows a flow chart illustrating a method of manufacturing an LED lighting lamp using a thermally conductive chip.

Referring to FIG. 6, in the LED lighting lamp manufacturing method using the gold-plated heat conductive chip 300,

The PCB assembly 50 of the LED lighting or the like and the LED thermal terminals 19 mounted on the upper copper surface 220 of the PCB assembly 50 are in contact with the thermal terminal 19 of the LED element of the upper copper- A first step of forming a via hole 240 between the lower copper foil surface 222 and the lower copper foil surface 230,

The copper film 250 is formed by copper plating between the LED thermal terminal bonding copper surface 222 and the lower copper foil surface 230 of the copper foil surface 220 of the PCB assembly 50 of the via hole 240 In the second step,

And a third step of inserting and interposing a thermally conductive chip (300) having a gold (Au) film in the copper (Ag) core in the copper film (250).

In the second step, the copper film 250 is bonded to the intermediate layer 210 of the FR-4 material interposed between the LED thermal terminal bonded copper surface 222 and the lower copper surface 230 of the upper copper surface 220 of the PCB assembly 50 Copper (Cu) plating, and the thickness of the copper film is preferably 25 to 35 mu m.

The third step of interposing the gold-plated thermally conductive chip 300 includes a third step of inserting the thermally conductive chip 300 having a height larger than the thickness of the PCB in the copper film 250 of the via hole 240, ) On the upper and lower sides of the double-sided board.

The diameter of the via hole 240 formed in the first step is preferably 1.3 mm.

 It is preferable that the gold-plated thermally conductive chip 300 in the 3-1st step has a diameter smaller than the inner diameter of the copper film 250 and a height higher than that of the double-sided board.

The via hole 240 formed in the first step may be formed in the shape of a funnel on the lower end side of the PCB assembly 50 to which the heat discharging body 400 is coupled in order to easily insert the gold-plated thermally conductive chip 300 in the via- It is preferable to form the inclined portion 241.

 The gold-plated heat conduction chip 300 of the third-first stage is preferably formed by plating a silver (Ag) core with a gold (Au) film of 7 to 12 탆.

The height of the gold-plated heat conduction chip 300 in the 3-1st step is preferably 0.15 mm to 0.25 mm higher than the thickness of the PCB assembly 50.

The diameter of the gold-plated heat conduction chip 300 in the 3-1st step is preferably 0.05 mm to 0.15 mm smaller than the diameter of the via hole in which the copper film 250 is formed.

A method of interposing the gold-plated thermally conductive chip 300 in the via hole formed with the copper film 250 of the third stage is preferably performed in such a state that the lower end of the PCB assembly 50 to which the heat sink is coupled faces upward.

The gold-plated heat conduction chip 300 protruded into the via-hole in the step 3-2 is preferably pressed by a press.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be determined by the scope of claims and equivalents thereof.

(50) --- PCB assembly (200) --- Double-sided board
(210) --- intermediate layer (220) of FR-4 material --- upper copper foil surface
(221) --- Lead frame bonding of LED element Copperface
(222) --- Thermal terminal bonding copper surface of LED element
(230) --- Lower copper foil surface (240) --- Via hole
(250) --- copper film (300) --- gold-plated heat conduction chip
(Au) layer 320 - Ag (Ag) core
(400) --- heat sink

Claims (11)

A method of manufacturing an LED lighting lamp that radiates heat using a gold-plated heat conduction chip,
A PCB assembly 50 of LED lighting or the like and a thermal terminal 19 of each LED element mounted on the upper copper surface 220 of the PCB assembly 50 are connected to the LED element thermal terminal 19 of the upper copper- A through hole 240 having a diameter of 1.3 mm to 1.6 mm is formed between the surface 222 and the lower copper foil surface 230 to form a funnel-shaped inclined portion on the lower end side of the PCB assembly 50 to which the heat sink 400 is coupled. Stage 1,
A second step of forming a copper film 250 on the inside diameter of the via hole 240 by copper plating,
A third step of inserting a gold-plated thermally conductive chip 300 coated with a gold (Au) film on a silver (Ag) core in the copper film 250,
The third step of inserting the gold-plated thermally conductive chip 300 is a method of inserting the gold-plated thermally conductive chip 300 having a diameter smaller than the diameter of the via hole formed with the copper film 250 and having a height greater than the thickness of the PCB assembly 50, 250 in the via hole formed in the step
And a third step (2-2) of pressing the gold-plated thermally conductive chip (300) protruded and inserted in the via hole at the upper and lower ends of the PCB assembly (50).
The method according to claim 1,
Wherein the thickness of the copper film (250) is 25 to 35 占 퐉.
delete delete delete delete The method according to claim 1,
Wherein a thickness of the gold (Au) film 320 of the gold-plated heat conduction chip 300 in the third-stage is in a range of 7 to 12 占 퐉.
The method according to claim 1,
Wherein the height of the gold-plated thermally conductive chip 300 in the 3-1st step is 0.15 mm to 0.25 mm higher than the thickness of the PCB assembly 50.
The method according to claim 1,
Wherein the diameter of the gold-plated thermally conductive chip 300 in the 3-1st step is smaller by 0.05mm to 0.15mm than the diameter of the via hole in which the copper film 250 is formed.
The method according to claim 1,
The method of interposing the gold-plated heat conduction chip 300 in the via hole formed with the copper layer 250 of the third stage is to insert the PCB assembly 50 with the lower end of the PCB assembly 50 to which the heat conductor is coupled upward. Fabrication method of LED lighting using gold - plated heat conduction chip.
The method according to claim 1,
Wherein the means for pressing the thermally conductive chip (300) projected into the via hole in the step 3-2 is a press.
KR1020150165181A 2015-11-25 2015-11-25 Led lamp manufacturing method using gold-plated thermal conductivity chip KR101629762B1 (en)

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KR102701837B1 (en) * 2024-03-07 2024-09-02 주식회사 케이엔씨글로벌텍 Multilayer PCB providing improved heat dissipation performance and manufacturing method thereof

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KR100975970B1 (en) 2009-11-27 2010-08-13 주식회사 테크엔 The large illuminations with power led
KR20140095751A (en) * 2013-01-25 2014-08-04 정연보 Metal printed circuit board, assembly substrate for light emitting diode, assembly body for light emitting diode using the same
JP5569210B2 (en) * 2010-07-21 2014-08-13 住友ベークライト株式会社 Light source device
KR101558889B1 (en) 2015-06-10 2015-10-13 주식회사 테크엔 Led lamp a radiation systems using a high-efficiency thermal conductivity chip
KR101570053B1 (en) * 2015-07-28 2015-11-19 주식회사 테크엔 Led street light with variable color temperature according to weather changes

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Publication number Priority date Publication date Assignee Title
KR20050045558A (en) * 2003-11-12 2005-05-17 주식회사 에이팩 A heatsink and its manufaturing method
KR100975970B1 (en) 2009-11-27 2010-08-13 주식회사 테크엔 The large illuminations with power led
JP5569210B2 (en) * 2010-07-21 2014-08-13 住友ベークライト株式会社 Light source device
KR20140095751A (en) * 2013-01-25 2014-08-04 정연보 Metal printed circuit board, assembly substrate for light emitting diode, assembly body for light emitting diode using the same
KR101558889B1 (en) 2015-06-10 2015-10-13 주식회사 테크엔 Led lamp a radiation systems using a high-efficiency thermal conductivity chip
KR101570053B1 (en) * 2015-07-28 2015-11-19 주식회사 테크엔 Led street light with variable color temperature according to weather changes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102701837B1 (en) * 2024-03-07 2024-09-02 주식회사 케이엔씨글로벌텍 Multilayer PCB providing improved heat dissipation performance and manufacturing method thereof

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