CN206136543U - Samming type forced air cooling radiator - Google Patents
Samming type forced air cooling radiator Download PDFInfo
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- CN206136543U CN206136543U CN201621038461.9U CN201621038461U CN206136543U CN 206136543 U CN206136543 U CN 206136543U CN 201621038461 U CN201621038461 U CN 201621038461U CN 206136543 U CN206136543 U CN 206136543U
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- power device
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- air cooling
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- radiator
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Abstract
The utility model discloses a samming type forced air cooling radiator, which comprises a substrate, be provided with radiating fin on the bottom surface of base plate, radiating fin's one end is equipped with the air intake, and the other end is equipped with the air outlet, a plurality of and uniformly heated plate's shape assorted recess, every are seted up to the top surface of base plate the embedded uniformly heated plate that is equipped with of recess, the power device setting is in uniformly heated plate is last. The utility model discloses an every uniformly heated plate is responsible for the heat dissipation of each selfcorresponding power device in the radiator, has stoped the heat conduction between the power device effectively, avoids having guaranteed because of excessive temperature differentials between radiator air intake and the air outlet leads to the fact the power device unstable that temperature on the base plate is even, has reduced the power device because of the unstability that the high temperature results in, has lengthened the life of power device.
Description
Technical field
This utility model is related to air-cooled radiator technical field.More particularly, to a kind of radiating of homogeneous temperature type forced air cooling
Device.
Background technology
In prior art, high power device can operationally produce high temperature, and traditional forced air cooling radiator is directly to dissipate
Hot device surface smear heat-conducting silicone grease installation power device again, does not do any technique processing on fin and substrate.This kind of radiator
Operationally the temperature of air inlet position is stacked into air outlet position through fin and substrate conduction, causes whole radiator temperature
It is uneven, can be higher the closer to air outlet position temperature.So make the power device temperature difference on radiator larger, bring
The factors of instability.
Accordingly, it is desirable to provide a kind of little homogeneous temperature type radiator of the temperature difference of air inlet and air outlet.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of homogeneous temperature type forced air cooling radiating of uniformity of temperature profile
Device.
To solve above-mentioned technical problem, this utility model adopts following technical proposals：
A kind of homogeneous temperature type forced air cooling radiator, including substrate, are provided with radiating fin on the bottom surface of the substrate, described
One end of radiating fin is provided with air inlet, and the other end is provided with air outlet, and the top surface of the substrate offers several and soaking plate
Mating shapes groove, soaking plate is embedded with each described groove, power device is arranged in the soaking plate.
Preferably, the top surface of the substrate offers the groove of 4 and the mating shapes of soaking plate.
Preferably, 4 groove arrangements are in a row.
The beneficial effects of the utility model are as follows：
A kind of homogeneous temperature type forced air cooling radiator of the present utility model is as a result of above-mentioned technical proposal, real estate fluting
It is divided into setting-in soaking plate in 4 radiating areas, corresponding groove, each soaking plate to be responsible for each correspondence power spreader surface
The radiating of device, effectively prevents the heat between power device to conduct, it is to avoid because between radiator air inlet and air outlet
Excessive temperature differentials causes power device unstable, it is ensured that the temperature on substrate is uniform, reduces power device because temperature is too high
It is caused unstable, extend the service life of power device.
Description of the drawings
Specific embodiment of the present utility model is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 illustrates explosive view of the present utility model.
Fig. 2 illustrates application schematic diagram of the present utility model.
Specific embodiment
In order to be illustrated more clearly that this utility model, this utility model is done into one with reference to preferred embodiments and drawings
The explanation of step.Similar part is indicated with identical reference in accompanying drawing.It will be appreciated by those skilled in the art that below
Specifically described content is illustrative and be not restrictive, and should not limit protection domain of the present utility model with this.
As shown in figure 1, a kind of homogeneous temperature type forced air cooling radiator, including substrate 1, it is provided with the bottom surface of substrate 1 vertical
With the radiating fin 4 of substrate 1, one end of radiating fin 4 is provided with air inlet 5, and the other end is provided with air outlet 6, and the top surface of substrate 1 is opened
The groove 3 of 4 and the form fit of soaking plate 2 is provided with, groove 3 is arranged and in a row substrate 1 is separated into into 4 sections, soaking plate 2
It is embedded in groove 3, power device 7 is arranged on the surface of soaking plate 2.The heat that power device 7 is produced when working is by equal
Hot plate 2 is taken away after being transmitted on substrate 1 by radiating fin 4, because soaking plate 2 can prevent heat from substrate 1 to power device 7
Conduction, it is achieved that the temperature of substrate 1 is uniform.
As shown in Fig. 2 power device 7 is arranged in soaking plate 2, soaking plate 2 is inlaid in the top surface of substrate 1, because near enter
Power device 7 at the position of air port 5 all can only transmit heat with the power device 7 at the position of air outlet 6 to substrate 1,
So between power device 7 can keeping temperature it is uniform, the situation without excessive temperature differentials between emergent power device 7 occurs,
Cause power device job insecurity because temperature is too high so as to avoid, extend the service life of power device.
Obviously, above-described embodiment of the present utility model is only intended to clearly illustrate this utility model example, and
It is not the restriction to embodiment of the present utility model, for those of ordinary skill in the field, in described above
On the basis of can also make other changes in different forms, all of embodiment cannot be exhaustive here,
It is every to belong to the obvious change or change still in of the present utility model that the technical solution of the utility model extends out
The row of protection domain.
Claims (3)
1. a kind of homogeneous temperature type forced air cooling radiator, it is characterised in that：Including substrate, radiating is provided with the bottom surface of the substrate
Fin, one end of the radiating fin is provided with air inlet, and the other end is provided with air outlet, and the top surface of the substrate offers several
With the groove of the mating shapes of soaking plate, soaking plate is embedded with each described groove, power device is arranged on the soaking
On plate.
2. a kind of homogeneous temperature type forced air cooling radiator according to claim 1, it is characterised in that：The top surface of the substrate is opened
It is provided with the groove of 4 and the mating shapes of soaking plate.
3. a kind of homogeneous temperature type forced air cooling radiator according to claim 2, it is characterised in that：4 groove arrangements
In a row.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621038461.9U CN206136543U (en) | 2016-09-05 | 2016-09-05 | Samming type forced air cooling radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621038461.9U CN206136543U (en) | 2016-09-05 | 2016-09-05 | Samming type forced air cooling radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206136543U true CN206136543U (en) | 2017-04-26 |
Family
ID=58567897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621038461.9U Active CN206136543U (en) | 2016-09-05 | 2016-09-05 | Samming type forced air cooling radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206136543U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493172A (en) * | 2018-06-08 | 2018-09-04 | 广东工业大学 | A kind of soaking plate heat dissipating device of intelligent control |
| CN110149783A (en) * | 2019-06-03 | 2019-08-20 | 西安交通大学 | A kind of the free convection reinforcing radiator structure and heat dissipating method of non-homogeneous heat source distribution |
| CN112492862A (en) * | 2021-01-05 | 2021-03-12 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
| CN113241333A (en) * | 2021-04-30 | 2021-08-10 | 阳光电源股份有限公司 | Power device heat dissipation system, assembly method thereof and semiconductor equipment |
-
2016
- 2016-09-05 CN CN201621038461.9U patent/CN206136543U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108493172A (en) * | 2018-06-08 | 2018-09-04 | 广东工业大学 | A kind of soaking plate heat dissipating device of intelligent control |
| CN110149783A (en) * | 2019-06-03 | 2019-08-20 | 西安交通大学 | A kind of the free convection reinforcing radiator structure and heat dissipating method of non-homogeneous heat source distribution |
| CN112492862A (en) * | 2021-01-05 | 2021-03-12 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
| CN113241333A (en) * | 2021-04-30 | 2021-08-10 | 阳光电源股份有限公司 | Power device heat dissipation system, assembly method thereof and semiconductor equipment |
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