CN205883822U - Electronic governor and unmanned aerial vehicle - Google Patents

Electronic governor and unmanned aerial vehicle Download PDF

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Publication number
CN205883822U
CN205883822U CN201620687570.7U CN201620687570U CN205883822U CN 205883822 U CN205883822 U CN 205883822U CN 201620687570 U CN201620687570 U CN 201620687570U CN 205883822 U CN205883822 U CN 205883822U
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circuit board
heat
speed regulator
electron speed
district
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CN201620687570.7U
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Chinese (zh)
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康振华
于江涛
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Guangzhou Xaircraft Technology Co Ltd
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Guangzhou Xaircraft Technology Co Ltd
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Abstract

The utility model discloses an electronic governor and unmanned aerial vehicle. Electronic governor includes: casing, circuit board and have insulating properties's heat conduction bed set. Prescribe a limit to in the casing to hold the chamber, the casing is the metal casing. The circuit board is established and is being held the intracavity, is equipped with the power tube on the circuit board. The heat conduction bed set is established on the power tube, heat conduction bed set and the inner wall contact of holding the chamber. According to the utility model discloses an electronic governor can furthest outside the casing is derived to the heat on the circuit board, reduces circuit board operating temperature, guarantees that electronic governor can reach maximum output power, and has prolonged the life -span of components and parts, has reduced electronic governor's weight, has strengthened interference immunity. Whole electronic governor simple structure, processing technology are also uncomplicated, but material saving and cost.

Description

Electron speed regulator and unmanned plane
Technical field
This utility model relates to a kind of electron speed regulator and unmanned plane.
Background technology
The electron speed regulator used on unmanned plane has the characteristic that power density is high, it require in limited bulk (about The area of one business card) realize Shang kilowatt output.Therefore electron speed regulator is higher to cooling requirements, its heat dissipating layer The folded feature such as low thermal resistance to be possessed, lightweight, rapid heat dissipation.
Utility model content
This utility model is intended at least to solve one of technical problem present in prior art.To this end, this utility model exists In proposing a kind of electron speed regulator, the heat dispersion of described electron speed regulator is good.
This utility model also proposes a kind of unmanned plane with above-mentioned electron speed regulator.
According to electron speed regulator of the present utility model, including: housing, limit receiving chamber, described housing in described housing For metal shell;Circuit board, described circuit board is located at described receiving intracavity, and described circuit board is provided with power tube;There is insulation The heat-conducting layer group of performance, described heat-conducting layer group is located on described power tube, and described heat-conducting layer group connects with the inwall in described receiving chamber Touch.
According to the electron speed regulator of this utility model embodiment, by housing is arranged on metal shell, and circuit board Power tube contacted with housing by the heat-conducting layer group with insulating properties, it is thus possible to greatest extent the unit on circuit board Device heat is derived outside housing, reduces circuit board operating temperature, it is ensured that electron speed regulator can reach peak power output, and prolongs Grow the life-span of components and parts.Meanwhile, using metal shell as the important step of heat radiation, electron speed regulator need not the most additionally arrange scattered Backing, thus decrease unnecessary additional components weight, and then reduce the weight of electron speed regulator.It addition, circuit board is located at In metal shell, casing shielding external electromagnetic interference can be passed through, thus enhance the anti-interference of electron speed regulator.Whole electronics Governor structure is simple, and processing technique is the most uncomplicated, can material saving and cost.
In certain embodiments, described heat-conducting layer group includes: the first gold medal being located between described power tube and described housing Belonging to layer, described the first metal layer includes that floor district, described floor district include that horizontal plate and the lateral buckling from described horizontal plate extend Vertical piece, described horizontal plate fits in the top of described power tube, and described vertical piece is fixed on described circuit board.
Specifically, described vertical piece fits in the side of described power tube.
In certain embodiments, described power tube is multiple, and multiple described power tube is the form of multiple rows of multiple row Being arranged on described circuit board, described the first metal layer includes multiple floor district, often arranges described power tube and is provided with one piece of described layer District.
Further, described heat-conducting layer group also includes: be located at second between described the first metal layer and described housing Metal level, described second metal level contacts with described the first metal layer.
Further, described heat-conducting layer group also includes: the heat conduction being located between described second metal level and described housing is exhausted The contact internal walls in edge layer, described thermally conductive insulating layer and described receiving chamber.
In a concrete example, described housing is Al-alloy parts, and described the first metal layer is copper sheet layer, described second gold medal Belonging to layer is aluminium flake layer.Thus, electron speed regulator has the effects such as lamination is simple, processing technique is simple, radiating effect is superior.
In certain embodiments, described housing include top shell, described top shell include Hou Ke district and from described Hou Ke district one The shell district that end extends, the end face in described shell district flushes with described circuit board, and the top in described shell district is provided with opening, institute The power line stating circuit board passes described opening to stretch out described receiving chamber.
Specifically, the top of described housing is provided with the fin for heat radiation.
According to unmanned plane of the present utility model, including according to electron speed regulator of the present utility model.
According to unmanned plane of the present utility model, by arranging above-mentioned electron speed regulator, improve stablizing of unmanned plane operation Property and reliability.It addition, decrease the weight of unmanned plane, save cost.
Additional aspect of the present utility model and advantage will part be given in the following description, and part will be from explained below In become obvious, or recognized by practice of the present utility model.
Accompanying drawing explanation
Above-mentioned and/or additional aspect of the present utility model and advantage are from combining general the accompanying drawings below description to embodiment Become obvious and easy to understand, wherein:
Fig. 1 is the decomposition chart of the electron speed regulator according to this utility model embodiment;
Fig. 2 is the three-dimensional structure diagram of the electron speed regulator according to this utility model embodiment;
Fig. 3 is the sectional structure chart of the electron speed regulator according to this utility model embodiment.
Reference:
Electron speed regulator 100,
Housing 1, accommodate chamber 10, top shell 11, Hou Ke district 111, shell district 112, drain pan 12, fin 13, opening 14,
Circuit board 2, power tube 21, power line 22,
Heat-conducting layer group 3, thermally conductive insulating layer 31, the first metal layer 32, floor district 321, horizontal plate 3211, vertical piece 3212, Two metal levels 33.
Detailed description of the invention
Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, the most ad initio Represent same or similar element to same or similar label eventually or there is the element of same or like function.Below by ginseng It is exemplary for examining the embodiment that accompanying drawing describes, it is intended to be used for explaining this utility model, and it is not intended that to this utility model Restriction.
Below with reference to Fig. 1-Fig. 3, the electron speed regulator 100 according to this utility model embodiment is described.
Electron speed regulator 100 according to this utility model embodiment, as depicted in figs. 1 and 2, including: housing 1, circuit board 2 With the heat-conducting layer group 3 with insulating properties.Limiting receiving chamber 10 in housing 1, housing 1 is metal shell.Circuit board 2 is located at appearance Receiving in chamber 10, circuit board 2 is provided with power tube 21.Heat-conducting layer group 3 is located on power tube 21, heat-conducting layer group 3 and receiving chamber 10 Contact internal walls.
It is to say, the power tube 21 on circuit board 2 is connected with housing 1 by heat-conducting layer group 3 in electron speed regulator 100 Touch.Heat-conducting layer group 3 possesses stronger heat conductivility, and housing 1 is metal shell, and housing 1 possesses stronger heat dispersion, therefore On circuit board 2, the heat of power tube 21 can be gone out by heat-conducting layer group 3 and housing 1 rapid divergence, thus quickly reduces circuit board 2 Operating temperature.So heat dispersion of electron speed regulator 100 improves, and on circuit board 2, each components and parts are unlikely to be burnt, it is ensured that The stability of the output of electron speed regulator 100.
Further, since heat-conducting layer group 3 has insulating properties, power tube 21 cannot be led with metal shell by heat-conducting layer group 3 Electricity, such heat-conducting layer group 3, it is avoided that the situation of electric leakage after other components and parts contact on circuit board 2 with heat-conducting layer group 3.
Electron speed regulator 100 according to this utility model embodiment, by being arranged to metal shell, and circuit by housing 1 Power tube 21 on plate 2 is contacted with housing 1 by the heat-conducting layer group 3 with insulating properties, it is thus possible to greatest extent electricity Components and parts heat on road plate 2 is derived outside housing 1, reduces circuit board 2 operating temperature, it is ensured that electron speed regulator 100 can reach Peak power output, and extend the life-span of components and parts.Meanwhile, using metal shell as the important step of heat radiation, electronic speed regulation Device 100 need not the most additionally arrange fin, thus decreases unnecessary additional components weight, and then reduces electron speed regulator The weight of 100.It addition, circuit board 2 is located in metal shell, external electromagnetic interference can be shielded by housing 1, thus enhance electricity The anti-interference of sub-speed regulator 100.Whole electron speed regulator 100 simple in construction, processing technique is the most uncomplicated, can material saving and Cost.
For convenience of understanding, a concrete reality in electron speed regulator 100 of the present utility model is described below in conjunction with Fig. 1-Fig. 3 Execute example.
As shown in Figure 1-Figure 3, housing 1 includes: drain pan 12 and top shell 11, limits receiving chamber between drain pan 12 and top shell 11 10, circuit board 2 and heat-conducting layer group 3 are each provided at accommodating in chamber 10.Wherein, the side being provided with power tube 21 of circuit board 2 towards Top shell 11 is arranged.
Heat-conducting layer group 3 also includes: the first metal layer 32, and the first metal layer 32 is located between power tube 21 and housing 1, first Metal level 32 includes that floor district 321, floor district 321 include: horizontal plate 3211 and vertical piece 3212, vertical piece 3212 is from horizontal plate 3211 A lateral buckling extend, horizontal plate 3211 fits in the top of power tube 21, and vertical piece 3212 is fixed on circuit board, and perpendicular Straight sheet 3212 fits in the side of power tube 21.It is to say, a part for the first metal layer 32 is curved towards the direction of circuit board 2 Folding.Wherein, the first metal layer 32 is coated with heat conductive silica gel on the surface away from circuit board 2.
Heat-conducting layer group 3 also includes: the second metal level 33, and the second metal level 33 is located between the first metal layer 32 and housing 1, Second metal level 33 contacts with the first metal layer 32.
Heat-conducting layer group 3 includes: have the thermally conductive insulating layer 31 of heat conduction and insulating properties, and thermally conductive insulating layer 31 is located at power tube On 21 and with accommodate chamber 10 contact internal walls.
On the circuit board 2, power tube 21 is multiple, and the form that multiple power tube 21 is in multiple rows of multiple row is arranged on circuit board On 2.Wherein, power tube 21 is formed as M row's N row, and wherein, M can be 6, and the quantity of N can be 3,4,5 etc..
The first metal layer 32 includes multiple floor district 321, and often row's power tube 21 is provided with piece layer district 321.It is to say, it is every One row's power tube 21 constitutes a heat-generating units, sets a Ge Ceng district 321 above each heat-generating units, and multiple floor district 321 constitute One metal level 32.Wherein, spaced apart between adjacent Liang Geceng district 321.
Specifically, as it is shown in figure 1, each floor district 321 all includes: horizontal plate 3211 and vertical piece 3212, horizontal plate 3211 Be located between power tube 21 and thermally conductive insulating layer 31, vertical piece 3212 from the side edge-perpendicular of horizontal plate 3211 towards circuit board The direction of 2 extends.It is to say, each floor district 321 is formed generally as the plate part of a L-shaped.
As it is shown on figure 3, the roof of thermally conductive insulating layer 31 and sidewall contact with top shell 11, the sidewall of the second metal level 33 with Top shell 11 also contacts.
It addition, the top of top shell 11 is provided with multiple fin 13, fin 13 rule in top shell 11 is neatly distributed, multiple fins 13 form multiple rows of multiple row.Multiple fins 13 be array-like be P row Q row, P and Q is determined by concrete heat conduction situation.
Being additionally provided with opening 14 on housing 1, the power line 22 of circuit board 2 accommodates chamber 10 through opening 14 to stretch out.Fig. 1- In the embodiment of Fig. 3, power line 22 has three, and three power lines 22 connect on the circuit board 2 at interval.Opening 14 is located at top On shell 11, three power lines 22 stretch out housing 1, to connect external power source at opening 14.
In this embodiment, the thickness of drain pan 12 is equal, and the top of drain pan 12 is opened wide.The bottom-open of top shell 11, top shell 11 are fastened on drain pan 12 to form receiving chamber 10.Wherein, top shell 11 includes Hou Ke district 111 and the one end from Hou Ke district 111 The shell district 112 that bottom is extended, the gauge in Hou Ke district 111 is relatively big, and the gauge in shell district 112 is less.Here carry And gauge, refer to the size on the thickness direction of circuit board 2.
Opening 14 is located at the top in shell district 112, and fin 13 is located at the top in Hou Ke district 111, and the side of opening 14 is with thick The edge in shell district 111 is concordant, say, that cut out opening 14 at the top in shell district 112 along the edge in Hou Ke district 111.
As it is shown on figure 3, the end face in the end face of circuit board 2 and shell district 112 is substantially flush, the power line 22 of circuit board 2 exists Without bending when stretching out opening 14.
In this embodiment, the heat conduction lamination of electron speed regulator 100 includes from lower to upper: drain pan 12, circuit board 2, first Metal level the 32, second metal level 33, thermally conductive insulating layer 31 and top shell 11.Top shell 11 contacts with heat-conducting layer group 3, heat-conducting layer group 3, Top shell 11 constitutes the critical component of circuit board 2 heat radiation.
The assembling process of this embodiment is: can be by the bottom of the vertical piece 3212 in each floor district 321 of the first metal layer 32 Welding on the circuit board 2, makes the vertical piece 3212 in each floor district 321 be close to the side of corresponding power pipe 21, each floor district 321 Horizontal plate 3211 is close to the end face of corresponding power pipe 21.Then the second metal level 33 is bonded at the first metal by heat conductive silica gel On layer 32, afterwards thermally conductive insulating layer 31 is overlayed on the second metal level 33.
After setting heat-conducting layer group 3 on the circuit board 2, circuit board 2 can be placed in drain pan 12, then buckle top shell 11, make heat-conducting layer group 3 be pressed between top shell 11 and circuit board 2.
Can power line 22 be welded on the circuit board 2 before circuit board 2 loads housing 1, it is possible to load shell at circuit board 2 Again power line 22 is welded on the circuit board 2 after body 1.
In the above-described embodiments, housing 1 is divided into drain pan 12 and top shell 11, can be convenient for assembly.
Thermally conductive insulating layer 31 can be heat-conducting silica gel sheet, and heat-conducting silica gel sheet not only has certain heat conductivility, also has insulation Performance, it is ensured that heat-conducting layer group 3 can heat conduction and the characteristic of insulation.It addition, heat-conducting silica gel sheet also has certain elasticity, therefore thermal conductive silicon Film can closely be compacted between power tube 21 and housing 1, it is ensured that will not press from both sides between heat-conducting layer group 3 and housing 1, power tube 21 There is too much air, thus ensure high to the heat conductivity of housing 1 from power tube 21, and bumper housing 1 is transmitted by heat-conducting layer group 3 To the pressure of power tube 21, protect power tube 21.
In the above-described embodiments, select the first metal layer 32 to be attached on power tube 21, the heat conduction system of heat-conducting layer group 3 can be improved Number, it is ensured that the heat on power tube 21 can quickly conduct to heat-conducting layer group 3.
In the above-described embodiments, the first metal layer 32 also sets up the second metal level 33, the first metal layer 32 and second Metal level 33 can be made from a variety of materials or be arranged to different shapes, and the first metal layer 32 coordinates the second metal level 33 can To reach more preferable heat conductivility.
Such as, in the above-described embodiments, the first metal layer 32 is copper sheet layer, and the second metal level 33 is aluminium flake layer.Due to copper Material heat conductivity is high, and the welding performance parameter of copper sheet is preferable, and therefore the first metal layer 32 selects copper sheet layer can improve the first gold medal Belong to the welding quality between layer 32 and circuit board 2.Owing to aluminium heat conductivity is the highest, and aluminium light weight, quality are soft, Yi Jia Work, can more be close to aluminium flake compacting, therefore the second metal level 33 aluminium lamella.
In above-described embodiment, the first metal layer 32 is divided into multiple floor district 321, spaced apart between adjacent Liang Geceng district 321, Not only avoid altering electricity between adjacent two power tubes 21, also help each floor district 321 and set according to the arrangement of this row's power tube 21 It is set to suitable shape.In Fig. 1, owing to often arranging the equal marshalling of power tube 21, corresponding floor district 321 is at power bank of tubes Curving, with the sidewall contact with this row's power tube 21, thus increases the contact area of the first metal layer 32 and power tube 21, Improve the capacity of heat transmission of the first metal layer 32.
In the above-described embodiments, each floor district 321 is welded on the circuit board 2, each floor district 321 and circuit board 2 can be made Connection more firm, and between each floor district 321 and corresponding power pipe 21, thermal resistance loss is low.
In the above-described embodiments, the surface away from power tube 21 of the first metal layer 32 scribbles heat conductive silica gel, thus Make the first metal layer 32 have certain insulating properties, improve the integral insulation performance of heat-conducting layer group 3.It addition, at the first metal Being coated with heat conductive silica gel on layer 32, the second metal level 33 can be bonded on the first metal layer 32 when being located on the first metal layer 32, adds The firmness of the connection between strong second metal level 33 and the first metal layer 32.
In the above-described embodiments, housing 1 is Al-alloy parts, and housing 1 can be made to have the characteristic such as high thermal conductivity coefficient, high intensity, Housing 1 can be designed variously-shaped, and the thickness of housing 1 can also be designed to relatively thin.Complete machine heat-transfer surface is long-pending relatively big, and housing 1 can It is equivalent to low thermal resistance parts, makes electron speed regulator 100 close to preferable heat conduction condition.
The setting of fin 13 can improve the heat dispersion of housing 1.Wherein, row and the columns of fin 13 can be by specifically applying Situation is arranged, and is not construed as limiting here.
Certainly, the electron speed regulator 100 of this utility model embodiment is not limited to the structure described in above-described embodiment, such as, The thermally conductive insulating layer 31 in this utility model with heat conduction and insulating properties is not limited to heat-conducting silica gel sheet, and thermally conductive insulating layer 31 also may be used Being made up of other materials, such as thermally conductive insulating layer 31 can be also ceramic layer etc..
Furthermore it is possible to again choose the first metal layer 32 and the second gold medal according to the performance of the heat-conducting layer group 3 being pre-designed Belong to the material of layer 33.Such as, the first metal layer 32 directly contacted with power tube 21 can be arranged to highly heat-conductive material layer, to incite somebody to action Heat on power tube 21 is quickly derived.Then the second metal level 33 contacted with the first metal layer 32 is by the material of high specific heat capacity Make, or the second metal level 33 is arranged to the material of one-way heat conduction, so, the heat conduction that the first metal layer 32 absorbs to the After two metal levels 33, the heat of the second metal level 33 can no longer be transferred back on power tube 21 by the first metal layer 32.
Further, after the structure that the first metal layer 32 is rationally set and thickness, it is also possible to cancel the second metal level 33 and lead At least one in thermal insulation layer 31.
If heat-conducting layer group 3 eliminates the setting of the second metal level 33, then thermally conductive insulating layer 31 is being located at the first metal layer Can be bonded on the first metal layer 32 time on 32, strengthen the firm journey of connection between the second metal level 33 and the first metal layer 32 Degree.
To sum up, electron speed regulator 100 has a following plurality of advantages:
1) the design has the effects such as lamination is simple, processing technique is simple, heat-conducting effect is superior;
2) selecting copper sheet is the first metal layer 32, and simple in construction is easily worked, and heat conductivity is high, distinctive welding manner Making fixing more firm, thermal resistance loss is low;
3) selecting silicone grease is thermally conductive insulating layer 31, is easily worked, has good heat conduction and insulating properties;
4) aluminium alloy shell is housing 1, has the characteristic such as high thermal conductivity coefficient, high intensity, can design variously-shaped, Thickness can be designed to relatively thin, and complete machine heat-transfer surface is long-pending relatively big, can be equivalent to low thermal resistance parts, close to preferable heat conduction bar Part.
According to the unmanned plane of this utility model embodiment, including the electron speed regulator according to this utility model above-described embodiment 100。
According to the unmanned plane of this utility model embodiment, by arranging above-mentioned electron speed regulator 100, electron speed regulator 100 Peak power output can be reached, and service life is long, improve stability and reliability that unmanned plane runs.It addition, reduce The weight of unmanned plane, has saved cost.
In description of the present utility model, it is to be understood that term " " center ", " thickness ", " on ", D score, " top ", Orientation or the position relationship of the instruction such as " end ", " interior ", " outward " they are based on orientation shown in the drawings or position relationship, merely to just Describe in description this utility model and simplification rather than indicate or imply that the device of indication or element must have specific side Position, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.
Additionally, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance Or the implicit quantity indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can express or Implicitly include one or more this feature.In description of the present utility model, except as otherwise noted, the implication of " multiple " It is two or more.
In description of the present utility model, unless otherwise clearly defined and limited, term " be connected ", " connection ", " Gu Fixed " should be interpreted broadly, connect for example, it may be fixing, it is also possible to be to removably connect, or integral;Can be that machinery connects Connect, it is also possible to be electrical connection;Can be to be joined directly together, it is also possible to be indirectly connected to by intermediary, in can being two elements The connection in portion or the interaction relationship of two elements.For the ordinary skill in the art, can manage with concrete condition Solve above-mentioned term concrete meaning in this utility model.
In this utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it D score can include that the first and second features directly contact, it is also possible to includes that the first and second features are not directly contact but logical Cross the other characterisation contact between them.And, fisrt feature second feature " on ", " top " and " above " include One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height higher than second feature.First is special Levy second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or only Represent that fisrt feature level height is less than second feature.
In the description of this specification, the description of reference term " embodiment ", " example " etc. mean to combine this embodiment or Specific features, structure, material or feature that example describes are contained at least one embodiment of the present utility model or example. In this manual, the schematic representation to above-mentioned term is not necessarily referring to identical embodiment or example.And, description Specific features, structure, material or feature can be tied in any one or more embodiments or example in an appropriate manner Close.
Embodiment the most of the present utility model, it will be understood by those skilled in the art that: In the case of without departing from principle of the present utility model and objective, these embodiments can be carried out multiple change, revise, replace And modification, scope of the present utility model is limited by claim and equivalent thereof.

Claims (10)

1. an electron speed regulator, it is characterised in that including:
Housing, limits receiving chamber in described housing, described housing is metal shell;
Circuit board, described circuit board is located at described receiving intracavity, and described circuit board is provided with power tube;
Having the heat-conducting layer group of insulating properties, described heat-conducting layer group is located on described power tube, described heat-conducting layer group and described appearance Receive the contact internal walls in chamber.
Electron speed regulator the most according to claim 1, it is characterised in that described heat-conducting layer group includes: be located at described power The first metal layer between pipe and described housing, described the first metal layer includes that floor district, described floor district include horizontal plate and from institute Stating the vertical piece that a lateral buckling of horizontal plate extends, described horizontal plate fits in the top of described power tube, described vertical piece It is fixed on described circuit board.
Electron speed regulator the most according to claim 2, it is characterised in that described vertical piece fits in the one of described power tube Side.
Electron speed regulator the most according to claim 2, it is characterised in that described power tube is multiple, and multiple described merit Rate pipe is that the form of multiple rows of multiple row is arranged on described circuit board, and described the first metal layer includes multiple floor district, often arranges described merit Rate pipe is provided with one piece of described floor district.
Electron speed regulator the most according to claim 2, it is characterised in that described heat-conducting layer group also includes: be located at described The second metal level between one metal level and described housing, described second metal level contacts with described the first metal layer.
Electron speed regulator the most according to claim 5, it is characterised in that described heat-conducting layer group also includes: be located at described The contact internal walls in the thermally conductive insulating layer between two metal levels and described housing, described thermally conductive insulating layer and described receiving chamber.
Electron speed regulator the most according to claim 5, it is characterised in that described housing is Al-alloy parts, described first gold medal Belonging to layer is copper sheet layer, and described second metal level is aluminium flake layer.
Electron speed regulator the most according to claim 1, it is characterised in that described housing includes that top shell, described top shell include The shell district that Hou Ke district and the one end from described Hou Ke district are extended, the end face in described shell district flushes with described circuit board, institute The top stating shell district is provided with opening, and the power line of described circuit board passes described opening to stretch out described receiving chamber.
9. according to the electron speed regulator according to any one of claim 1-8, it is characterised in that the top of described housing is provided with use Fin in heat radiation.
10. a unmanned plane, it is characterised in that including: according to the electron speed regulator according to any one of claim 1-9.
CN201620687570.7U 2016-06-30 2016-06-30 Electronic governor and unmanned aerial vehicle Active CN205883822U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107187586A (en) * 2017-04-28 2017-09-22 重庆零度智控智能科技有限公司 Unmanned vehicle body and unmanned vehicle
CN108521773A (en) * 2017-08-31 2018-09-11 深圳市大疆创新科技有限公司 Electricity adjusts component, dynamical system and unmanned plane
WO2018196043A1 (en) * 2017-04-28 2018-11-01 上海拓攻机器人有限公司 Control apparatus for unmanned aerial vehicle, and unmanned aerial vehicle
CN109892026B (en) * 2017-04-24 2022-04-26 深圳市大疆创新科技有限公司 Electronic governor and unmanned aerial vehicle

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109892026B (en) * 2017-04-24 2022-04-26 深圳市大疆创新科技有限公司 Electronic governor and unmanned aerial vehicle
CN107187586A (en) * 2017-04-28 2017-09-22 重庆零度智控智能科技有限公司 Unmanned vehicle body and unmanned vehicle
WO2018196043A1 (en) * 2017-04-28 2018-11-01 上海拓攻机器人有限公司 Control apparatus for unmanned aerial vehicle, and unmanned aerial vehicle
US11032906B2 (en) 2017-04-28 2021-06-08 Shanghai TopxGun Robotics Co., Ltd. Control device for unmanned aerial vehicle and unmanned aerial vehicle
CN107187586B (en) * 2017-04-28 2023-09-15 北京远度互联科技有限公司 Unmanned vehicles organism and unmanned vehicles
CN108521773A (en) * 2017-08-31 2018-09-11 深圳市大疆创新科技有限公司 Electricity adjusts component, dynamical system and unmanned plane
CN108521773B (en) * 2017-08-31 2021-10-08 深圳市大疆创新科技有限公司 Subassembly, driving system and unmanned aerial vehicle are transferred to electricity

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