CN203554260U - An electric power conversion device and a refrigerator - Google Patents
An electric power conversion device and a refrigerator Download PDFInfo
- Publication number
- CN203554260U CN203554260U CN201320638948.0U CN201320638948U CN203554260U CN 203554260 U CN203554260 U CN 203554260U CN 201320638948 U CN201320638948 U CN 201320638948U CN 203554260 U CN203554260 U CN 203554260U
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- Prior art keywords
- power inverter
- semiconductor device
- heat
- heated parts
- radiating part
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- Expired - Fee Related
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- Devices That Are Associated With Refrigeration Equipment (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides an electric power conversion device and a refrigerator. The task of the utility model is to obtain an electric appliance product with a high degree of freedom of the layout of components. According to the electric power conversion device of the utility model, one or more semiconductor devices (3) installed on an electronic printing substrate (2) is accommodated in an electric appliance component case (9). The electric power conversion device is characterized in that: electric power conversion device is formed of the following structure: the electric power conversion device is provided with a heat pipe; the heat pipe is provided with a heated portion (5) arranged to be in contact with the one or more semiconductor devices (3), a heat-conducting portion (6) arranged to be in contact with the heated portion and a heat radiation portion (7) arranged to be in contact with the heat-conducting portion. A heat radiation surface of the heat radiation portion (7) is configured along the external contour of the electric appliance component case (9), and the heat radiation portion (7) is configured to be at a position higher than the heated portion (5). Refrigerant inside the heat pipe cycles spontaneously by means of the gravity and a temperature gradient. The utility model also provides a refrigerator comprising the above power conversion device in the inside portion.
Description
Technical field
The refrigerator that the utility model relates to power inverter and possesses this power inverter.
Background technology
The power inverter that many electric equipment products such as refrigerator possess possesses semiconductor device (semiconductor device).This semiconductor device can generate heat because of the action of power inverter, therefore needs the cooling mechanisms such as radiator (heat sink).And, in patent documentation 1, disclose and Coverage Control be used as to the refrigerator of heating panel with the metal cover (cover) of electronic unit receiving room.
Patent documentation 1: No. 3704250 communique of Japanese Patent
Yet, in the prior art, in the situation that using radiator, need to guarantee space (space).And, in the situation that Coverage Control is used as to heating panel with the metal cover of electronic unit receiving room, there are the following problems: must possess the metal cover with the contact of semiconductor device generating heat, the size of the position that parts are mounted, set parts (size) etc. is restricted, and the degree of freedom of the layout of parts (layout) is little.
Utility model content
The utility model completes in view of the above problems, and its object is to obtain a kind of high electric equipment products of the degree of freedom of layout of parts.
In order to solve above-mentioned problem, achieve the above object, the utility model provides a kind of following power inverter, this power inverter is taken in the one or more semiconductor device that are arranged on electronic printing substrate (print circuit board) in electric component case, above-mentioned power inverter is characterised in that, above-mentioned power inverter forms following structure: above-mentioned power inverter possesses heat pipe (heat pipe), this heat pipe possesses the heated parts of the setting of contacting with above-mentioned semiconductor device, contact the heat-conducting part arranging with this heated parts and contact the radiating part arranging with this heat-conducting part, the radiating surface of above-mentioned radiating part is along the gabarit configuration of electric component case, above-mentioned radiating part is disposed at the position higher than above-mentioned heated parts, cold-producing medium in above-mentioned heat pipe is by gravity and temperature gradient and spontaneously circulation.
And, the utility model provides a kind of following power inverter, this power inverter is taken in the one or more semiconductor device that are arranged on electronic printing substrate in being the electric component case of curved shape, above-mentioned power inverter is characterised in that, above-mentioned power inverter forms following structure: above-mentioned power inverter possesses heat pipe, this heat pipe possesses the heated parts of the setting of contacting with above-mentioned semiconductor device, contact the heat-conducting part of the flexure type arranging with this heated parts and contact the radiating part arranging with this heat-conducting part, the radiating surface of above-mentioned radiating part is along face configuration gabarit and above-mentioned heated parts different directions of electric component case, above-mentioned radiating part is disposed at the position higher than above-mentioned heated parts, cold-producing medium in above-mentioned heat pipe is by gravity and temperature gradient and spontaneously circulation.
And the utility model provides a kind of refrigerator that comprises above-mentioned power inverter in inside, and above-mentioned radiating part is along the gabarit configuration of device.
And, the utility model provides a kind of following power inverter, this power inverter is taken in the one or more semiconductor device that are arranged on electronic printing substrate in electric component case, above-mentioned power inverter is characterised in that, above-mentioned power inverter possesses heating panel, this heating panel has the heated parts contacting with above-mentioned semiconductor device, and the back side at this heated parts has radiating part, above-mentioned semiconductor device and above-mentioned electronic printing substrate are covered by housing material, this housing material is formed by the resin of insulating properties and flame retardancy, above-mentioned semiconductor device consists of wide bandgap semiconductor.
According to the utility model, can play the effect of the electric equipment products that the degree of freedom of the layout that can obtain parts is high.
Accompanying drawing explanation
Fig. 1 is the figure that the structure of the related power inverter of execution mode 1 is shown.
Fig. 2 is the figure that the related refrigerator of execution mode 1 is shown.
Fig. 3 is the figure that the structure of the related power inverter of execution mode 2 is shown.
Fig. 4 is the figure that the related refrigerator of execution mode 2 is shown.
Fig. 5 is the figure that the structure of the related power inverter of execution mode 3 is shown.
Fig. 6 is the figure that the structure of the related power inverter of execution mode 4 is shown.
Label declaration
1: cover; 2: electronic printing substrate; 3: semiconductor device; 4: fixed part; 5: heated parts; 6,6a: heat-conducting part; 7: radiating part; 8a, 8b: high thermal transfer plate; 9,9a: electric part box; 10: housing material; 11: aluminium electrolytic capacitor; 12: heating panel; 13,13a: refrigerator.
Embodiment
Below, with reference to accompanying drawing, the execution mode of the related refrigerator of the utility model is elaborated.In addition, the utility model is not limited to this execution mode.
Execution mode 1
Fig. 1 is the figure of structure that the execution mode 1 of the related power inverter that is equipped on electric equipment products of the utility model is shown.
Power inverter shown in Fig. 1 possesses: cover 1; Be fixed on the electronic printing substrate 2 of cover 1; Be fixed on the semiconductor device 3 of electronic printing substrate 2; Fixed part 4; Use fixed part 4 to be fixed on the heated parts 5 of semiconductor device 3; Transmit the hot heat-conducting part 6 of heated parts 5; Be configured in the position of leaving from heated parts 5 and the radiating part 7 contacting with heat-conducting part 6; Be assemblied in the high thermal transfer plate 8a between semiconductor device 3 and heated parts 5; Contact the high thermal transfer plate 8b of configuration with the radiating surface of radiating part 7; Take in the electric component case 9 of above-mentioned whole parts; And be assemblied in the aluminium electrolytic capacitor (aluminum electrolytic capacitor) 11 on electronic printing substrate 2.
The material of cover 1 is insulating properties material, is the material with thermal endurance and the corrosion resistance of the degree that can tolerate environment for use.As this material, can exemplify the synthetic resin such as polyethylene (polyethylene) and polypropylene (polypropylene).
As fixed part 4, can exemplify screw (screw).
Heated parts 5 is to bear the hot parts that semiconductor device 3 sends.
Heat-conducting part 6 is the heat of heated parts 5 to be passed to the parts of radiating part 7, and possesses cold-producing medium in inside.
Radiating part 7 is parts that the heat of coming via heat-conducting part 6 conduction is emitted.Radiating part 7 does not possess the structure of fin (fin) shape etc., but forms the smooth structure without concavo-convex processing.The radiating part of therefore, constructing with fin is in the past compared and can be reduced to occupy space.
High thermal transfer plate 8a, 8b are the parts that make respectively to conduct in the heat between semiconductor device 3 and heated parts 5 and between radiating part 7 and electric component case 9 become smooth and easy (smooth), and the material of high thermal transfer plate 8a, 8b is the material that pyroconductivity is high.In addition, in the situation that the caloric value of semiconductor device 3 is little, also one or both in high thermal transfer plate 8a, 8b can be set.
As long as electric component case 9 has thermal endurance, corrosion resistance and the mechanical strength of the degree that can tolerate environment for use.
Heated parts 5, heat-conducting part 6 and radiating part 7 form heat pipe, and radiating part 7 is configured in the position higher than heated parts 5.The heat that semiconductor device 3 sends is passed to radiating part 7 from heated parts 5 via heat-conducting part 6, and emits from electric component case 9.
Because radiating part 7 is configured in the position higher than heated parts 5, therefore by the refrigerated medium in the heat pipe after heated parts 5 heating, towards radiating part 7, flowed.Like this, cold-producing medium flows towards radiating part 7 naturally from heated parts 5, does not therefore need the pump (pump) for making refrigerant circulation.
, the power inverter of present embodiment is mounted in the power inverter that one or more semiconductor device 3 on electronic printing substrate 2 are incorporated in electric component case 9, it is characterized in that, this power inverter forms following structure: possess heat pipe, this heat pipe possesses the heated parts 5 of the setting of contacting with semiconductor device 3, contact the heat-conducting part 6 arranging with this heated parts 5 and contact the radiating part 7 arranging with this heat-conducting part 6, the radiating surface of radiating part 7 is along the gabarit configuration of electric component case 9, radiating part 7 is disposed at the position higher than heated parts 5, cold-producing medium in described heat pipe is by gravity and temperature gradient and spontaneously circulation.In addition, radiating surface refers to the face of the area maximum that radiating part 7 has, and is the face with semiconductor device 3 opposition sides.
What understand as mentioned above is such, uses heat pipe that heated parts 5 and radiating part 7 are disposed to the position of mutually leaving, and therefore semiconductor device 3 parts such as grade of heated parts 5 can be installed with the degree of freedom configuration than in the past high.And, can form fixing and not requiring accurate tolerance, can suppress the structure of cost (cost) for the position of electronic printing substrate 2.
In addition, because heated parts 5 and radiating part 7 are configured in the position of mutually leaving, so semiconductor device 3 is also configured in radiating part 7 position of mutually leaving, can be near semiconductor device 3 use thermal endurance than in the past low parts.Therefore, by so that the minimum mode arrangement components of the flowloop of electric current (current loop), the size that can dwindle electronic printing substrate 2.And, by selection, suppress the parts of the generation of noise (noise), can form the structure of the impact of the noise that suppresses exogen.
Yet the power inverter of present embodiment can be applied to refrigerator.Fig. 2 is the figure that the configuration when power inverter of Fig. 1 is applied to refrigerator 13 is shown.Like this, the power inverter of present embodiment is configured to side or the back side almost parallel of its radiating surface and refrigerator.
Like this, by the power inverter shown in application drawing 1, can obtain refrigerator efficient, that cheap, reliability is high.
Fig. 3 is the figure of structure that the execution mode 2 of the related power inverter that is equipped on electric equipment products of the utility model is shown.
The difference of the power inverter shown in the power inverter shown in Fig. 3 and Fig. 1 is: the heat-conducting part 6 that replaces Fig. 1, possesses crooked heat-conducting part 6a, replace electric component case 9, possess electric component case 9a, other structure is all identical with the power inverter shown in Fig. 1.
Power inverter shown in Fig. 3 possesses crooked heat-conducting part 6a, therefore, from the high thermal transfer plate 8b of radiating part 7 contact towards direction different with the power inverter shown in Fig. 1.That is, the direction of radiating surface is different.
Fig. 4 is the figure that the configuration when power inverter of Fig. 3 is applied to refrigerator 13a is shown.Like this, in the power inverter of present embodiment, be configured to the upper surface almost parallel of its radiating surface and refrigerator.Therefore, for the refrigerator 13a of present embodiment, comparing with the refrigerator 13 of execution mode 1 can constriction side or the back side, and therefore playing can be by the distinctive effect of reduction highly.
Like this, by the power inverter shown in application drawing 3, can obtain refrigerator efficient, that cheap, reliability is high.And, can increase the degree of freedom of the layout of configured parts, and increase the volume in refrigerator.
Fig. 5 is the figure of structure that the execution mode 3 of the related power inverter that is equipped on electric equipment products of the utility model is shown.
The difference of the power inverter shown in the power inverter shown in Fig. 5 and Fig. 1 is: electronic printing substrate 2 is covered by housing material 10, and other structure is identical with the power inverter shown in Fig. 1.
Power inverter shown in Fig. 5 possesses external packing component 10, therefore can prevent that dust, insect etc. are attached to the conducting parts of electronic printing substrate 2 and power inverter is broken down.Therefore, can improve the reliability of power inverter.
In addition, also can be by the textural association of the structure of present embodiment and execution mode 2.
Fig. 6 is the figure of structure that the execution mode 4 of the related power inverter that is equipped on electric equipment products of the utility model is shown.
Power inverter shown in Fig. 6 has the heating panel 12 contacting with semiconductor device 3, and the side contacting with semiconductor device 3 of heating panel 12 is heated parts, and the rear side of the heated parts of heating panel 12 is radiating part.And the same with Fig. 5, electronic printing substrate 2 is covered by housing material 10.Other structure is identical with the power inverter shown in Fig. 1.
In the power inverter shown in Fig. 6, semiconductor device 3 is used wide bandgap semiconductor (wide bandgap semiconductor).As wide bandgap semiconductor, can exemplify carborundum (SiC) and gallium nitride (GaN).By using wide bandgap semiconductor at semiconductor device 3, can suppress the power loss at semiconductor device 3 places, can suppress heat dissipation capacity.Therefore, can heat-dissipating structure be formed to simple structure as heating panel 12, can suppress cost.And, the size that can dwindle electric component case 9.
And the power inverter shown in Fig. 6 possesses housing material 10, therefore, identical with execution mode 3, can prevent that dust, insect etc. are attached to the conducting parts of electronic printing substrate 2 and power inverter is broken down.Therefore, can improve the reliability of power inverter.
In addition, in the present embodiment, the mode of the semiconductor device 3 application wide bandgap semiconductors that the power inverter shown in Fig. 6 is possessed is illustrated, but is not limited thereto, and in the power inverter shown in Fig. 1, Fig. 3 and Fig. 5, also can apply wide bandgap semiconductor.When in the situation that apply wide bandgap semiconductor in the power inverter shown in Fig. 1, Fig. 3 and Fig. 5, also can suppress power loss, can suppress heat dissipation capacity.
In industry, utilize possibility
As mentioned above, the related power inverter of the utility model causes in electric equipment products that the configuration of parts is restricted in the heating because of semiconductor device to be useful, to be especially applicable to refrigerator.
Claims (7)
1. a power inverter, this power inverter is taken in the one or more semiconductor device that are arranged on electronic printing substrate in electric component case,
Described power inverter is characterised in that,
Described power inverter forms following structure:
Described power inverter possesses heat pipe, and this heat pipe possesses the heated parts arranging with described contact of semiconductor device, the radiating part that contacts the heat-conducting part arranging with this heated parts and contact setting with this heat-conducting part,
The radiating surface of described radiating part configures along the gabarit of electric component case,
Described radiating part is disposed at the position higher than described heated parts,
Cold-producing medium in described heat pipe is by gravity and temperature gradient and spontaneously circulation.
2. a power inverter, this power inverter is taken in the one or more semiconductor device that are arranged on electronic printing substrate in being the electric component case of curved shape,
Described power inverter is characterised in that,
Described power inverter forms following structure:
Described power inverter possesses heat pipe, and this heat pipe possesses the heated parts arranging with described contact of semiconductor device, the radiating part that contacts the heat-conducting part of the flexure type arranging with this heated parts and contact setting with this heat-conducting part,
The radiating surface of described radiating part configures along face gabarit and described heated parts different directions of electric component case,
Described radiating part is disposed at the position higher than described heated parts,
Cold-producing medium in described heat pipe is by gravity and temperature gradient and spontaneously circulation.
3. power inverter according to claim 1 and 2, is characterized in that,
Described semiconductor device and described electronic printing substrate are covered by housing material, and this housing material is formed by the resin of insulating properties and flame retardancy.
4. power inverter according to claim 1 and 2, is characterized in that,
The semiconductor element that forms described semiconductor device is wide bandgap semiconductor.
5. power inverter according to claim 1 and 2, is characterized in that,
The radiating surface of described radiating part forms the smooth structure without concavo-convex processing.
6. a refrigerator, is characterized in that,
This refrigerator comprises the power inverter described in claim 1 or 2 in inside,
Described radiating part is along the gabarit configuration of device.
7. a power inverter, this power inverter is taken in the one or more semiconductor device that are arranged on electronic printing substrate in electric component case,
Described power inverter is characterised in that,
Described power inverter possesses heating panel, and this heating panel has the heated parts with described contact of semiconductor device, and has radiating part at the back side of this heated parts,
Described semiconductor device and described electronic printing substrate are covered by housing material, and this housing material is formed by the resin of insulating properties and flame retardancy,
Described semiconductor device consists of wide bandgap semiconductor.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012284951A JP5773976B2 (en) | 2012-12-27 | 2012-12-27 | refrigerator |
| JP2012-284951 | 2012-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203554260U true CN203554260U (en) | 2014-04-16 |
Family
ID=50472321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320638948.0U Expired - Fee Related CN203554260U (en) | 2012-12-27 | 2013-10-16 | An electric power conversion device and a refrigerator |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP5773976B2 (en) |
| CN (1) | CN203554260U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104729182A (en) * | 2015-02-03 | 2015-06-24 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6211293A (en) * | 1985-07-09 | 1987-01-20 | 株式会社日立製作所 | Sealing of electronic circuit board |
| JPH0560455A (en) * | 1991-08-29 | 1993-03-09 | Toshiba Corp | Refrigerator |
| JPH0579779A (en) * | 1991-09-19 | 1993-03-30 | Furukawa Electric Co Ltd:The | Heat pipe type cooler |
| JP3504052B2 (en) * | 1996-02-14 | 2004-03-08 | 株式会社日立製作所 | Power converter for electric vehicles |
| JPH1079460A (en) * | 1996-09-05 | 1998-03-24 | Toshiba Transport Eng Kk | Semiconductor control apparatus for vehicles |
| JPH11330758A (en) * | 1998-05-13 | 1999-11-30 | Fujikura Ltd | Cooling device for card for outside installation communication equipment |
| JP2000234767A (en) * | 1999-02-10 | 2000-08-29 | Mitsubishi Electric Corp | Cooling device and cooling device of air-conditioner |
| JP3704250B2 (en) * | 1999-04-05 | 2005-10-12 | 三菱電機株式会社 | refrigerator |
| JP2001289549A (en) * | 2000-04-05 | 2001-10-19 | Hitachi Ltd | Refrigerator control device |
| JP2009024921A (en) * | 2007-07-19 | 2009-02-05 | Hitachi Appliances Inc | Refrigerator |
| JP2009111310A (en) * | 2007-11-01 | 2009-05-21 | Fanuc Ltd | Heat radiation structure of electronic device |
| JP5523454B2 (en) * | 2009-06-08 | 2014-06-18 | パナソニック株式会社 | Manufacturing method of electronic component mounting structure |
| JP2011258761A (en) * | 2010-06-09 | 2011-12-22 | Mitsubishi Electric Corp | Heat radiating structure of electronic apparatus and on-vehicle electronic apparatus |
| JP2012221969A (en) * | 2011-04-04 | 2012-11-12 | Panasonic Corp | Electronic circuit device for compressor |
-
2012
- 2012-12-27 JP JP2012284951A patent/JP5773976B2/en not_active Expired - Fee Related
-
2013
- 2013-10-16 CN CN201320638948.0U patent/CN203554260U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104729182A (en) * | 2015-02-03 | 2015-06-24 | 青岛海尔股份有限公司 | Semiconductor refrigeration refrigerator |
| CN104729182B (en) * | 2015-02-03 | 2016-11-23 | 青岛海尔股份有限公司 | Semiconductor freezer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5773976B2 (en) | 2015-09-02 |
| JP2014127647A (en) | 2014-07-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140416 Termination date: 20211016 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |