CN219372660U

CN219372660U - High temperature resistant multilayer circuit board

Info

Publication number: CN219372660U
Application number: CN202223441803.XU
Authority: CN
Inventors: 戴伟峰
Original assignee: Quanzhou Litaisen Electronic Technology Co ltd
Current assignee: Quanzhou Litaisen Electronic Technology Co ltd
Priority date: 2022-12-22
Filing date: 2022-12-22
Publication date: 2023-07-18
Anticipated expiration: 2032-12-22

Abstract

The utility model discloses a high-temperature-resistant multilayer circuit board, wherein supporting plates are symmetrically and fixedly connected to the two sides of the top of a fixed base, a high-temperature-resistant Wen Xianlu plate is fixedly connected to the inner side of each supporting plate, a heat-conducting soft pad is adaptively connected to the bottom of each high-temperature-resistant circuit board, a heat-dissipating copper plate is fixedly connected to the bottom of each heat-conducting soft pad, a heat-dissipating fin is fixedly connected to the bottom of each heat-dissipating copper plate, a liquid containing box is fixedly connected to one side of each supporting plate, and the first heat-dissipating copper plate penetrates through the second supporting plate and the liquid containing box and is fixedly connected with the bottom and the top of each liquid containing box.

Description

High temperature resistant multilayer circuit board

Technical Field

The utility model relates to the technical field of multilayer circuit boards, in particular to a high-temperature-resistant multilayer circuit board.

Background

The circuit board is also called a circuit board, is mainly used on electronic components and has a very strong conductive function, and because long-time conduction tends to generate very high heat, especially on some electronic products with relatively large power, the high temperature resistance is a relatively important factor at this time, and a radiator and a heat conducting plate can be adopted to realize high temperature resistance.

Disclosure of Invention

In order to overcome the technical problems, the utility model aims to provide a high-temperature-resistant multilayer circuit board.

The aim of the utility model can be achieved by the following technical scheme:

the utility model provides a high temperature resistant multilayer circuit board, includes unable adjustment base, unable adjustment base's top bilateral symmetry fixedly connected with backup pad one and backup pad two, the inlet port has been seted up on the surface of backup pad one, one side of backup pad one is connected with the case of airing, fixedly connected with driving motor in the middle of the bottom of the case of airing, driving motor's output fixedly connected with radiator fan, the inboard fixedly connected with of backup pad one and backup pad two is high Wen Xianlu board one, high temperature resistant circuit board one's bottom adaptation is connected with heat conduction cushion one, heat conduction cushion one's bottom fixedly connected with heat dissipation copper one, heat dissipation copper one's bottom fixedly connected with fin, high temperature resistant circuit board one end's side fixedly connected with connecting piece, the connecting piece welding has the connecting wire, one side fixedly connected with liquid containing box of backup pad two, the inside of liquid containing box is provided with the coolant liquid, one passes backup pad two and liquid containing box and bottom and the top fixedly connected with of liquid containing box, one fixedly connected with sealing washer, sealing washer one side and backup pad two, sealing washer fixedly connected with sealing washer.

As a further scheme of the utility model: threaded holes are symmetrically formed in two sides of the ventilation box, threaded nails are connected with the threaded holes in a threaded mode, and the ventilation box is fixedly connected with the support plate through the threaded nails.

As a further scheme of the utility model: the heat-conducting circuit board is characterized in that the inner sides of the first support plate and the second support plate are fixedly connected with a second high-temperature-resistant Wen Xianlu plate, the top of the second high-temperature-resistant circuit board is adaptively connected with a second heat-conducting cushion, the top of the second heat-conducting cushion is fixedly connected with a second heat-radiating copper plate, and the top of the second heat-radiating copper plate is fixedly connected with a heat radiating fin.

As a further scheme of the utility model: the first heat-dissipation copper plate is fixedly connected with the second heat-dissipation copper plate through a heat-dissipation fin.

As a further scheme of the utility model: the side face of the second end of the high-temperature-resistant circuit board is fixedly provided with a connecting piece, and the connecting piece is welded with a connecting wire.

As a further scheme of the utility model: the second heat dissipation copper plate penetrates through the second support plate and the liquid storage box to be fixedly connected with the bottom and the top of the liquid storage box, and the second heat dissipation copper plate is fixedly connected with a sealing gasket.

As a further scheme of the utility model: the radiating fins are arranged in an equidistant linear mode, and the number of the radiating fins is not less than eight.

The utility model has the beneficial effects that: according to the utility model, the air exchange box is fixed on one side of the first supporting plate through the screw nails, so that the fixing effect is achieved, then the driving motor is electrified, the cooling fan rotates, so that the air flow is conveyed to pass through the fan heat piece, and the cooling effect is achieved.

Drawings

The utility model is further described below with reference to the accompanying drawings.

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a schematic top view of the high Wen Xianlu resistant panel I and liquid container of the present utility model;

FIG. 3 is a schematic illustration of the connection of the first high Wen Xianlu resistant plate and the first thermally conductive pad of the present utility model;

fig. 4 is a schematic view showing the connection structure of the gasket, the seal ring and the liquid storage box of the present utility model.

In the figure: 1. a fixed base; 2. a first supporting plate; 201. an air inlet hole; 3. a second supporting plate; 4. an air change box; 5. a threaded hole; 6. a screw thread nail; 7. a driving motor; 701. a heat radiation fan; 8. a first high-temperature-resistant circuit board; 801. a second high-temperature-resistant circuit board; 9. a first heat conducting soft pad; 901. a second heat conducting soft pad; 10. a first heat dissipation copper plate; 101. a second heat dissipation copper plate; 11. a heat sink; 12. a connecting piece; 13. a connecting wire; 14. a liquid storage box; 15. a cooling liquid; 16. a sealing gasket; 17. and (3) sealing rings.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 4, a high temperature resistant multilayer circuit board comprises a fixed base 1, a first support plate 2 and a second support plate 3 are symmetrically and fixedly connected to the two sides of the top of the fixed base 1, an air inlet 201 is formed in the surface of the first support plate 2, one side of the first support plate 2 is connected with an air ventilation box 4, a driving motor 7 is fixedly connected to the middle of the bottom of the air ventilation box 4, an output end of the driving motor 7 is fixedly connected with a cooling fan 701, the inner sides of the first support plate 2 and the second support plate 3 are fixedly connected with a first high Wen Xianlu plate 8, the bottom of the first high temperature resistant circuit board 8 is connected with a first heat conducting cushion 9 in an adapting manner, the bottom of the first heat conducting cushion 9 is fixedly connected with a first heat dissipating copper plate 10, the bottom of the first heat dissipating copper plate 10 is fixedly connected with a heat dissipating fin 11, the heat dissipating fin 11 is in an equidistant linear arrangement, the number of the heat dissipating fin 11 is not less than eight, a connecting piece 12 is fixedly arranged on one side of one end of the first high temperature resistant circuit board 8, the connecting piece 12 is welded with a connecting wire 13, one side of the second support plate 3 is fixedly connected with a cooling liquid storage box 14, the inside the liquid storage box 14, a cooling liquid 15 is fixedly connected with the second side of the liquid storage box 14, the first heat dissipating box 10 passes through the first heat dissipating cushion 10 and the first heat dissipating plate 16 is fixedly connected with the first heat dissipating copper plate 16, the first heat dissipating plate 16 and the heat dissipating plate 16 is fixedly connected with the sealing pad 16, and the first heat dissipating plate 16 is fixedly connected with the heat dissipating pad 16, and the heat is fixedly connected with the heat conducting pad 16, and the heat is sealed to the heat pad, and the heat is sealed.

The screw hole 5 has been seted up to the bilateral symmetry of ventilation box 4 to screw hole 5 threaded connection has screw nail 6, and ventilation box 4 passes through screw nail 6 and backup pad 2 fixed connection, thereby reach the effect of fixed ventilation box 4, and the inboard fixedly connected with high Wen Xianlu board two 801 of backup pad 2 and backup pad two 3, and the top adaptation of high temperature resistant circuit board two 801 is connected with heat conduction cushion two 901, and the top fixedly connected with heat dissipation copper two 101 of heat conduction cushion two 901, and the top fixedly connected with fin 11 of heat dissipation copper two 101, thereby reach better radiating effect, and can not harm the electronic component on the high temperature resistant circuit board two 801, and heat dissipation copper one 10 passes through fin 11 and heat dissipation copper two 101 fixed connection, thereby improve its heat dissipation ability, and the side fixed mounting of high temperature resistant circuit board two 801 one end has connecting piece 12, and heat dissipation copper two 101 pass backup pad two 3 and liquid containing box 14 and the bottom and top fixed connection of liquid containing box 14, and heat dissipation copper two 101 fixed connection have sealed pad 16, and one side of sealed pad 16 and backup pad two 3 fixed connection, and heat dissipation copper 16 are sealed at the same time with heat dissipation copper 15, thereby the high temperature resistant circuit board 8 is guaranteed to be overflowed at the sealed circuit board 8.

The working principle of the utility model is as follows: after the fixing base 1 is installed at a position to be installed, the air exchange box 4 is fixed on one side of the first supporting plate 2 through the screw nails 6, then the driving motor 7 is electrified, so that the cooling fan 701 rotates, when the first high-temperature-resistant circuit board 8 and the second high-temperature-resistant circuit board 801 are operated, heat can be generated, the heat can be transmitted to the first heat-radiating copper plate 10 and the second heat-radiating copper plate 101 through the first heat-conducting soft cushion 9 and the second heat-conducting soft cushion 901, one end of the first heat-radiating copper plate 10 and the second heat-radiating copper plate 101 are connected with the liquid storage box 14, the heat can be transmitted to the inside of the liquid storage box 14, and finally the heat can be dissipated and rapidly reduced under the action of the cooling liquid 15 due to the cooling liquid 15, and the sealing gasket 16 and the sealing ring 17 are arranged at the joint of the liquid storage box 14 and the first heat-radiating copper plate 10 and the second heat-radiating copper plate 101.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.

Claims

1. The utility model provides a high temperature resistant multilayer circuit board, includes unable adjustment base (1), its characterized in that, the top bilateral symmetry fixedly connected with backup pad one (2) and backup pad two (3) of unable adjustment base (1), inlet port (201) have been seted up on the surface of backup pad one (2), one side of backup pad one (2) is connected with ventilation box (4), fixedly connected with driving motor (7) in the middle of the bottom of ventilation box (4), the output fixedly connected with radiator fan (701) of driving motor (7), the inboard fixedly connected with high Wen Xianlu board one (8) of backup pad one (2) and backup pad two (3), the bottom adaptation of high temperature resistant circuit board one (8) is connected with heat conduction cushion one (9), the bottom fixedly connected with heat dissipation copper one (10) of heat conduction cushion one (9), the bottom fixedly connected with piece (11) of heat dissipation copper one (10), side fixedly installed on one end of high temperature resistant circuit board one (8) has connecting piece (12), connecting piece (13) have connecting wire, the inside of backup pad two (3) is fixedly connected with high Wen Xianlu board one side (14) is accomodates liquid (14), the first heat dissipation copper plate (10) penetrates through the second support plate (3) and the liquid storage box (14) to be fixedly connected with the bottom and the top of the liquid storage box (14), the first heat dissipation copper plate (10) is fixedly connected with a sealing gasket (16), one side of the sealing gasket (16) is fixedly connected with the second support plate (3), and the other side of the sealing gasket (16) is fixedly connected with a sealing ring (17).

2. The high-temperature-resistant multilayer circuit board according to claim 1, wherein threaded holes (5) are symmetrically formed in two sides of the ventilation box (4), the threaded holes (5) are in threaded connection with threaded nails (6), and the ventilation box (4) is fixedly connected with the first support plate (2) through the threaded nails (6).

3. The high-temperature-resistant multilayer circuit board according to claim 1, wherein the inner sides of the first supporting plate (2) and the second supporting plate (3) are fixedly connected with a second high-temperature-resistant Wen Xianlu plate (801), the top of the second high-temperature-resistant circuit board (801) is adaptively connected with a second heat-conducting soft pad (901), the top of the second heat-conducting soft pad (901) is fixedly connected with a second heat-dissipating copper plate (101), and the top of the second heat-dissipating copper plate (101) is fixedly connected with a heat sink (11).

4. The high-temperature-resistant multilayer circuit board according to claim 1, wherein the first heat-dissipating copper plate (10) is fixedly connected with the second heat-dissipating copper plate (101) through a heat-dissipating fin (11).

5. A high temperature resistant multilayer circuit board according to claim 3, wherein a connecting member (12) is fixedly installed on a side surface of one end of the second high temperature resistant circuit board (801).

6. A high temperature resistant multilayer circuit board according to claim 3, wherein the second heat dissipating copper plate (101) is fixedly connected to the bottom and the top of the liquid storage box (14) through the second support plate (3) and the liquid storage box (14), and the second heat dissipating copper plate (101) is fixedly connected with a sealing gasket (16).

7. The high temperature resistant multilayer circuit board according to claim 1, wherein the heat radiating fins (11) are arranged linearly at equal distances, and the number of the heat radiating fins (11) is not less than eight.