CN107969082A - The vacuum degree of portable electronic devices - Google Patents

The vacuum degree of portable electronic devices Download PDF

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Publication number
CN107969082A
CN107969082A CN201610915110.XA CN201610915110A CN107969082A CN 107969082 A CN107969082 A CN 107969082A CN 201610915110 A CN201610915110 A CN 201610915110A CN 107969082 A CN107969082 A CN 107969082A
Authority
CN
China
Prior art keywords
component
electronic devices
portable electronic
rear shell
front housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610915110.XA
Other languages
Chinese (zh)
Inventor
杨翔宇
唐霖剑
陈宥嘉
周进义
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Weishi New Material Technology Co.,Ltd.
Original Assignee
Dongguan Jazz Advanced Electronic Application Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongguan Jazz Advanced Electronic Application Material Co Ltd filed Critical Dongguan Jazz Advanced Electronic Application Material Co Ltd
Priority to CN201610915110.XA priority Critical patent/CN107969082A/en
Publication of CN107969082A publication Critical patent/CN107969082A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Telephone Set Structure (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

A kind of vacuum degree of portable electronic devices, including:One is suitable for the front housing and rear shell of portable electronic devices, and front housing is corresponding with rear shell is combined into a component, it is characterised in that:To be evacuated after sintering or patch material closing on the front housing and rear shell of component, the vacuum area at least provided with a closed is formed;And there is thermal insulation in this vacuum area, a vacuum degree is formed, so that front housing is corresponding with rear shell to form an insulation system.Avoid portable electronic devices after prolonged use, housing scald user is passed through since electronic building brick heat source (such as chip, battery) distributes heat.

Description

The vacuum degree of portable electronic devices
Technical field
The present invention is in relation to a kind of vacuum degree of portable electronic devices, it is applied to vacuum degree can Carrying electronic devices, realize portable electronic devices and heat-insulated avoid what electronic building brick heat source (such as chip, battery) was distributed Heat passes through housing scald user.
Background technology
, after via long-time use, are then locally there is superheating phenomenon, this is existing in presently commercially available portable electronic devices As not only causing consumer's sense of touch temperature excessive or even scalding user.
Secondary person, since the appearance and modeling of current portable electronic devices requires thickness excessively thin, space to be preserved is not to biography Thermal convection current (obtaining convection current using fan) in system heat transfer method, so just only remaining heat transfer and heat radiation two ways can It is employed, presently commercially available portable electronic devices are to utilize to attach near heating sources mostly, such as the high heat conduction such as graphite flake, copper foil Material is to reach radiating and cooling purpose, from the point of view of the brand large-screen mobile phone such as commercially available Meizu, millet, Huawei, has no significantly heat dissipation drop Temp effect, local temperature is still high, which not only causes consumer's sense of touch temperature excessive or even scald user, consumer It is in use to have complaint more.Therefore the present inventor in view of problem points are above taken off, conceives a kind of vacuum heat-insulation of portable electronic devices Structure, for the problem of the invention to be solved.
The content of the invention
To solve the electronic building brick heat source (such as chip, battery) of portable electronic devices, caused heat is worn at work More housing scald user, avoids the problem that causing housing hot-spot, the present invention provides a kind of vacuum of portable electronic devices Heat insulation structural, improves the bad usage experience of consumer.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of vacuum degree of portable electronic devices, including:One be suitable for portable electronic devices front housing and Rear shell, and the front housing is corresponding with the rear shell is combined into a component, it is characterised in that:With sintering on the front housing and rear shell of the component Or be evacuated after patch material closing, form the vacuum area at least provided with a closed;And in the vacuum area With thermal insulation, a vacuum degree is formed, so that the front housing is corresponding with the rear shell to form an insulation system.
According to before taking off feature, a circuit board is equipped with the component, at least provided with a chip and shielding case on the circuit board, The shielding case covers the chip, and the cover of the shielding case contacts the side that the component is located at the vacuum area.
According to feature is before taken off, a battery is equipped with the component, which is located at the side of the vacuum area.
According to before taking off feature, which is set as two, and respectively positioned at the front housing and rear shell of the component and corresponding In parallel.
According to before taking off feature, be equipped with a circuit board in the component, chip and shielding of the circuit board equipped with two mirrors Cover, respectively the shielding case covers the respectively chip respectively, and respectively the cover of the shielding case contacts front housing in the component, rear shell simultaneously respectively Positioned at the both sides of the vacuum area.
According to feature is before taken off, a battery is equipped with the component, which contacts front housing, rear shell and position in the component respectively In the both sides of the vacuum area.
According to before taking off feature, which can set positioned at the front of the front housing and any of which position below;And should Vacuum area can also set any of which position behind the front of the rear shell.
According to feature is before taken off, a liquid crystal screen and contact panel are further included, it is sequentially fixed on the assembly.
By above taking off technological means, the heat that heat source produced by the present invention solves portable electronic devices distributes, via true Empty soaking heat insulation structural, the problem of will not causing housing hot-spot, solve the electronic building brick heat source (examples of portable electronic devices Such as chip, battery) at work caused heat pass through housing scald user, allow consumer to have more preferable man-machine experience.
The invention has the advantages that improve the bad usage experience of consumer.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the schematic diagram of the embodiment of the present invention.
Fig. 2 is the schematic diagram of the another possible embodiments of the present invention.
Fig. 3 is the schematic diagram of another possible embodiments of the present invention.
Figure label explanation:
10 portable electronic devices
11 components
111 front housings
112 rear shells
12 circuit boards
121 chips
122 shielding cases
13 batteries
14 liquid crystal screens
15 contact panels
20 vacuum degrees
21 vacuum areas
30 insulation systems
Embodiment
First, please refer to Fig.1~Fig. 3 shown in, a kind of vacuum degree of portable electronic devices of the present invention it is preferable Embodiment includes:One is suitable for the front housing 111 and rear shell 112 of portable electronic devices 10, and the front housing 111 and the rear shell 112 It is corresponding to be combined into a component 11, it is characterised in that:With sintering or patch material on the front housing 111 and rear shell 112 of the component 11 It is evacuated after closing, forms the vacuum area 21 at least provided with a closed;And have in the vacuum area 21 every It is hot, a vacuum degree 20 is formed, so that the front housing 111 is corresponding with the rear shell 112 to form an insulation system 30, this reality Apply in example, as shown in Figure 1, the vacuum area 21 can be located at the front housing 111 of the component 11;Further, which can set Front setting in the front housing 111 of the component and below any of which position.
Or as shown in Fig. 2, in another possible embodiments, which can set the rear shell 112 positioned at the component 11; Further, which is located at the front and any of which position below of the rear shell 112 of the component 11.Consequently, it is possible to should Front housing 111 and the rear shell 112 are two differences and independent individual, make the vacuum degree 20 may be provided in the front housing 111 or The rear shell 112, but it is not limited to this.
Hold, be equipped with a circuit board 12 in the component 11, at least provided with a chip 121 and shielding case on the circuit board 12 122, which covers the chip 121, and the cover of the shielding case 122 is contacted in the component 11 has the vacuum area A battery 13 is equipped with 21 side, and the component 11, the battery 13 is in the side with the vacuum area 21, in other words, The front or back of the 121 top face front housing of chip (middle plate) 111;In the front or back of rear shell 112, with sintering or attach It is evacuated, is thermally shielded in this vacuum area 21, but be not limited to this after material closing.
Again as shown in figure 3, in another possible embodiments, which is set as two, and is located at the component respectively 11 front housing 111 and rear shell 112 and corresponding in parallel;Further, the vacuum area 21 be located at the front housing 111 front and after Face any of which position;And the vacuum area 21 can be set positioned at the front of the rear shell 112 and any of which position below;So One, the front housing 111 and the rear shell 112 are two differences and independent individual, the vacuum degree 20 is respectively provided at The front housing 111 and the rear shell 112, but it is not limited to this.
Hold, be equipped with a circuit board 12 in the component 11, which is equipped with the chip 121 of two mirrors and shields Cover 122, respectively the shielding case 122 covers the respectively chip 121 respectively, and respectively the cover of the shielding case 122 contacts the component 11 respectively A battery 13, the battery 13 are equipped with interior front housing 111, rear shell 112 and the both sides with the vacuum area 21, and the component 11 Front housing 111, rear shell 112 and the both sides with the vacuum area 21 in the component 11 are contacted respectively, in other words, in the chip The front of 121 top face front housings (middle plate) 111 and reverse side;In the front of rear shell 112 and reverse side, sealed with sintering or attaching material It is evacuated, is thermally shielded in this vacuum area 21, but be not limited to this after closing.In addition, further include a liquid crystal screen 14 and touch Panel 15 is controlled, it is sequentially fixed on the component 11.
Based on above-mentioned composition, vacuum degree 20 of the invention, its by the chip 121 in the component 11 caused by Heat source carries out vacuum heat-insulation, is avoided that the contact panel 15 and rear shell 112 form local heat source, and electronics dress can be carried by also solving this The heat for putting 10 chip 121 caused main heating source at work passes through housing scald user, allows consumer to have more preferable people Body is tested.
The above described is only a preferred embodiment of the present invention, not make limitation in any form to the present invention, it is all It is any simple modification, equivalent change and modification made according to the technical spirit of the present invention to above example, still falls within In the range of technical solution of the present invention.
In conclusion the present invention in structure design, using in practicality and cost benefit, complying fully with industry development institute Need, and revealed structure is also to have unprecedented innovative structure, has novelty, creativeness, practicality, meets related The regulation of patent of invention important document, therefore lift application in accordance with the law.

Claims (9)

1. a kind of vacuum degree of portable electronic devices, including:One be suitable for portable electronic devices front housing and after Shell, and the front housing is corresponding with the rear shell is combined into a component, it is characterised in that:
To be evacuated after sintering or patch material closing on the front housing and rear shell of the component, formed at least provided with a closing The vacuum area of shape;And there is thermal insulation in the vacuum area, a vacuum degree is formed, so that the front housing and the rear shell One insulation system of corresponding formation.
2. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that set in the component There is a circuit board, at least provided with a chip and shielding case on the circuit board, which covers the chip, and the shielding case Cover contacts the side that the component is located at the vacuum area.
3. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that set in the component There is a battery, battery is located at the side of the vacuum area.
4. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that the vacuum area It is set as two, and respectively positioned at the front housing and rear shell of the component and corresponding in parallel.
5. the vacuum degree of portable electronic devices according to claim 4, it is characterised in that set in the component There is a circuit board, which is equipped with the chip and shielding case of two mirrors, and respectively the shielding case covers the respectively chip respectively, and Respectively the cover of the shielding case contacts front housing, rear shell and the both sides for being located at the vacuum area in the component respectively.
6. the vacuum degree of portable electronic devices according to claim 4, it is characterised in that set in the component There is a battery, which contacts front housing, rear shell and the both sides for being located at the vacuum area in the component respectively.
7. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that the vacuum area Any of which position positioned at the front of the front housing of the component and below.
8. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that the vacuum area Any of which position positioned at the front of the rear shell of the component and below.
9. the vacuum degree of portable electronic devices according to any one of claim 1 to 8, it is characterised in that A liquid crystal screen and contact panel are further included, it is sequentially fixed on the assembly.
CN201610915110.XA 2016-10-20 2016-10-20 The vacuum degree of portable electronic devices Pending CN107969082A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610915110.XA CN107969082A (en) 2016-10-20 2016-10-20 The vacuum degree of portable electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610915110.XA CN107969082A (en) 2016-10-20 2016-10-20 The vacuum degree of portable electronic devices

Publications (1)

Publication Number Publication Date
CN107969082A true CN107969082A (en) 2018-04-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023036020A1 (en) * 2021-09-10 2023-03-16 荣耀终端有限公司 Electronic device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090279260A1 (en) * 2008-02-29 2009-11-12 Xing En Yu Suspension device for a superconducting magnet heat shield enclosure
CN203689249U (en) * 2013-12-20 2014-07-02 联想(北京)有限公司 Notebook computer host casing and notebook computer
CN204681713U (en) * 2015-06-15 2015-09-30 乐清罗克韦尔自动化有限公司 A kind of boundary switch controller
US20150289414A1 (en) * 2014-04-03 2015-10-08 Bae Systems Information And Electronic Systems Integration Inc. Method and apparatus for cooling electonic components
CN205040132U (en) * 2015-08-11 2016-02-17 奇鋐科技股份有限公司 Thermal -insulated structure of hand -held device and hand -held device that has thermal -insulated structure
CN205071567U (en) * 2015-08-13 2016-03-02 东莞钱锋特殊胶粘制品有限公司 Heat dissipation buffering conductive composite forming structure of mobile electronic device
CN206136510U (en) * 2016-10-20 2017-04-26 东莞爵士先进电子应用材料有限公司 Portability electron device's vacuum separates hot junction and constructs

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090279260A1 (en) * 2008-02-29 2009-11-12 Xing En Yu Suspension device for a superconducting magnet heat shield enclosure
CN203689249U (en) * 2013-12-20 2014-07-02 联想(北京)有限公司 Notebook computer host casing and notebook computer
US20150289414A1 (en) * 2014-04-03 2015-10-08 Bae Systems Information And Electronic Systems Integration Inc. Method and apparatus for cooling electonic components
CN204681713U (en) * 2015-06-15 2015-09-30 乐清罗克韦尔自动化有限公司 A kind of boundary switch controller
CN205040132U (en) * 2015-08-11 2016-02-17 奇鋐科技股份有限公司 Thermal -insulated structure of hand -held device and hand -held device that has thermal -insulated structure
CN205071567U (en) * 2015-08-13 2016-03-02 东莞钱锋特殊胶粘制品有限公司 Heat dissipation buffering conductive composite forming structure of mobile electronic device
CN206136510U (en) * 2016-10-20 2017-04-26 东莞爵士先进电子应用材料有限公司 Portability electron device's vacuum separates hot junction and constructs

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023036020A1 (en) * 2021-09-10 2023-03-16 荣耀终端有限公司 Electronic device

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Effective date of registration: 20210421

Address after: 703, block B, Changxing building, 4002 Huaqiang North Road, Yuanling street, Futian District, Shenzhen, Guangdong 518000

Applicant after: Shenzhen Weishi New Material Technology Co.,Ltd.

Address before: Liaobu Town, Guangdong city of Dongguan province 523421 Liu Wu Xiang Village Fulailu No. 51

Applicant before: DONGGUAN JAZZ ADVANCED ELECTRONIC APPLICATION MATERIALS Co.,Ltd.

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180427