CN107969082A - The vacuum degree of portable electronic devices - Google Patents
The vacuum degree of portable electronic devices Download PDFInfo
- Publication number
- CN107969082A CN107969082A CN201610915110.XA CN201610915110A CN107969082A CN 107969082 A CN107969082 A CN 107969082A CN 201610915110 A CN201610915110 A CN 201610915110A CN 107969082 A CN107969082 A CN 107969082A
- Authority
- CN
- China
- Prior art keywords
- component
- electronic devices
- portable electronic
- rear shell
- front housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0213—Venting apertures; Constructional details thereof
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
A kind of vacuum degree of portable electronic devices, including:One is suitable for the front housing and rear shell of portable electronic devices, and front housing is corresponding with rear shell is combined into a component, it is characterised in that:To be evacuated after sintering or patch material closing on the front housing and rear shell of component, the vacuum area at least provided with a closed is formed;And there is thermal insulation in this vacuum area, a vacuum degree is formed, so that front housing is corresponding with rear shell to form an insulation system.Avoid portable electronic devices after prolonged use, housing scald user is passed through since electronic building brick heat source (such as chip, battery) distributes heat.
Description
Technical field
The present invention is in relation to a kind of vacuum degree of portable electronic devices, it is applied to vacuum degree can
Carrying electronic devices, realize portable electronic devices and heat-insulated avoid what electronic building brick heat source (such as chip, battery) was distributed
Heat passes through housing scald user.
Background technology
, after via long-time use, are then locally there is superheating phenomenon, this is existing in presently commercially available portable electronic devices
As not only causing consumer's sense of touch temperature excessive or even scalding user.
Secondary person, since the appearance and modeling of current portable electronic devices requires thickness excessively thin, space to be preserved is not to biography
Thermal convection current (obtaining convection current using fan) in system heat transfer method, so just only remaining heat transfer and heat radiation two ways can
It is employed, presently commercially available portable electronic devices are to utilize to attach near heating sources mostly, such as the high heat conduction such as graphite flake, copper foil
Material is to reach radiating and cooling purpose, from the point of view of the brand large-screen mobile phone such as commercially available Meizu, millet, Huawei, has no significantly heat dissipation drop
Temp effect, local temperature is still high, which not only causes consumer's sense of touch temperature excessive or even scald user, consumer
It is in use to have complaint more.Therefore the present inventor in view of problem points are above taken off, conceives a kind of vacuum heat-insulation of portable electronic devices
Structure, for the problem of the invention to be solved.
The content of the invention
To solve the electronic building brick heat source (such as chip, battery) of portable electronic devices, caused heat is worn at work
More housing scald user, avoids the problem that causing housing hot-spot, the present invention provides a kind of vacuum of portable electronic devices
Heat insulation structural, improves the bad usage experience of consumer.
The technical solution adopted by the present invention to solve the technical problems is:
A kind of vacuum degree of portable electronic devices, including:One be suitable for portable electronic devices front housing and
Rear shell, and the front housing is corresponding with the rear shell is combined into a component, it is characterised in that:With sintering on the front housing and rear shell of the component
Or be evacuated after patch material closing, form the vacuum area at least provided with a closed;And in the vacuum area
With thermal insulation, a vacuum degree is formed, so that the front housing is corresponding with the rear shell to form an insulation system.
According to before taking off feature, a circuit board is equipped with the component, at least provided with a chip and shielding case on the circuit board,
The shielding case covers the chip, and the cover of the shielding case contacts the side that the component is located at the vacuum area.
According to feature is before taken off, a battery is equipped with the component, which is located at the side of the vacuum area.
According to before taking off feature, which is set as two, and respectively positioned at the front housing and rear shell of the component and corresponding
In parallel.
According to before taking off feature, be equipped with a circuit board in the component, chip and shielding of the circuit board equipped with two mirrors
Cover, respectively the shielding case covers the respectively chip respectively, and respectively the cover of the shielding case contacts front housing in the component, rear shell simultaneously respectively
Positioned at the both sides of the vacuum area.
According to feature is before taken off, a battery is equipped with the component, which contacts front housing, rear shell and position in the component respectively
In the both sides of the vacuum area.
According to before taking off feature, which can set positioned at the front of the front housing and any of which position below;And should
Vacuum area can also set any of which position behind the front of the rear shell.
According to feature is before taken off, a liquid crystal screen and contact panel are further included, it is sequentially fixed on the assembly.
By above taking off technological means, the heat that heat source produced by the present invention solves portable electronic devices distributes, via true
Empty soaking heat insulation structural, the problem of will not causing housing hot-spot, solve the electronic building brick heat source (examples of portable electronic devices
Such as chip, battery) at work caused heat pass through housing scald user, allow consumer to have more preferable man-machine experience.
The invention has the advantages that improve the bad usage experience of consumer.
Brief description of the drawings
The present invention is further described with reference to the accompanying drawings and examples.
Fig. 1 is the schematic diagram of the embodiment of the present invention.
Fig. 2 is the schematic diagram of the another possible embodiments of the present invention.
Fig. 3 is the schematic diagram of another possible embodiments of the present invention.
Figure label explanation:
10 portable electronic devices
11 components
111 front housings
112 rear shells
12 circuit boards
121 chips
122 shielding cases
13 batteries
14 liquid crystal screens
15 contact panels
20 vacuum degrees
21 vacuum areas
30 insulation systems
Embodiment
First, please refer to Fig.1~Fig. 3 shown in, a kind of vacuum degree of portable electronic devices of the present invention it is preferable
Embodiment includes:One is suitable for the front housing 111 and rear shell 112 of portable electronic devices 10, and the front housing 111 and the rear shell 112
It is corresponding to be combined into a component 11, it is characterised in that:With sintering or patch material on the front housing 111 and rear shell 112 of the component 11
It is evacuated after closing, forms the vacuum area 21 at least provided with a closed;And have in the vacuum area 21 every
It is hot, a vacuum degree 20 is formed, so that the front housing 111 is corresponding with the rear shell 112 to form an insulation system 30, this reality
Apply in example, as shown in Figure 1, the vacuum area 21 can be located at the front housing 111 of the component 11;Further, which can set
Front setting in the front housing 111 of the component and below any of which position.
Or as shown in Fig. 2, in another possible embodiments, which can set the rear shell 112 positioned at the component 11;
Further, which is located at the front and any of which position below of the rear shell 112 of the component 11.Consequently, it is possible to should
Front housing 111 and the rear shell 112 are two differences and independent individual, make the vacuum degree 20 may be provided in the front housing 111 or
The rear shell 112, but it is not limited to this.
Hold, be equipped with a circuit board 12 in the component 11, at least provided with a chip 121 and shielding case on the circuit board 12
122, which covers the chip 121, and the cover of the shielding case 122 is contacted in the component 11 has the vacuum area
A battery 13 is equipped with 21 side, and the component 11, the battery 13 is in the side with the vacuum area 21, in other words,
The front or back of the 121 top face front housing of chip (middle plate) 111;In the front or back of rear shell 112, with sintering or attach
It is evacuated, is thermally shielded in this vacuum area 21, but be not limited to this after material closing.
Again as shown in figure 3, in another possible embodiments, which is set as two, and is located at the component respectively
11 front housing 111 and rear shell 112 and corresponding in parallel;Further, the vacuum area 21 be located at the front housing 111 front and after
Face any of which position;And the vacuum area 21 can be set positioned at the front of the rear shell 112 and any of which position below;So
One, the front housing 111 and the rear shell 112 are two differences and independent individual, the vacuum degree 20 is respectively provided at
The front housing 111 and the rear shell 112, but it is not limited to this.
Hold, be equipped with a circuit board 12 in the component 11, which is equipped with the chip 121 of two mirrors and shields
Cover 122, respectively the shielding case 122 covers the respectively chip 121 respectively, and respectively the cover of the shielding case 122 contacts the component 11 respectively
A battery 13, the battery 13 are equipped with interior front housing 111, rear shell 112 and the both sides with the vacuum area 21, and the component 11
Front housing 111, rear shell 112 and the both sides with the vacuum area 21 in the component 11 are contacted respectively, in other words, in the chip
The front of 121 top face front housings (middle plate) 111 and reverse side;In the front of rear shell 112 and reverse side, sealed with sintering or attaching material
It is evacuated, is thermally shielded in this vacuum area 21, but be not limited to this after closing.In addition, further include a liquid crystal screen 14 and touch
Panel 15 is controlled, it is sequentially fixed on the component 11.
Based on above-mentioned composition, vacuum degree 20 of the invention, its by the chip 121 in the component 11 caused by
Heat source carries out vacuum heat-insulation, is avoided that the contact panel 15 and rear shell 112 form local heat source, and electronics dress can be carried by also solving this
The heat for putting 10 chip 121 caused main heating source at work passes through housing scald user, allows consumer to have more preferable people
Body is tested.
The above described is only a preferred embodiment of the present invention, not make limitation in any form to the present invention, it is all
It is any simple modification, equivalent change and modification made according to the technical spirit of the present invention to above example, still falls within
In the range of technical solution of the present invention.
In conclusion the present invention in structure design, using in practicality and cost benefit, complying fully with industry development institute
Need, and revealed structure is also to have unprecedented innovative structure, has novelty, creativeness, practicality, meets related
The regulation of patent of invention important document, therefore lift application in accordance with the law.
Claims (9)
1. a kind of vacuum degree of portable electronic devices, including:One be suitable for portable electronic devices front housing and after
Shell, and the front housing is corresponding with the rear shell is combined into a component, it is characterised in that:
To be evacuated after sintering or patch material closing on the front housing and rear shell of the component, formed at least provided with a closing
The vacuum area of shape;And there is thermal insulation in the vacuum area, a vacuum degree is formed, so that the front housing and the rear shell
One insulation system of corresponding formation.
2. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that set in the component
There is a circuit board, at least provided with a chip and shielding case on the circuit board, which covers the chip, and the shielding case
Cover contacts the side that the component is located at the vacuum area.
3. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that set in the component
There is a battery, battery is located at the side of the vacuum area.
4. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that the vacuum area
It is set as two, and respectively positioned at the front housing and rear shell of the component and corresponding in parallel.
5. the vacuum degree of portable electronic devices according to claim 4, it is characterised in that set in the component
There is a circuit board, which is equipped with the chip and shielding case of two mirrors, and respectively the shielding case covers the respectively chip respectively, and
Respectively the cover of the shielding case contacts front housing, rear shell and the both sides for being located at the vacuum area in the component respectively.
6. the vacuum degree of portable electronic devices according to claim 4, it is characterised in that set in the component
There is a battery, which contacts front housing, rear shell and the both sides for being located at the vacuum area in the component respectively.
7. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that the vacuum area
Any of which position positioned at the front of the front housing of the component and below.
8. the vacuum degree of portable electronic devices according to claim 1, it is characterised in that the vacuum area
Any of which position positioned at the front of the rear shell of the component and below.
9. the vacuum degree of portable electronic devices according to any one of claim 1 to 8, it is characterised in that
A liquid crystal screen and contact panel are further included, it is sequentially fixed on the assembly.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610915110.XA CN107969082A (en) | 2016-10-20 | 2016-10-20 | The vacuum degree of portable electronic devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610915110.XA CN107969082A (en) | 2016-10-20 | 2016-10-20 | The vacuum degree of portable electronic devices |
Publications (1)
Publication Number | Publication Date |
---|---|
CN107969082A true CN107969082A (en) | 2018-04-27 |
Family
ID=61996439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610915110.XA Pending CN107969082A (en) | 2016-10-20 | 2016-10-20 | The vacuum degree of portable electronic devices |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN107969082A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023036020A1 (en) * | 2021-09-10 | 2023-03-16 | 荣耀终端有限公司 | Electronic device |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090279260A1 (en) * | 2008-02-29 | 2009-11-12 | Xing En Yu | Suspension device for a superconducting magnet heat shield enclosure |
CN203689249U (en) * | 2013-12-20 | 2014-07-02 | 联想(北京)有限公司 | Notebook computer host casing and notebook computer |
CN204681713U (en) * | 2015-06-15 | 2015-09-30 | 乐清罗克韦尔自动化有限公司 | A kind of boundary switch controller |
US20150289414A1 (en) * | 2014-04-03 | 2015-10-08 | Bae Systems Information And Electronic Systems Integration Inc. | Method and apparatus for cooling electonic components |
CN205040132U (en) * | 2015-08-11 | 2016-02-17 | 奇鋐科技股份有限公司 | Thermal -insulated structure of hand -held device and hand -held device that has thermal -insulated structure |
CN205071567U (en) * | 2015-08-13 | 2016-03-02 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
CN206136510U (en) * | 2016-10-20 | 2017-04-26 | 东莞爵士先进电子应用材料有限公司 | Portability electron device's vacuum separates hot junction and constructs |
-
2016
- 2016-10-20 CN CN201610915110.XA patent/CN107969082A/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090279260A1 (en) * | 2008-02-29 | 2009-11-12 | Xing En Yu | Suspension device for a superconducting magnet heat shield enclosure |
CN203689249U (en) * | 2013-12-20 | 2014-07-02 | 联想(北京)有限公司 | Notebook computer host casing and notebook computer |
US20150289414A1 (en) * | 2014-04-03 | 2015-10-08 | Bae Systems Information And Electronic Systems Integration Inc. | Method and apparatus for cooling electonic components |
CN204681713U (en) * | 2015-06-15 | 2015-09-30 | 乐清罗克韦尔自动化有限公司 | A kind of boundary switch controller |
CN205040132U (en) * | 2015-08-11 | 2016-02-17 | 奇鋐科技股份有限公司 | Thermal -insulated structure of hand -held device and hand -held device that has thermal -insulated structure |
CN205071567U (en) * | 2015-08-13 | 2016-03-02 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
CN206136510U (en) * | 2016-10-20 | 2017-04-26 | 东莞爵士先进电子应用材料有限公司 | Portability electron device's vacuum separates hot junction and constructs |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023036020A1 (en) * | 2021-09-10 | 2023-03-16 | 荣耀终端有限公司 | Electronic device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104813760B (en) | A kind of radiating subassembly and electronic equipment | |
WO2018059464A1 (en) | Heat dissipation structure for electronic device, and electronic device | |
CN108207097A (en) | A kind of heat-proof device and electronic product | |
EP3539364B1 (en) | Heat-radiating structure and electronic device including the same | |
CN107509381B (en) | A kind of production method of screening cover, screening cover and mobile terminal | |
CN203912443U (en) | Hand-held device heat-radiating structure | |
WO2017067219A1 (en) | Cooling device for mobile terminal, and mobile terminal | |
EP2075993A1 (en) | A mobile terminal preventing temperature rising of user-sensitive surface | |
CN103209574A (en) | Heat dissipation device and method of mobile terminal, and mobile terminal | |
CN106793710A (en) | A kind of portable electronic device soaking radiator structure and technique | |
CN106413336A (en) | Heat dissipation buffering shielding composite structure of mobile electronic device | |
CN205071566U (en) | Heat dissipation buffering shielding composite structure of mobile electronic device | |
EP3107362B1 (en) | Frame and mobile terminal | |
TWM487609U (en) | Heat dissipation structure of handheld electronic device | |
CN106413369A (en) | Shielding case and circuit board | |
CN107969082A (en) | The vacuum degree of portable electronic devices | |
CN206136510U (en) | Portability electron device's vacuum separates hot junction and constructs | |
CN106647114A (en) | Camera module | |
TWI573521B (en) | Heat dissipation structure of handheld electronic device | |
CN105828569A (en) | Heat radiation device and electronic equipment | |
CN106413335A (en) | Heat dissipation buffering shielding composite structure of mobile electronic device | |
CN205071568U (en) | Heat dissipation buffering shielding composite structure of mobile electronic device | |
CN205179142U (en) | Modified heat dissipation type mobile phone motherboard | |
CN206525067U (en) | The composite support radiator structure of portable electronic devices | |
CN203912442U (en) | Hand-held electronic device heat-radiating structure |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20210421 Address after: 703, block B, Changxing building, 4002 Huaqiang North Road, Yuanling street, Futian District, Shenzhen, Guangdong 518000 Applicant after: Shenzhen Weishi New Material Technology Co.,Ltd. Address before: Liaobu Town, Guangdong city of Dongguan province 523421 Liu Wu Xiang Village Fulailu No. 51 Applicant before: DONGGUAN JAZZ ADVANCED ELECTRONIC APPLICATION MATERIALS Co.,Ltd. |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180427 |