CN205071567U - Heat dissipation buffering conductive composite forming structure of mobile electronic device - Google Patents
Heat dissipation buffering conductive composite forming structure of mobile electronic device Download PDFInfo
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- CN205071567U CN205071567U CN201520691164.3U CN201520691164U CN205071567U CN 205071567 U CN205071567 U CN 205071567U CN 201520691164 U CN201520691164 U CN 201520691164U CN 205071567 U CN205071567 U CN 205071567U
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- 230000003139 buffering effect Effects 0.000 title claims abstract description 29
- 239000002131 composite material Substances 0.000 title claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 6
- 238000000465 moulding Methods 0.000 claims abstract description 17
- 230000000694 effects Effects 0.000 claims abstract description 12
- 230000005855 radiation Effects 0.000 claims description 44
- 150000001875 compounds Chemical class 0.000 claims description 26
- 239000004973 liquid crystal related substance Substances 0.000 claims description 23
- 238000002955 isolation Methods 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 13
- 239000011148 porous material Substances 0.000 claims description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
- 230000004308 accommodation Effects 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229920000742 Cotton Polymers 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 239000010439 graphite Substances 0.000 claims description 3
- 229910002804 graphite Inorganic materials 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000009413 insulation Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000012528 membrane Substances 0.000 abstract 1
- 210000003660 reticulum Anatomy 0.000 description 9
- 239000011469 building brick Substances 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Abstract
A heat dissipation buffering conductive composite molding structure of a mobile electronic device comprises: especially indicate a collection heat dissipation buffering electrically conductive composite forming structure in an organic whole, it includes that a transparent substrate and back lid combine relatively through a mesochite support, its characterized in that: the composite diaphragm is integrally molded with the middle shell support (insert; the waste of the membrane caused by poor assembly can be reduced, and the assembly yield is improved; and the mobile electronic device integrates the functions of heat dissipation, buffering, electric conduction and heat insulation, and has the effects of keeping the reliability of the mobile electronic device and saving the cost.
Description
Technical field
The utility model is the heat radiation buffering conduction composite molding structure about a kind of electronic apparatus, and espespecially a kind of combination heat radiation, buffering, conduction, heat insulation four functions are in the composite molding structure of one.
Background technology
The electronic apparatus such as smart mobile phone, panel computer, it has been developed into the process chip of more and more high operation frequency by double-core, four cores, eight cores etc.; And the development of electronic apparatus is with short and small frivolous for designer trends, therefore for can reach high operation efficiency and short and small frivolous double requirements, the radiating efficiency of electronic apparatus is important increasingly.
Secondary person, the radiating mode of current electronic apparatus, mainly utilize the modes such as simple perforate, heat conduction, thermal convection, but those radiating modes are with cannot the load heat energy that produces of high-effect chip now, therefore the problem of accumulated heat is had, heat energy cannot uniformly dispersing, causes the radiating efficiency reducing electronic apparatus inside.
Press again, the chip of usual electronic equipment is operationally main heating source, heat radiation is not only to reduce chip own temperature to ensure that it normally can work in the temperature range required, can not cause housing local overheating simultaneously, cause bad experience to consumer when also will take into account heat radiation.
Be with, the novel M of TaiWan, China No. 496156 patent, disclose a kind of electronic apparatus radiator structure, it comprises a fore shell support 11, liquid crystal display module 12 and bonnet 16 and a heat-conductive assembly 15, this liquid crystal display module 12 side is provided with a substrate 14, this substrate 14 is provided with at least one electronic building brick 141, this bonnet 16 has an accommodation space 161, this liquid crystal display module 12 side is sticked a center 13, this substrate 14 is embedded on this center 13, this heat-conductive assembly 15 is arranged between described electronic building brick 141 and bonnet 16, the described electronic building brick 141 of this heat-conductive assembly 15 side correspondence contact, the described bonnet 16 of opposite side correspondence contact, scatter so as to helping the uniform thermal power of this electronic building brick 121 and do not produce accumulated heat.But look into; after its heat-conductive assembly 15 as heat radiation manufactures respectively with bonnet 16; heat-conductive assembly 15 is binded at bonnet 16 inner edge surface again; therefore its radiating efficiency or electronic shield function still have weak point; in addition it does not disclose the buffer structure of this liquid crystal display module 12 of protection, is therefore still improved space.
In addition; in current Cell Phone Design; not damaged in order to protect LCD to be in use subject to impulsive force; solve during LCD uses simultaneously and generate heat and too much affect performance, traditional design below LCD, mounts foam be used for cushion impact forces, and attachment conducting film is used for heat radiation; but; need to arrange a special assembling station like this, assembly cost is higher, increases Z-direction thickness.
Therefore solve the problems referred to above point of traditional electronic apparatus, it is major subjects of the present utility model.
Utility model content
Technical problem underlying to be solved in the utility model is, overcome the above-mentioned defect that prior art exists, and a kind of heat radiation buffering conduction composite molding structure of electronic apparatus is provided, its combination heat radiation, buffering, conduction, heat insulation four merits are used for integrally, and one build-in are fixed on fore shell support, have and save assembling manpower, shorten built-up time, reduce assembly cost, improve assembling yield, reduce effect of Z-direction thickness; It combines heat radiation, buffering, conduction three merits for one, has the reliability that can keep electronic apparatus, again can be cost-saving.
The utility model solves the technical scheme that its technical problem adopts:
A heat radiation buffering conduction composite molding structure for electronic apparatus, comprising: a transparency carrier; One liquid crystal display module, is located at the below of this transparency carrier; One mesochite support, is located at the below of this liquid crystal display module; One circuit board, is located at the below of this mesochite support, and it is at least provided with an electronic chip; Battery, is located at the below of this mesochite support; And a bonnet, be relatively combined in the root edge of this mesochite support, it has an accommodation space, in order to receive aforesaid component;
It is characterized in that: a compound film sheet, by a resilient coating, a thermal isolation film and a conductive radiator film is from top to bottom superimposed formed, this compound film sheet and this mesochite support single moulded piece (insertmolding), form this compound film sheet build-in to fix on this mesochite support, and the surface of this conductive radiator film of lower floor at least exposes a conductive radiator face in the surface of this mesochite support.
According to front taking off feature, in one possible embodiments, this compound film sheet is between this mesochite support and this liquid crystal display module, form the upper surface that this compound film sheet build-in fixes on this mesochite support, and the surperficial book office of this mesochite support is provided with a perforate, this perforate exposes the conductive radiator face of this conductive radiator film, for heat radiation, simultaneously this resilient coating for this liquid crystal display module buffering and last between this mesochite support with this electronic chip together with heat resistant layer.
In another possible embodiments, this compound film sheet is between this mesochite support and this liquid crystal display mode, and the surface of this mesochite support is without open-celled structure, forms the lower surface that this compound film sheet build-in fixes on this mesochite support.
According to front taking off feature, this mesochite support is formed by a plastic parts, upwards fixes this liquid crystal display module simultaneously, fixes this circuit board downwards; This circuit board is provided with a radome (shieldingcan) with surface mount technology (SMT), and the cover of this radome (shieldingcan) contacts the conductive radiator face of this conductive radiator film; The electronic chip of this circuit board is provided with an insulating radiation sheet, in order to provide this heat dissipation of electronic chip, intercepts this radome simultaneously and contacts with this electronic chip, play insulating effect; And this electronic chip contacts this insulating radiation sheet, in order to the heat of this electronic chip is vertically upwards transmitted, the heat of this electronic chip output is passed, the heat that this radome is transmitted transversely horizontal dispersion is gone out, and stops the outside radiations heat energy of this conductive radiator film with this thermal isolation film.
According to front taking off feature, this insulating radiation sheet can be made up of the aluminium oxide adding silica gel; This conductive radiator film is Copper Foil, aluminium foil or graphite flake; This resilient coating is foamed cotton layer, rubber layer or elastic film layer; This thermal isolation film can be one have the flat film of microcellular structure or on this flat film basis, be processed with the perforated film of several pore, pore space structure.
By on take off technological means, it is one-body molded that traditional injection lid is changed into mould note by the utility model, that is it is first by three layers of this resilient coating, thermal isolation film and conductive radiator film composition compound film sheet, put one-body molded with this mesochite support in a mold, reduce by an assembling station according to this, save assembling manpower, shorten built-up time, reduce assembly cost, reduce Z-direction thickness; And the diaphragm waste that can reduce because assembly failure brings, improves effect of assembling yield.And it combines heat radiation, buffering, conduction, heat insulation four merits for one, has the reliability that can keep electronic apparatus, effect that again can be cost-saving.
The beneficial effects of the utility model are, its combination heat radiation, buffering, conduction, heat insulation four merits are used for integrally, and one build-in is fixed on fore shell support, have and save assembling manpower, shorten built-up time, reduce assembly cost, improve assembling yield, reduce effect of Z-direction thickness; It combines heat radiation, buffering, conduction three merits for one, has the reliability that can keep electronic apparatus, again can be cost-saving.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Figure 1A is the exploded perspective view of existing a kind of electronic apparatus radiator structure.
Figure 1B is the combination stereogram of existing a kind of electronic apparatus radiator structure.
Fig. 1 C is the cutaway view of existing a kind of electronic apparatus radiator structure.
Fig. 1 D is the enlarged drawing shown in 1D in Fig. 1 C.
Fig. 2 is the exploded perspective view of the utility model first possible embodiments.
Fig. 3 is the combination stereogram of the utility model first possible embodiments.
Fig. 4 is the cutaway view of the utility model first possible embodiments.
Fig. 5 is the exploded perspective view of the utility model second possible embodiments.
Fig. 6 is the combination stereogram of the utility model second possible embodiments.
Fig. 7 is the cutaway view of the utility model second possible embodiments.
Fig. 8 is the enlarged drawing of 8 indications in Fig. 7.
Fig. 9 is the exploded perspective view of the utility model the 3rd possible embodiments.
Figure 10 is the combination stereogram of the utility model the 3rd possible embodiments.
Figure 11 is the cutaway view of the utility model the 3rd possible embodiments.
Figure 12 is the exploded perspective view of the utility model the 4th possible embodiments.
Figure 13 is the combination stereogram of the utility model the 4th possible embodiments.
Figure 14 is the cutaway view of the utility model the 4th possible embodiments.
Figure 15 is the enlarged drawing of 15 indications in Figure 14.
Number in the figure illustrates:
20 transparency carriers
21 Printing Zones
22,22a, 22b, 22c, 22d mesochite support
221 perforates
222 inside casing faces
223 neighborings
30 liquid crystal display modules
40 circuit boards
41 electronic chips
50 batteries
60 bonnets
61 accommodation spaces
70 compound film sheets
71 resilient coatings
72 thermal isolation film
721 pores, pore space structure
73 conductive radiator films
80 radomes
81 covers
90 insulating radiation sheets
Embodiment
First, refer to shown in Fig. 2 ~ Fig. 4, the heat radiation buffering conduction composite molding structure of the electronic apparatus disclosed by the utility model, its first possible embodiments comprises: a transparency carrier 20, its outer peripheral edges can be provided with a nontransparent Printing Zone 21, but be not limited to this; One liquid crystal display module 30, is located at the below of this transparency carrier 20; One mesochite support 22, is located at the below of this liquid crystal display module 30; One circuit board 40, is located at the below of this mesochite support 22, it is at least provided with an electronic chip 41; One battery 50, is located at the below of this mesochite support 22; And a bonnet 60, be relatively combined in this transparency carrier 20 root edge by this mesochite support 22a, it has an accommodation space 61, in order to receive aforesaid component; But, above take off component and belong to prior art (PriorArt), non-patent object of the present utility model, hold and do not repeat.
Principal character of the present utility model is: a compound film sheet 70, by resilient coating 71, thermal isolation film 72 and a conductive radiator film 73 is from top to bottom superimposed is formed, this compound film sheet 70 and this mesochite support 22 single moulded piece (insertmolding), form this compound film sheet 70 build-in to fix on this mesochite support 22, and the surface of this conductive radiator film 73 at least exposes the surperficial book office of a conductive radiator face 731 at this mesochite support 22.In the present embodiment, this mesochite support 22 is formed in one and has the mesochite support 22a of the single type in an inside casing face 222.
Fig. 4 is the cutaway view of the utility model first possible embodiments, this transparency carrier 20 is located on the inside casing face 222 of this mesochite support 22a, this compound film sheet 70 is between this mesochite support 22a and this liquid crystal display module 30, form the upper surface that this compound film sheet 70 build-in fixes on this mesochite support 22a, and the surperficial book office of this mesochite support 22a is provided with a perforate 221, this perforate 221 exposes the conductive radiator face 731 of this conductive radiator film 73, with for heat radiation, simultaneously this resilient coating 71 cushion for this liquid crystal display module 30 and this mesochite support 22a last with between this electronic chip 41 together with heat resistant layer.
Fig. 5 ~ Fig. 8 is the utility model second possible embodiments, and its structure being same as the first possible embodiments represents with same reference numbers, and its difference is only: this mesochite support 22b is included in its periphery and forms in conjunction with an independent shaping framework 23.That is in the first possible embodiments, this mesochite support 22a is formed in one and has the inside casing face 222 of framework function simultaneously, and in the present embodiment, this framework 23 props up the mesochite support 22 that neighboring 223 is formed for independent shaping this mesochite support 22b that is fixed in again, as shown in Figure 7.
Refer to shown in Fig. 9 ~ Figure 11, it discloses the utility model the 3rd possible embodiments, its structure being same as the first possible embodiments represents with same reference numbers, its difference is only: this compound film sheet 70 is between this mesochite support 22 and this circuit board 40, in the present embodiment, this mesochite support 22 is that the surperficial mesochite support 22 without open-celled structure forms the lower surface that this compound film sheet 70 build-in fixes on this mesochite support 22c.
Shown in Figure 12 ~ Figure 15, it discloses the utility model the 4th possible embodiments, its structure being same as the 3rd possible embodiments represents with same reference numbers, its difference is only: this mesochite support 22d is included in its periphery and forms in conjunction with an independent shaping framework 23, this framework 23 is on the independent shaping neighboring 223 being fixed in this mesochite support 22d again, as shown in figure 14.
On take off in embodiment, this mesochite support 22 can be a plastic parts and formed, and simultaneously upwards fixes this liquid crystal display module 30, fixes this circuit board 40 downwards; This circuit board 40 is provided with a radome (shieldingcan) 80 with surface mount technology (SMT), and the cover 81 of this radome (shieldingcan) 80 contacts the conductive radiator face 731 of this conductive radiator film 73; This circuit board 40 is provided with an insulating radiation sheet 90, in order to provide this electronic chip 41 to dispel the heat, intercepts this radome 80 simultaneously and contacts with this electronic chip 41, play insulating effect; And this electronic chip 41 contacts this insulating radiation sheet 90, in order to the heat of this electronic chip 41 is vertically upwards transmitted, the heat of this electronic chip 41 output is passed, the heat that this radome 80 is transmitted transversely horizontal dispersion is gone out, and stop this conductive radiator film 73 outwards radiations heat energy with this thermal isolation film 72, in the present embodiment, this insulating radiation sheet 90 can be made up of the aluminium oxide adding silica gel, but is not limited to this.
Hold, this conductive radiator film 73, in order to lateral transport heat, reaches Homogeneouslly-radiating, and in the present embodiment, this conductive radiator film of this conductive radiator film 73 is Copper Foil, aluminium foil or graphite flake, but is not limited to this.
In addition, cover above this conductive radiator film 73 and be provided with one deck thermal isolation film 72, in order to stop this conductive radiator film 73 outwards radiations heat energy, in case user's feel is overheated, in the present embodiment, this thermal isolation film 72 adds the thermal insulation film with microcellular structure of hollow glass bead foaming, or utilize other material or processes to form and there is the film of heat insulating function, its both can be plane also can be, on the basis of this flat film, there is through perforation processing several pore, the film of pore space structure 721, its thermal resistance principle mainly utilizes air layer in the air layer in its internal capillary and the rear hole added to condense air, the characteristic utilizing air conduction coefficient large forms thermoresistance layer, this thermoresistance layer can affect heat direction of transfer, make heat energy uniformly dispersing and control in thermoresistance layer to stop heat further to housing outdiffusion, but be not limited to this.
Moreover; one deck resilient coating 71 (material can be the elastomeric cushion material such as rubber, foam) is provided with in the outside of this thermal isolation film 72; in order to protect this liquid crystal display module 30; reach buffering and prevent heat to be delivered to effect outside housing; in the present embodiment; this resilient coating 721 is foamed cotton layer, rubber layer or elastic film layer, but is not limited to this.
Please consult the enlarged drawing shown in Fig. 8 and Figure 15 more simultaneously, this compound film sheet 70 build-in fixes on this mesochite support 20 as longitudinally conducting heat and electromagnetic shielding medium, improve the problem that this mesochite support 20 heat conduction is bad, and the heat sent by this electronic chip 41 continues longitudinally to pass, and then the heat transmitted from this electronic chip 41 is longitudinally sent to the conductive radiator film 73 of this compound film sheet 70 by this insulating radiation sheet 90 and this radome 80, then come by the horizontal parallel distribution of this conductive radiator film 73, reach Homogeneouslly-radiating; Moreover in this thermal isolation film 72, its both can be plane also can be, on the basis of this flat film, there is through perforation processing several pore, the film of pore space structure 721, its effect can stop heat to continue to housing outdiffusion, overheated bad experience is caused with exempt from customs examination user, and with this resilient coating 71, provide cushioning effect to have concurrently heat insulation, protect this liquid crystal display module 30; Whereby, the utility model has combination heat radiation, buffering, conduction, heat insulation four merits for one, both can keep the reliability of electronic apparatus, effect that again can be cost-saving.
By on take off technological means, the utility model changes traditional injection lid into mould with this mesochite support 22 and notes one-body molded, that is it is first by three layers of this resilient coating 71, thermal isolation film 72 and conductive radiator film 73 composition compound film sheet 70, put one-body molded with this mesochite support 22 in a mold, to reduce by an assembling station, save assembling manpower, shorten built-up time, reduce assembly cost, reduce Z-direction thickness; And the diaphragm waste that can reduce because assembly failure (diaphragm off normal or distortion need to tear to re-assembly) brings, improves assembling yield.
The above, it is only preferred embodiment of the present utility model, not any pro forma restriction is done to the utility model, every above embodiment is done according to technical spirit of the present utility model any simple modification, equivalent variations and modification, all still belong in the scope of technical solutions of the utility model.
In sum, the utility model is in structural design, use practicality and cost benefit, meet completely needed for industry development, and the structure disclosed also is have unprecedented innovative structure, there is novelty, creativeness, practicality, meet the regulation about new patent important document, therefore mention application in accordance with the law.
Claims (10)
1. a heat radiation buffering conduction composite molding structure for electronic apparatus, comprising:
One transparency carrier, it can be provided with a Printing Zone;
One liquid crystal display module, is located at the below of this transparency carrier;
One mesochite support, is located at the below of this liquid crystal display module;
One circuit board, is located at the below of this mesochite support, and it is at least provided with an electronic chip;
One battery, is located at the below of this mesochite support; And
One bonnet, is combined in the root edge of this mesochite support relatively, and it has an accommodation space, in order to receive aforesaid component; It is characterized in that:
One compound film sheet, from top to bottom be formed by stacking by a resilient coating, a thermal isolation film and a conductive radiator film, this compound film sheet and this mesochite support single moulded piece, form this compound film sheet build-in to fix on this mesochite support, and the surface of this conductive radiator film of lower floor at least exposes a conductive radiator face in the surface of this mesochite support.
2. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 1, it is characterized in that, described compound film sheet is between this mesochite support and this liquid crystal display module, form the upper surface that this compound film sheet build-in fixes on this mesochite support, and the surperficial book office of this mesochite support is provided with a perforate, this perforate exposes the conductive radiator face of this conductive radiator film, for heat radiation, simultaneously this resilient coating for this liquid crystal display module buffering and last between this mesochite support with this electronic chip together with heat resistant layer.
3. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 2, it is characterized in that, described mesochite support is also included in its periphery and is provided with a framework.
4. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 1, it is characterized in that, described compound film sheet is between this mesochite support and this circuit board, and the surface of this mesochite support is without open-celled structure, form the lower surface that this compound film sheet build-in fixes on this mesochite support.
5. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 4, it is characterized in that, described mesochite support is also provided with a framework at its periphery.
6., according to the heat radiation buffering conduction composite molding structure of the electronic apparatus of Claims 1 to 5 item according to any one of it, it is characterized in that, described mesochite support is a plastic parts, upwards fixes this liquid crystal display module simultaneously, fixes this circuit board downwards; This circuit board is provided with a radome, and the cover of this radome contacts the conductive radiator face of this conductive radiator film; This circuit board is provided with an insulating radiation sheet, for this heat dissipation of electronic chip, intercepts this radome simultaneously and contacts with this electronic chip, play insulating effect; And this electronic chip contacts this insulating radiation sheet, in order to the heat of this electronic chip is vertically upwards transmitted, the heat of this electronic chip output is passed, the heat that this radome is transmitted transversely horizontal dispersion is gone out, and stops the outside radiations heat energy of this conductive radiator film with this thermal isolation film.
7. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 6, it is characterized in that, described insulating radiation sheet can be made up of the aluminium oxide adding silica gel.
8. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 1, it is characterized in that, described conductive radiator film is Copper Foil, aluminium foil or graphite flake.
9. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 1, it is characterized in that, described resilient coating is foamed cotton layer, rubber layer or elastic film layer.
10. the heat radiation buffering conduction composite molding structure of electronic apparatus according to claim 1, it is characterized in that, described thermal isolation film is one have the flat film of microcellular structure or on this flat film basis, be processed with the perforated film of several pore, pore space structure.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104213063 | 2015-08-13 | ||
| TW104213063U TWM519268U (en) | 2015-08-13 | 2015-08-13 | Heat dissipation buffer conductive composite molding structure of mobile electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205071567U true CN205071567U (en) | 2016-03-02 |
Family
ID=55398062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520691164.3U Active CN205071567U (en) | 2015-08-13 | 2015-09-07 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN205071567U (en) |
| TW (1) | TWM519268U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455411A (en) * | 2015-08-13 | 2017-02-22 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
| CN106455465A (en) * | 2016-11-15 | 2017-02-22 | 智恩电子(大亚湾)有限公司 | Impact-resisting electromagnetic wave shielding film for circuit board |
| CN107969092A (en) * | 2016-10-20 | 2018-04-27 | 东莞爵士先进电子应用材料有限公司 | The vacuum radiator structure of portable electronic devices |
| CN107969082A (en) * | 2016-10-20 | 2018-04-27 | 东莞爵士先进电子应用材料有限公司 | The vacuum degree of portable electronic devices |
| WO2023036020A1 (en) * | 2021-09-10 | 2023-03-16 | 荣耀终端有限公司 | Electronic device |
| US11842945B2 (en) | 2020-10-30 | 2023-12-12 | Samsung Electronics Co., Ltd. | Chip on film package and display apparatus including the same |
-
2015
- 2015-08-13 TW TW104213063U patent/TWM519268U/en unknown
- 2015-09-07 CN CN201520691164.3U patent/CN205071567U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106455411A (en) * | 2015-08-13 | 2017-02-22 | 东莞钱锋特殊胶粘制品有限公司 | Heat dissipation buffering conductive composite forming structure of mobile electronic device |
| CN107969092A (en) * | 2016-10-20 | 2018-04-27 | 东莞爵士先进电子应用材料有限公司 | The vacuum radiator structure of portable electronic devices |
| CN107969082A (en) * | 2016-10-20 | 2018-04-27 | 东莞爵士先进电子应用材料有限公司 | The vacuum degree of portable electronic devices |
| CN106455465A (en) * | 2016-11-15 | 2017-02-22 | 智恩电子(大亚湾)有限公司 | Impact-resisting electromagnetic wave shielding film for circuit board |
| CN106455465B (en) * | 2016-11-15 | 2020-07-03 | 智恩电子(大亚湾)有限公司 | Impact-resistant electromagnetic wave shielding film for circuit board |
| US11842945B2 (en) | 2020-10-30 | 2023-12-12 | Samsung Electronics Co., Ltd. | Chip on film package and display apparatus including the same |
| WO2023036020A1 (en) * | 2021-09-10 | 2023-03-16 | 荣耀终端有限公司 | Electronic device |
| EP4171187A4 (en) * | 2021-09-10 | 2024-02-28 | Honor Device Co Ltd | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM519268U (en) | 2016-03-21 |
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Effective date of registration: 20210422 Address after: 703, block B, Changxing building, 4002 Huaqiang North Road, Yuanling street, Futian District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Weishi New Material Technology Co.,Ltd. Address before: 523420, 19 Ling Ling Road, floating bamboo village, Liaobu Town, Dongguan, Guangdong, China Patentee before: DONGGUAN QIANFENG SPECIAL ADHESIVE PRODUCTS Co.,Ltd. |