CN106455465B - Impact-resistant electromagnetic wave shielding film for circuit board - Google Patents

Impact-resistant electromagnetic wave shielding film for circuit board Download PDF

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Publication number
CN106455465B
CN106455465B CN201611002943.3A CN201611002943A CN106455465B CN 106455465 B CN106455465 B CN 106455465B CN 201611002943 A CN201611002943 A CN 201611002943A CN 106455465 B CN106455465 B CN 106455465B
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layer
insulating layer
metal
parts
metal layer
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CN106455465A (en
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秦远国
王远
付建云
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Tean Electronic Da Ya Bay Co ltd
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Tean Electronic Da Ya Bay Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C08L81/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/02—Polythioethers; Polythioether-ethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2423/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
    • C08J2423/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
    • C08J2423/10—Homopolymers or copolymers of propene
    • C08J2423/12—Polypropene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/16—Applications used for films
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The invention discloses an impact-resistant electromagnetic wave shielding film for a circuit board, which comprises an insulating layer, a metal layer and a bonding layer which are sequentially arranged, wherein a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the adhesive layer towards the adhesive layer. According to the invention, the plurality of elastic lugs are arranged on the surface of the insulating layer and can be made of any one of the existing elastic materials, and the elastic layer can prevent the shielding film from being directly impacted by external force, prevent the insulating layer and the metal layer from being abraded and ensure the integrity of the metal layer.

Description

Impact-resistant electromagnetic wave shielding film for circuit board
Technical Field
The invention relates to the technical field of printed circuit boards, in particular to an impact-resistant electromagnetic wave shielding film for a circuit board.
Background
With the integration of the functions of communication equipment such as mobile phones, the components are rapidly high-frequency and high-speed. For example: besides the original audio transmission function, the mobile phone function has become a necessary function, the WLAN, GPS and internet functions have become popular, and the integration of the future sensing component makes the trend of rapid high-frequency and high-speed components more inevitable. The problems of electromagnetic interference inside and outside the components caused by high frequency and high speed driving, and signal attenuation in transmission, i.e., insertion loss and jitter, will become serious.
At present, the shielding film for the circuit board mainly has the following structure:
1) forming a metal layer on the surface of the insulating layer, and forming a conductive adhesive layer on the surface of the metal layer;
2) forming a conductive adhesive layer on the surface of the metal layer;
the structures 1) and 2) have no essential difference, and 2) only the surface of the metal layer is not provided with an insulating layer.
3) And an omnibearing conductive adhesive layer is formed on the surface of the insulating layer.
In the structure, the shielding film is easy to be worn and damaged by impact in the transportation, use and processing processes of the circuit board, so that the shielding film is failed.
Disclosure of Invention
Accordingly, the present invention provides a shielding film capable of effectively preventing impact damage.
The purpose of the invention is realized by the following technical scheme: an anti-impact electromagnetic wave shielding film for a circuit board comprises an insulating layer, a metal layer and a bonding layer which are sequentially arranged, wherein a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the adhesive layer towards the adhesive layer.
The metal layer is connected with the bottom layer of the circuit board through the metal contact to complete grounding. The adhesive layer is used for bonding the shielding film with the circuit board in the year. Particularly, the plurality of elastic bumps are arranged on the surface of the insulating layer and can be made of any one of the existing elastic materials, and the elastic layer can prevent the shielding film from being directly impacted by external force, prevent the insulating layer and the metal layer from being abraded and ensure the integrity of the metal layer.
Furthermore, a buffer layer is arranged between the insulating layer and the metal layer, and buffer cavities distributed in a grid shape are arranged in the buffer layer.
The buffer layer is used for reducing the area of contact of metal level and insulating layer, tears the metal level when avoiding the buffer layer to suffer the impact simultaneously.
Further, the thickness of the metal layer is 0.5-8 microns; the metal layer is made of at least one simple substance of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold; the thickness of the insulating layer is 1-25 microns; the insulating layer is one of a PPS film layer, a PEN film layer, a polyester film layer, a polyimide film layer, a film layer formed after epoxy resin printing ink is cured, a film layer formed after polyurethane printing ink is cured, a film layer formed after modified acrylic resin is cured and a film layer formed after polyimide resin is cured; the thickness of the bonding layer is 1-25 microns, and the materials used for the bonding layer are selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides; the buffer layer is one of a PPS film layer, a PEN film layer, a polyester film layer and a polyimide film layer.
Preferably, the insulating layer is a PPS film layer; the PPS film layer comprises 60-70 parts of polyphenylene sulfide, 10-20 parts of polypropylene, 1-3 parts of potassium dihydrogen phosphate, 0.2-0.3 part of polyvinyl alcohol, 0.05-0.08 part of 3, 7-dimethyl-1, 6-octadiene-3-ol and 1-3 parts of dicyclopentadiene.
Polyvinyl alcohol is an important chemical raw material, and is used for manufacturing polyvinyl acetal, gasoline-resistant pipelines, vinylon synthetic fibers, fabric treating agents, emulsifiers, paper coatings, adhesives, glue and the like. CAS number for 3, 7-dimethyl-1, 6-octadien-3-ol is 78-70-6. Dicyclopentadiene (DCPD), also known as dicyclopentadiene, is a dimer formed from cyclopentadiene by diels-alder reaction. PPS has the advantages of high mechanical strength, high temperature resistance, chemical resistance, flame retardancy, good thermal stability, excellent electrical property and the like. But the flexibility is poor, and the rubber is easy to damage by impact and bending. Designers try to add a proper amount of auxiliary agent into PPS, and find that the 3, 7-dimethyl-1, 6-octadiene-3-alcohol, dicyclopentadiene and polyvinyl alcohol have synergistic effect to effectively improve the impact resistance of the PPS material, so that the PPS material is not easy to damage due to impact. In addition, the aging resistance of the PPS can be effectively improved by the polyvinyl alcohol, and the insulation layer is prevented from being damaged due to aging.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Detailed Description
For the convenience of understanding of those skilled in the art, the present invention will be described in further detail below with reference to the accompanying drawings and examples:
example 1
The embodiment provides an impact-resistant electromagnetic wave shielding film for a circuit board, as shown in fig. 1, which comprises an insulating layer 1, a metal layer 2 and an adhesive layer 3, which are sequentially arranged, wherein a plurality of elastic bumps 4 are arranged on the surface of the insulating layer 1; the metal layer 2 is provided with metal contacts 5 penetrating the adhesive layer 3 towards the adhesive layer. In this embodiment, the elastic bumps are silica gel bumps.
Further, a buffer layer 6 is further arranged between the insulating layer and the metal layer, and buffer cavities 7 which are distributed in a grid shape are arranged in the buffer layer 6.
And the buffer layer is formed by stamping the buffer cavity after the polymer resin film is formed.
Further, the metal layer has a thickness of 0.3 μm; the metal layer is made of a copper simple substance; the thickness of the insulating layer is 15 microns; the insulating layer is a polyester film layer; the thickness of the bonding layer is 20 microns, and the material used by the bonding layer is selected from modified rubber; the buffer layer is a PPS film layer.
Example 2
The embodiment provides an impact-resistant electromagnetic wave shielding film for a circuit board, which comprises an insulating layer, a metal layer and an adhesive layer which are sequentially arranged, wherein a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the adhesive layer towards the adhesive layer. In this embodiment, the elastic bumps are rubber bumps.
Further, the metal layer has a thickness of 2 μm; the metal layer is made of simple aluminum; the thickness of the insulating layer is 10 microns; the insulating layer is a PPS film layer; the thickness of the bonding layer is 8 microns, and the material used for the bonding layer is selected from acrylic.
Preferably, the insulating layer is a PPS film layer; the PPS film layer comprises 65 parts of polyphenylene sulfide, 12 parts of polypropylene, 2 parts of monopotassium phosphate, 0.2 part of polyvinyl alcohol, 0.06 part of 3, 7-dimethyl-1, 6-octadiene-3-ol and 2 parts of dicyclopentadiene.
Example 3
The embodiment provides an impact-resistant electromagnetic wave shielding film for a circuit board, which comprises an insulating layer, a metal layer and an adhesive layer which are sequentially arranged, wherein a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the adhesive layer towards the adhesive layer. In this embodiment, the elastic protrusion is polylactic acid.
Furthermore, a buffer layer is arranged between the insulating layer and the metal layer, and buffer cavities distributed in a grid shape are arranged in the buffer layer.
Further, the metal layer has a thickness of 5 μm; the metal layer is made of a simple gold substance; the thickness of the insulating layer is 20 microns; the insulating layer is a PPS film layer; the thickness of the bonding layer is 19 microns, and the bonding layer is modified thermoplastic polyimide; the buffer layer is a polyimide film layer.
Preferably, the insulating layer is a PPS film layer; the PPS film layer comprises, by weight, 70 parts of polyphenylene sulfide, 10 parts of polypropylene, 3 parts of monopotassium phosphate, 0.2 part of polyvinyl alcohol, 0.08 part of 3, 7-dimethyl-1, 6-octadiene-3-ol and 1 part of dicyclopentadiene.
Example 4
The embodiment provides an impact-resistant electromagnetic wave shielding film for a circuit board, which comprises an insulating layer, a metal layer and an adhesive layer which are sequentially arranged, wherein a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the adhesive layer towards the adhesive layer. In this embodiment, the elastic protrusion is polylactic acid.
Furthermore, a buffer layer is arranged between the insulating layer and the metal layer, and buffer cavities distributed in a grid shape are arranged in the buffer layer.
Further, the metal layer has a thickness of 5 μm; the metal layer is made of a simple gold substance; the thickness of the insulating layer is 20 microns; the insulating layer is a PPS film layer; the thickness of the bonding layer is 19 microns, and the bonding layer is modified thermoplastic polyimide; the buffer layer is a polyimide film layer.
Preferably, the insulating layer is a PPS film layer; the PPS film layer comprises 60 parts of polyphenylene sulfide, 20 parts of polypropylene, 1 part of monopotassium phosphate, 0.3 part of polyvinyl alcohol, 0.05 part of 3, 7-dimethyl-1, 6-octadiene-3-ol and 3 parts of dicyclopentadiene.
Example 5
The embodiment provides an impact-resistant electromagnetic wave shielding film for a circuit board, which comprises an insulating layer, a metal layer and an adhesive layer which are sequentially arranged, wherein a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the adhesive layer towards the adhesive layer. In this embodiment, the elastic bumps are rubber bumps.
Further, the metal layer has a thickness of 2 μm; the metal layer is made of simple aluminum; the thickness of the insulating layer is 10 microns; the insulating layer is a PPS film layer; the thickness of the bonding layer is 8 microns, and the material used for the bonding layer is selected from acrylic.
Preferably, the insulating layer is a PPS film layer; the PPS film layer comprises 65 parts of polyphenylene sulfide, 12 parts of polypropylene, 2 parts of monopotassium phosphate, 0.06 part of 3, 7-dimethyl-1, 6-octadiene-3-ol and 2 parts of dicyclopentadiene.
Example 6
The embodiment provides an impact-resistant electromagnetic wave shielding film for a circuit board, which comprises an insulating layer, a metal layer and an adhesive layer which are sequentially arranged, wherein a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the adhesive layer towards the adhesive layer. In this embodiment, the elastic bumps are rubber bumps.
Further, the metal layer has a thickness of 2 μm; the metal layer is made of simple aluminum; the thickness of the insulating layer is 10 microns; the insulating layer is a PPS film layer; the thickness of the bonding layer is 8 microns, and the material used for the bonding layer is selected from acrylic.
Preferably, the insulating layer is a PPS film layer; the PPS film layer comprises 65 parts of polyphenylene sulfide, 12 parts of polypropylene, 2 parts of monopotassium phosphate, 0.2 part of polyvinyl alcohol and 2 parts of dicyclopentadiene.
And (6) testing flexibility.
The flexibility of the shielding film was tested by a bending resistance test.
First, the test piece was bent in half in the longitudinal direction by applying a load of 1kg in an initial state in which the test piece was expanded to 10mm × 100mm, and then the test piece was expanded to the initial state from the bent state, and the bending and expansion were repeated a plurality of times in a set of operations, and the number of operations until cracking occurred at the bent portion (insulating layer) in the expanded state was counted, and the bending test was repeated when the sample was treated in a 1KW xenon lamp aging box for 5000 hours.
The results are shown in Table 1.
Table 1.
Figure DEST_PATH_IMAGE002
Impact resistance test
The PPS samples of the examples were subjected to impact resistance testing using GB 1043-79. The results are shown in Table 2.
Table 2.
Figure DEST_PATH_IMAGE004
The foregoing is a detailed description of the invention, which is described in greater detail and not intended to limit the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications are possible without departing from the inventive concept, and such obvious alternatives fall within the scope of the invention.

Claims (1)

1. The utility model provides an electromagnetic wave shielding film that circuit board was used to shock resistance, includes insulating layer, metal level, the tie coat that sets gradually, its characterized in that: a plurality of elastic lugs are arranged on the surface of the insulating layer; the metal layer is provided with a metal contact penetrating through the bonding layer towards the bonding layer;
a buffer layer is arranged between the insulating layer and the metal layer, and buffer cavities distributed in a grid shape are arranged in the buffer layer;
the thickness of the metal layer is 0.1-6 microns; the metal layer is made of at least one simple substance of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold; the thickness of the insulating layer is 1-25 microns; the thickness of the bonding layer is 1-25 microns, and the materials used for the bonding layer are selected from the following materials: modified epoxy resins, acrylic resins, modified rubbers, and modified thermoplastic polyimides; the buffer layer is one of a PPS film layer, a PEN film layer, a polyester film layer and a polyimide film layer;
the insulating layer is a PPS film layer; the PPS film layer comprises 60-70 parts of polyphenylene sulfide, 10-20 parts of polypropylene, 1-3 parts of potassium dihydrogen phosphate, 0.2-0.3 part of polyvinyl alcohol, 0.05-0.08 part of 3, 7-dimethyl-1, 6-octadiene-3-ol and 1-3 parts of dicyclopentadiene.
CN201611002943.3A 2016-11-15 2016-11-15 Impact-resistant electromagnetic wave shielding film for circuit board Active CN106455465B (en)

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Publication number Priority date Publication date Assignee Title
CN107835561B (en) * 2017-10-26 2020-03-27 深圳市中欧新材料有限公司 Circuit board containing electromagnetic wave shielding film and manufacturing method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102510712A (en) * 2011-11-14 2012-06-20 广州方邦电子有限公司 Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor
CN203366285U (en) * 2013-07-30 2013-12-25 南昌欧菲光科技有限公司 Touch display screen
CN103763893A (en) * 2014-01-14 2014-04-30 广州方邦电子有限公司 Electromagnetic wave shielding film and method for manufacturing circuit board with same
CN205071567U (en) * 2015-08-13 2016-03-02 东莞钱锋特殊胶粘制品有限公司 Heat dissipation buffering conductive composite forming structure of mobile electronic device
KR20160027304A (en) * 2014-08-28 2016-03-10 한양대학교 산학협력단 Frictional electricity energy generator and manufacturing method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102510712A (en) * 2011-11-14 2012-06-20 广州方邦电子有限公司 Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor
CN203366285U (en) * 2013-07-30 2013-12-25 南昌欧菲光科技有限公司 Touch display screen
CN103763893A (en) * 2014-01-14 2014-04-30 广州方邦电子有限公司 Electromagnetic wave shielding film and method for manufacturing circuit board with same
KR20160027304A (en) * 2014-08-28 2016-03-10 한양대학교 산학협력단 Frictional electricity energy generator and manufacturing method thereof
CN205071567U (en) * 2015-08-13 2016-03-02 东莞钱锋特殊胶粘制品有限公司 Heat dissipation buffering conductive composite forming structure of mobile electronic device

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