CN206611695U - A kind of electronics silica gel heat conductive pad - Google Patents
A kind of electronics silica gel heat conductive pad Download PDFInfo
- Publication number
- CN206611695U CN206611695U CN201720303608.0U CN201720303608U CN206611695U CN 206611695 U CN206611695 U CN 206611695U CN 201720303608 U CN201720303608 U CN 201720303608U CN 206611695 U CN206611695 U CN 206611695U
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- Prior art keywords
- heat
- conducting layer
- conductive pad
- heat conductive
- silica gel
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Abstract
The utility model discloses a kind of electronics silica gel heat conductive pad, including heat conductive pad main body, first heat-conducting layer and the second heat-conducting layer, first heat-conducting layer is located at heat conductive pad body top and the second heat-conducting layer is arranged at heat conductive pad bottom part body, carbon fiber layer is provided between first heat-conducting layer and the second heat-conducting layer, the first heat conduction layer surface is provided with cutting groove, the utility model passes through provided with the first heat-conducting layer and the second heat-conducting layer, be conducive to carrying out heat conduction and radiating, carbon fiber layer is soft outside but hard inside, there is good heat-conducting effect, on the one hand the mechanical strength of reinforced gasket is conducive to, on the other hand be conducive to improving heat-conducting effect, level trough and vertical channel are set to by cutting groove and level trough is mutually perpendicular to vertical channel, be conducive to regular cutting, avoid brokenly its internal stress.
Description
Technical field
The utility model is related to silica gel pad field, more particularly to a kind of electronics silica gel heat conductive pad.
Background technology
It is well known that with the development of industrial production and science and technology, people are continuous to material to propose new requirement.In electricity
Sub- appliance field, due to developing rapidly for integrated technology and package technique, electronic component, logic circuit are to light, thin, small direction
Development, caloric value is consequently increased, so that the insulating materials of high heat conduction is needed, it is effective to remove the heat that electronic equipment is produced,
The reliability of this service life for being related to product and quality.Conventional cooling means had in the past：Natural cooling, divulge information or make
With bigger casing.As heating region is more and more wider, the heat of generation is also increasing, forces electronic equipment manufacturer to have to
Take more efficiently cooling measure.Heat conductive silica gel pad is exactly a kind of the most frequently used auxiliary heat dissipation material.Thermal conductive silicon rubber cushion
Piece, which is widely used as sealant, to be used in electronic product, therefore to heat conductive silica gel pad in addition to heat transfer requirement, in addition it is also necessary to lead
Hot silica gel pad has good mechanical strength, and the mechanical strength of big logarithm heat conductive silica gel pad is poor, another aspect silicon
Rubber cushion needs cutting due to specification difference when in use, but on the one hand can cut askew during cutting, and influence is used, on the other hand, with
Meaning cutting can influence pad internal stress, therefore, invent a kind of electronics silica gel heat conductive pad necessary to solve the above problems.
Utility model content
The purpose of this utility model is to provide a kind of electronics silica gel heat conductive pad, to solve what is proposed in above-mentioned background technology
Problem.
To achieve the above object, the utility model provides following technical scheme：A kind of electronics silica gel heat conductive pad, including heat conduction
Main body, the first heat-conducting layer and the second heat-conducting layer are padded, first heat-conducting layer is located at heat conductive pad body top and the second heat-conducting layer
Heat conductive pad bottom part body is arranged at, carbon fiber layer, first heat conduction are provided between first heat-conducting layer and the second heat-conducting layer
Layer surface is provided with cutting groove.
It is preferred that, first heat-conducting layer is identical with the second heat-conducting layer thickness.
It is preferred that, the cutting groove is set to V-shaped.
It is preferred that, the cutting groove is set to level trough and vertical channel.
It is preferred that, the level trough is mutually perpendicular to vertical channel.
Technique effect of the present utility model and advantage：By provided with the first heat-conducting layer and the second heat-conducting layer, being conducive to carrying out
Heat conduction and radiating, carbon fiber layer are soft outside but hard inside, have good heat-conducting effect, are on the one hand conducive to the mechanical strength of reinforced gasket,
On the other hand be conducive to improving heat-conducting effect, level trough is set to by cutting groove and vertical channel and level trough and vertical channel are mutual
Vertically, regular cutting is conducive to, it is to avoid broken its internal stress.
Brief description of the drawings
Fig. 1 is cross-sectional view of the present utility model.
Fig. 2 is top structure schematic diagram of the present utility model.
In figure：1 heat conductive pad main body, 2 first heat-conducting layers, 3 second heat-conducting layers, 4 carbon fiber layers, 5 cutting grooves.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belongs to the scope of the utility model protection.
The utility model provides a kind of electronics silica gel heat conductive pad as shown in Figure 1-2, including heat conductive pad main body 1, first
The heat-conducting layer 3 of heat-conducting layer 2 and second, first heat-conducting layer 2 is located at the top of heat conductive pad main body 1 and the second heat-conducting layer 3 is arranged at
Carbon fiber layer 4, first heat-conducting layer 2 are provided between the bottom of heat conductive pad main body 1, the heat-conducting layer 3 of the first heat-conducting layer 2 and second
Surface is provided with cutting groove 5.
First heat-conducting layer 2 is identical with the thickness of the second heat-conducting layer 3, is advantageously implemented identical heat-conducting effect, described to cut
Cut groove 5 and be set to V-shaped, be easy to cutting, the cutting groove 5 is set to level trough and vertical channel, the level trough and vertical channel
It is mutually perpendicular to, is conducive to regular cutting, it is to avoid is broken its internal stress.
This practical operation principle：By provided with the first heat-conducting layer 2 and the second heat-conducting layer 3, being conducive to carrying out heat conduction and radiating,
Carbon fiber layer 4 is soft outside but hard inside, there is good heat-conducting effect, is on the one hand conducive to the mechanical strength of reinforced gasket, on the other hand has
Beneficial to heat-conducting effect is improved, level trough and vertical channel are set to by cutting groove 5 and level trough is mutually perpendicular to vertical channel, favorably
In rule cutting, it is to avoid broken its internal stress.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, this is not limited to
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Equivalent substitution is carried out, all within spirit of the present utility model and principle, any modification, equivalent substitution and improvements made etc.,
It should be included within protection domain of the present utility model.
Claims (5)
1. a kind of electronics silica gel heat conductive pad, including heat conductive pad main body (1), the first heat-conducting layer (2) and the second heat-conducting layer (3), it is special
Levy and be：First heat-conducting layer (2) is located at the top of heat conductive pad main body (1) and the second heat-conducting layer (3) is arranged at heat conductive pad master
Body (1) bottom, is provided with carbon fiber layer (4), first heat-conducting layer between first heat-conducting layer (2) and the second heat-conducting layer (3)
(2) surface is provided with cutting groove (5).
2. a kind of electronics silica gel heat conductive pad according to claim 1, it is characterised in that：First heat-conducting layer (2) and the
Two heat-conducting layers (3) thickness is identical.
3. a kind of electronics silica gel heat conductive pad according to claim 1, it is characterised in that：The cutting groove (5) is set to V words
Shape.
4. a kind of electronics silica gel heat conductive pad according to claim 1, it is characterised in that：The cutting groove (5) is set to water
Rise as high as the banks and vertical channel.
5. a kind of electronics silica gel heat conductive pad according to claim 4, it is characterised in that：The level trough and vertical channel are mutual
Vertically.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720303608.0U CN206611695U (en) | 2017-03-27 | 2017-03-27 | A kind of electronics silica gel heat conductive pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720303608.0U CN206611695U (en) | 2017-03-27 | 2017-03-27 | A kind of electronics silica gel heat conductive pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206611695U true CN206611695U (en) | 2017-11-03 |
Family
ID=60174295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720303608.0U Expired - Fee Related CN206611695U (en) | 2017-03-27 | 2017-03-27 | A kind of electronics silica gel heat conductive pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206611695U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110380156A (en) * | 2019-08-08 | 2019-10-25 | 新纶科技（常州）有限公司 | A kind of high-strength composite heat-conducting silica gel sheet for new energy car battery |
| CN111070323A (en) * | 2019-12-20 | 2020-04-28 | 苏州高泰电子技术股份有限公司 | Ultra-soft heat-conducting silicon wafer die cutting processing technology |
-
2017
- 2017-03-27 CN CN201720303608.0U patent/CN206611695U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110380156A (en) * | 2019-08-08 | 2019-10-25 | 新纶科技（常州）有限公司 | A kind of high-strength composite heat-conducting silica gel sheet for new energy car battery |
| CN111070323A (en) * | 2019-12-20 | 2020-04-28 | 苏州高泰电子技术股份有限公司 | Ultra-soft heat-conducting silicon wafer die cutting processing technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20171103 Termination date: 20200327 |