JPH11163564A - Electronic apparatus and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dissipate heat of electronic components from the components directly, from leads of the components or from a substrate directly to a radiator, to transfer the heat to a case without medium of air, to reduce assembly cost without increasing the cost of components, and to simplify assembly steps although the heat from the radiator is dissipated through the medium of the surrounding air or radiating grease. SOLUTION: An electronic apparatus is comprised of a circuit board 1 on which heat producing electronic components are mounted on its mounting surface and a case 24 for hermetically housing the board. A radiator 15 exhibiting a high thermal conductivity is disposed between the underside of the circuit board 1 and the inner surface of the case 24 for dissipating heat from the outer surface of the case, by supporting the underside of the circuit board in intimate contact with the inner surface of the case.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device and a method of manufacturing the electronic device, and more particularly, to a board unit including at least an electronic component including a heating element and a board on which the electronic component is mounted, and a device for incorporating the unit inside. The present invention relates to an electronic device including a housing.

[0002]

2. Description of the Related Art Conventionally, a heat radiator of an electronic device having a built-in board on which electronic components generating heat are mounted inside a housing has been known.
It was configured as shown in the external perspective view of FIG.
Another conventional heat dissipation structure is disclosed in JP-A-08-139.
The one described in Japanese Patent Publication No. 236 is known. In FIG. 8, 1 is a printed circuit board (hereinafter referred to as a board), 2 is a transformer, 3 is an aluminum electrolytic capacitor, 4 is a thermistor, 6
Is a primary choke coil, 7 is a diode, 8 is a FET, 65 is a heat sink, and these constitute main components of a power supply. These will be described below by taking a power supply as an example. There are various types of circuit boards without limitation. In FIG. 8, a lower case 1 for storing the board unit is provided.
24 are shown.

Next, FIG. 9 shows a cross section in a state where the board unit is housed in a case. In FIG. 9, the same reference numerals are given to the components already described, and the description thereof is omitted. 133 is an upper case for forming a pair with the lower case 124 and housing the board unit. Reference numeral 34 denotes a screw tightening column provided on the case 133 and coupled to the screw tightening column 124a of the lower case 124.
And 35b are case fastening screws. Reference numeral 36 denotes a fitting portion of the screw post, and reference numerals 52 to 59 denote leads of electronic components mounted on the board. Reference numeral 165 denotes a radiator plate for dispersing generated heat and dissipating the heat generated by the screw 8a indicating the heat-generating component (of course, the screw is not limited to the screw). Thus, in the conventional electronic device, the heating element 7 is connected to the heat radiating plate 16.
5 is provided so as to be in contact therewith, heat is transmitted from this contact portion, diffused to the heat radiating plate 165, and the diffused heat is released to the surrounding environment to release heat.

Further, in the example disclosed in Japanese Patent Application Laid-Open No. 08-139236, a heat radiation grease is filled between the heat radiating plate and the case to release air from the heat radiating plate to the air in the case. The heat radiation efficiency has been improved. In this case, as the effect of the heat radiation grease, the heat transfer and diffusion are improved by the adhesion to the heat radiating plate and the case and the effect of the high thermal conductivity, and the heat can be radiated from the entire case to the outside.

[0005]

However, the above conventional example has the following disadvantages. That is, in the configuration example shown in FIG. 8, since the members responsible for heat radiation are limited to the heat radiating plates 165 to the plate members, they can be applied only to electronic components that can efficiently radiate heat by contacting these members. there were. In addition, the heat sink is made of Al
(Aluminum) was often used as the material, and the cost was high.

In order to solve this problem, iron or brass materials are used to reduce material costs, soldering process costs, and the like. However, these metal materials have poor heat radiation characteristics. Therefore, there was a limit to use. In other words, Al could not be soldered, and therefore, a step of screwing was basically provided separately from the step of soldering parts, or a step such as soldering was constituted by using it in combination with other material parts . Iron and brass materials are used so that they can be soldered together with components. However, since brass is expensive, iron materials may be used when the temperature rise is not so large. However, iron rusted, which caused a management problem. Especially when rusted, the solder did not stick, so it was quite difficult to handle.

On the other hand, the method disclosed in Japanese Patent Application Laid-Open No. 08-139236 improves the characteristics themselves, but has the following disadvantages. That is, since the heat radiating plate is still provided as shown in FIG. 8, the cost is further increased as a whole. Further, it is described that the heat radiation grease is appropriately cured after being applied and filled, but this step is also very troublesome and expensive. That is, in the coating process, it is difficult to control the amount of coating and to maintain the uniformity of the coated surface. If it is difficult to ensure uniformity, it is conceivable that the heat sink may be brought into close contact with the heat radiating plate by pressurizing and pressing it. In addition, the management before curing includes the storage posture, temperature, and the like.If the posture is poor, there is leakage of grease, if the temperature is low, the curing time will be long, and if the temperature is high, the reliability of parts will be impaired. It was dangerous.

Therefore, the present invention has been made in view of the above-mentioned problems, and has the following objects. 1. In addition to heat radiation of specific parts, heat radiation of parts which cannot be attached to the heat radiating plate in the past is also performed.

[0009] 2. The heat radiation from the heat sink is heat radiation to the surrounding air or heat radiation with heat radiation grease interposed.On the other hand, heat is directly radiated from the component direct or component lead or the board to the radiator, and the air is released from there. Transfers heat to the case without intervention.

[0010] 3. If possible, do not provide a heat sink.

4. Does not increase parts cost.

5. Lower assembly costs.

6. Simplify the assembly process.

[0014]

Means for Solving the Problems The above-mentioned problems are solved,
According to an embodiment of the present invention, there is provided an electronic device including a circuit board on which a heat-generating electronic component is mounted on a mounting surface, and a case body for hermetically sealing and housing the circuit board. In the circuit board, the back surface side of the circuit board, a heat radiator of good thermal conductivity to perform heat radiation from the outer surface side of the case body by holding in close contact with the inner surface side of the case body, It is characterized by being interposed between the back side and the inner side of the case body.

[0015] Further, a locking hole is formed in the circuit board,
A through hole is formed in the radiator, and a substrate holding member having a shape portion to be locked to an edge of the locking hole is extended from the inner surface side of the case body, and The heat radiator is interposed between the back surface side of the circuit board and the inner surface side of the case body by sequentially inserting the through hole portion and the locking hole portion.

[0016] Further, a plurality of the substrate holding member, the through-hole portion, and the locking hole portion are provided, and the circuit board is brought into close contact with the inner surface side of the case body at multiple points.

Further, the shape portion is further formed with a portion for holding the circuit board so as to move to the inner surface side of the case body, and compresses the heat radiator in a thickness direction. . Further, a lead hole portion for escaping a lead of the electronic component extending from the back side of the circuit board is further formed in the heat radiator.

Further, a component radiator for directly radiating the electronic component mounted on the mounting surface side of the circuit board is further provided.

Further, in order to closely contact the component heat radiator between the other inner surface side of the case body and the electronic component, a pressing member formed so as not to interfere with the tall electronic component is further provided. It is characterized by.

Further, a heat radiator having good thermal conductivity is provided between the component heat radiator and the other inner surface of the case body.

Further, the heat radiator provided on the substrate surface side where the tall component is present is characterized in that a specific portion of the heat radiator is removed at the position of the tall component.

Further, all or any of the heat radiator, the component heat radiator, and the shape heat radiator are constituted by an elastic body or a viscoelastic body which retains its own shape.

Further, all or any of the heat radiator, the component heat radiator, and the shape heat radiator is characterized by being filled with an electrically insulating material having high thermal conductivity as a filler.

Further, the elastic body is a silicone elastomer containing silicone rubber.

Further, the electric insulator is made of Al 2 O 3, SI
It is characterized by being one of C and AlN.

Further, the electric insulator is a filler obtained by applying an insulating coat to a metal.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is an external perspective view of an electronic apparatus, showing a first embodiment. In this drawing, 1 is a substrate on which electronic components are mounted in a substrate unit of an electronic device, 2 is a transformer, 3 is an aluminum electrolytic capacitor, 4 is a thermistor, 5 is a resistor, 6 is 1
Next choke coil, 7 is a diode, 8 is a FET, 9 is a board hole through which fastening columns of the upper and lower cases pass, 10, 11, and 1.
Reference numerals 2, 13 and 14 are engagement holes of the substrate holding hooks.

Reference numeral 15 denotes a heat radiator which is in close contact with the substrate and the inner surface of the case and transmits heat of the heat generator to the case to radiate heat. Reference numerals 16 and 17 denote heat radiator holes through which fastening columns of the upper and lower cases pass. Reference numerals 18, 19, 20, 21, 22, and 23 denote hook through holes through which the substrate holding hooks pass through the radiator and engage with the engagement holes of the hooks on the substrate.

Next, reference numeral 24 denotes a lower case of one of the cases for accommodating the board unit, and reference numerals 25 and 26 denote fastening columns for coupling the other cases to the columns to fasten the cases. Reference numerals 28, 29, 30, 31, 32 denote hooks for holding the substrate. Next, in FIG. 2, which is a cross-sectional view taken along the line XX of FIG. 1, reference numeral 33 denotes another pair of the lower case 24, which is one case shown in FIG. The upper case. Further, 35a and 35b are screws for fastening the case, 36 is a fitting portion of the case fastening column, 37a, 37b, 36c, and 37d are component leads, and 28a and 30a are guide portions of the hook. As described above, the inclined surface is integrally formed. The upper and lower cases 2
Reference numerals 4 and 33 do not necessarily indicate a vertical relationship. Power cords and signal lines are not shown.

In the above configuration, in order to assemble into the state shown in FIG. 2, first, the heat radiator 15 is inserted into the radiator holes 16, 26 in the fastening columns 25, 26 of one lower case 24.
17 is fixed to the inner surface of the case through the hook through holes 18, 19, 20, 21, 22, 23 through the hooks 27, 28, 29, 30, 31, 32. Further, a pair of holes 9 (the other is not shown) of the substrate 1 and engagement holes 10, 11, 1
The hooks are engaged with the edges of the engagement holes through 2, 13, and 14 (partially not shown). At this time, hook guides 28a,
30a hits the end face of the engagement hole of the substrate, and the hook is elastically deformed. And when the engagement hole passes over the vertex of the guide, the hook is hooked on the engagement hole. At this time, by using a radiator that has elastic or viscoelastic properties,
The hook and the heat radiator are set so that the heat radiator is slightly elastically deformed when the engagement hole crosses the top of the hook guide. As a result, when the hook is hooked on the engagement hole, the radiator is slightly elastically deformed, whereby the radiator can apply a reaction force to the substrate and the case. In other words, the generation of a force can be brought into a close contact state. Since the hooks are present at a plurality of points, the deformation of the heat radiator does not occur at one point but at a single point. This means that uniform adhesion can be obtained. Further, according to FIG. 2, since the heat radiator is assembled by inserting the lead into the heat radiator by the component lead in the process of assembling, the lead and the heat radiator are assembled in a close contact state. The state obtained in this manner is a state in which the radiator is in close contact with the component leads, in close contact with the substrate, and in close contact with the inner surface of the case. The radiator is, of course, made of a material having high thermal conductivity. Thus, the heat generated from the heat-generating component is transmitted from the component lead and the substrate in contact with the component, the solder bonded to the lead, and the board pattern to the heat radiator, diffused and conducted by the heat radiator, and transmitted from the large area to the lower case 24. Is released to the outside air. With this configuration, the conventional heat radiating plate can be eliminated, and heat generated from other electronic components that cannot contact the heat radiating plate can be efficiently radiated. In addition, since the heat radiator has its own shape, assembling can be easily performed as described above. In addition, even after the assembly, the process can immediately proceed to the next step. In this configuration, a radiator is added to the conventional component configuration, and it is not necessary to provide a radiator plate. Thus, the process of assembling the heat radiator simply involves placing the heat radiator in the case. Conventionally, there are various factors to assemble the heat sink so that it does not come off, such as assembling the heat sink and the heat generating component, assembling or soldering the heat sink to the board, and occupying the space on the board of the heat sink. Therefore, it is overwhelmingly advantageous to only dispose the heat radiator. Even in terms of parts cost, the heat sink may require additional screws or additional parts such as insulating material between the heat sink and the parts. It can be said.

As described above, the present configuration can be made a very advantageous configuration with respect to the related art.

Next, FIG. 3 shows a second embodiment, and FIG.
3 is a view corresponding to a cross-sectional view taken along line XX of FIG. In the figure, the same reference numerals are given to the components already described, and the description thereof will be omitted. Reference numerals 38, 39, 40, and 41 denote hooks for holding the substrate, which are the features of FIG. 39
a, 40a (others not shown) show the guide part of the hook,
Reference numerals 38b, 39b, 40b, and 41b denote substrate biasing tapered portions, respectively. As shown, hooks 38 for holding the substrate are provided.
By forming 39, 40, and 41, the taper portion can be set without setting the dimensional relationship between the hook and the heat radiator in the height direction (or the thickness direction of the heat radiator 15) as described above. With this setting, the end face of the substrate can be brought into contact with the tapered portion in a wide range. For this reason, the biasing force to the substrate and the heat radiator is given by the vertical force of the contact portion between the tapered portion and the substrate due to the elastic force of each hook.

FIG. 4 shows a third embodiment, which corresponds to a sectional view taken along line XX of FIG. In this figure, the same reference numerals are given to the components already described, and the description thereof will be omitted, and 43, 44, 45, 46,
Reference numerals 47, 48, 49, 50, and 51 denote escape portions for component leads formed in the radiator 15 in advance. 52, 53,
Numerals 54, 55, 56, 57, 58 and 59 are component leads, respectively. Due to the configuration as shown in FIG. 4, that is, the radiator is partly removed from the component lead, so that the pressure applied when the radiator 15 is brought into close contact with the substrate 1 during assembly is extremely small. You can do it. This is an example of the above-mentioned example in which the heat generation of the parts is relatively effective as compared with the first and second embodiments.

FIG. 5 shows a fourth embodiment.
It is a figure corresponding to the X-ray arrow sectional drawing. In this figure,
The same reference numerals are given to the components already described and the description is omitted, and 15a and 15b are radiators provided on the side opposite to the substrate 1 with respect to the radiator 15.
Here, the heat dissipator 15 and the heat dissipators 15a and 15b can be formed integrally with each other or separately. Reference numeral 33a denotes an urging piece integrally provided in the case 33 for urging and adhering the heat radiator 15b to an electronic component mounted on the substrate 1. This biasing piece 33a
Needless to say, in order to further increase the degree of adhesion between the component and the heat radiator, it is possible to dissipate heat from both the front surface and the back surface of the substrate 1 with this configuration. became.

In FIG. 5, the radiators 15a, 15
b is configured to mainly radiate heat to the air inside the case, but by changing the configuration of the radiator, for example, by partially increasing the thickness of the radiator, the radiator is brought into close contact with the inner surface of the case, and the air is released from the radiator. It is also possible to configure so that heat is directly transmitted to the upper case 33 without going through. In any case, it is possible to radiate heat from both sides of the substrate 1 and also from the components themselves through the radiator in this way.

FIG. 6 shows a fifth embodiment.
It is a figure corresponding to the X-ray arrow sectional drawing. In this figure,
The components already described are denoted by the same reference numerals and description thereof will be omitted. When 60 is engaged with the case at 60b and 60c, 60a is formed so as to urge the radiator 15a against the component at 60a. This is an elastic biasing member made of an elastic body. By providing a separate biasing member in this way,
The size (length, thickness, size, etc.) and the material of the urging member can be set more appropriately as compared with a case where the urging member is formed of an integral member. This means that, for example, when the structure is complicated or the strength is large, the urging force is increased and the degree of adhesion can be increased depending on the structure, strength, and the like of the heat-radiated component.

FIG. 7 shows a sixth embodiment.
It is a figure corresponding to the X-ray arrow sectional drawing. In this figure,
The components already described are denoted by the same reference numerals and description thereof will be omitted. Reference numeral 61 denotes a heat radiator, and 62 denotes a high heat conductive air insulating filler dispersed and filled in the heat radiator 61. By configuring as described above and filling the filler at a high density, the thermal conductivity of the heat radiator can be further increased. Here, the filler comes into contact with, for example, component leads, and since the filler is densely packed, it must be an electrical insulator to provide electrical insulation as a radiator. Considering the point of high thermal conductivity, a ceramic or metal filler such as A2O3, SIC, AlN, or the like, or a metal filler is insulated. As for the insulating coating material of the metal filler, it is conceivable that the insulating coating material which is in contact with the lead may be broken, but the other insulating materials provide the necessary insulating properties.

Further, through the above-described embodiment, a specific material for the heat radiator is, for example, silicon rubber, which is a viscoelastic material and, at the same time, is capable of imparting high thermal conductivity. It can be adopted. It goes without saying that other materials that can obtain similar characteristics can be used.

As described above, heat can be radiated from components that cannot be attached to the radiator plate. Further, heat can be radiated through many paths such as component leads, patterns, and boards. When there is a component on the pattern surface, heat can also be radiated from the component itself. A heat dissipation path to the outside of the case could be configured without passing through the internal air. Heat sink can be eliminated. Therefore, the provision of the heat radiator is very effective in that it does not increase the cost and is easy to assemble. In addition, the radiator, the substrate, and the case can be uniformly adhered, and the heat conduction efficiency is high.

In order to closely contact the heat radiator with the substrate and the case, the dimensions of the hook substrate holding member must be determined usually in consideration of the dimensional variation of the heat radiator, Young's modulus, and the like. By setting the contact shape as shown in FIG. 3, the contact can be made within the range of the taper,
Hook size management becomes easy.

Further, as shown in FIG. 4, the heat radiator can be configured so as not to contact the lead, so that the heat radiator and the substrate can be uniformly contacted with a small force.

Also, since the hook is formed integrally with the case, there is no increase in cost. In addition, as shown in FIG. 5, the heat radiator exists not only on one surface side of the substrate but also on the other surface side, so that it contacts parts that cannot be contacted only on one surface side. Is possible,
The heat transfer efficiency can be further improved.

The radiator itself is also urged as shown in FIG. 5 so that the degree of adhesion is increased and a higher heat transfer effect can be obtained. Further, as shown in FIG. 6, when the heat radiator is incorporated, it is possible to prevent the heat radiator from being extremely deformed, so that it is possible to prevent the heat radiator from being destroyed or being unable to be incorporated. When the temperature rises during use, it is possible to prevent the heat dissipating body from changing from elastic deformation to plastic deformation, releasing the urging force, and reducing the degree of adhesion.

Further, the close contact state of the heat radiator can be easily achieved, and a complicated shape can be easily handled. In particular, the use of a viscoelastic body is effective because it has a function of absorbing shock and vibration generated as a product. Further, higher heat transfer characteristics can be achieved by the filler, and a radiator having both viscoelastic characteristics and high heat conduction characteristics can be obtained. A filler having both high thermal conductivity and electrical insulation can be obtained, and a sufficiently satisfactory electrical insulation can be obtained, and a filler having the highest level of thermal conductivity currently available can be obtained. In addition, a heat radiator that is in close contact with the substrate and the case is provided between the substrate and the inner surface of the case. By doing so, the heat of the heat generating element is transmitted from the lead to the radiator through the radiator and the lead and the component through the board, and further from the radiator to the case, so that the heat does not pass through the radiator plate. Heat can be sufficiently released to the outside.

That is, since heat is not radiated through the air having extremely poor heat conduction characteristics in the case like a heat radiating plate, the heat radiating plate can be eliminated. In addition, the heat dissipating body has a predetermined shape with flexibility by a process such as molding as a heat dissipating body in advance, so it is not a difficult process such as coating as heat dissipating grease, but simply a case or a substrate. And assemble it in a simple process.

Also, since the substrate is held at multiple points in the case, and since the heat radiator is located between the substrate and the case, holding the substrate at multiple points on the case provides an even adhesion effect.

Further, by the elastic force of the holding member of the substrate,
By applying an urging force in the direction in which the radiator is in close contact, the radiator is in uniform contact, and the degree of adhesion can be increased.

Further, since the case and the substrate holding member are integrally formed, it is possible to reduce the cost of forming the holding member separately.

Further, by forming the radiator to escape to the area where the lead is located so as not to contact the lead, when the radiator is brought into close contact with the substrate, deformation or deformation of the radiator due to insertion of the lead into the radiator is achieved. The reaction force due to frictional resistance is eliminated, making it possible to assemble easily.

Further, the heat radiator is provided on both sides of the substrate,
This improves the heat radiation efficiency. That is, since the heat of the heat generating element is directly transmitted from the main body of the component to the heat radiator, the heat is diffused by the heat radiator over a wide surface, so that the heat radiation efficiency can be improved.

Further, since the pressing member is provided separately from the case in order to increase the degree of close contact between the heat radiator on the component side and the component, the elasticity of the pressing member can be set appropriately.

When the height of the component is high, the radiator is not required to be forcibly deformed by escaping the radiator at that portion, or the radiator can be prevented from being deformed forcibly. It is not necessary to take difficult steps such as molding. Here, the effect of eliminating the necessity of forcibly deforming is that it is possible to prevent the radiator from being destroyed or to reduce the degree of adhesion of the radiator by forcibly deforming.

Further, since the heat radiator is made of an elastic or viscoelastic material which retains its shape, the heat radiator can be deformed relatively freely, and the substrate can be uniformly pressed by pressing at multiple points. Adhesion can be obtained. By maintaining the self-shape, handling at the time of assembling is good, and there is no fear of running out after assembling. In addition, since the effect of providing viscosity can consume energy of vibration / shock as heat, it is effective in preventing destruction of equipment due to vibration / shock.

In addition to the fact that the radiator has high thermal conductivity and is filled with an electrically insulating filler, the radiator is required to have elasticity or viscoelasticity. In general, resins have poor thermal conductivity compared to metals. Therefore, thermal conductivity is good by adding ceramics etc. as a filler, and
The characteristics of the radiator can be satisfied. Here, being electrically insulating is necessary because of the presence of the lead or the presence of the solder.

Further, since the heat radiator is made of silicon rubber, the silicon rubber is a material compatible with the viscoelastic body and also has thermal conductivity, and thus has a characteristic that it can be formed into a desired shape in advance.

Further, by using ceramics for the filler, the thermal characteristics can be improved, and the electrical insulation can be further improved while satisfying the electrical insulation properties.

In order to further improve the heat radiation,
By using a metal with an insulating cord as the filler, even if the insulating cord of the filler is broken in the vicinity of the component lead, it does not cover the whole, so that the electrical insulation can be maintained.

As described above, according to the present invention, it is possible not only to radiate heat of a specific component but also to radiate a component which cannot be attached to a radiator plate conventionally. In contrast to heat radiation to the surrounding air or heat radiation through heat radiation grease, heat is directly radiated from the component direct or component lead, or from the substrate to the radiator, and then transferred to the case without air. It is possible to provide an electronic device and a method of manufacturing an electronic device that can reduce the assembly cost without increasing the component cost and can simplify the assembly process.

[0058]

[Brief description of the drawings]

FIG. 1 is an external perspective view of an electronic device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line XX of FIG.

FIG. 3 is a view corresponding to a cross-sectional view taken along line XX of FIG. 1 according to the second embodiment.

FIG. 4 is a view corresponding to a cross-sectional view taken along line XX of FIG. 1 in the third embodiment.

FIG. 5 is a view corresponding to a cross-sectional view taken along line XX of FIG. 1 in the fourth embodiment.

FIG. 6 is a view corresponding to a cross-sectional view taken along line XX of FIG. 1 in the fifth embodiment.

FIG. 7 is a view corresponding to a cross-sectional view taken along line XX of FIG. 1 in the sixth embodiment.

FIG. 8 is an external perspective view of a conventional example.

FIG. 9 is a fragmentary sectional view of a conventional example.

[Explanation of symbols]

Reference Signs List 1 board unit (circuit board) 2 transformer (electronic component) 3 aluminum electrolytic capacitor (electronic component) 4 thermistor (electronic component) 5 resistor (electronic component) 6 primary choke coil (electronic component) 7 diode (electronic component) 8 FET (Electronic components) 9 Board hole 10-14 Engagement hole (locking hole) 15 Heat radiator 16, 17 Heat radiator hole 18-23 Hook through hole (through hole) 25, 26 Fastening column 27-32 Board holding Hook (substrate holding member) 24 upper case 33 lower case 36 fitting part 37a, 37b, 37c, 7d component lead 38b, 39b, 40b, 41b substrate biasing taper part (part) 43-51 escape part of component lead 52-59 Component lead 15a, 15b Heat radiator (component heat radiator) 60 Elastic urging member 61 Heat radiator 62 Filler (filler)

Claims (26)

[Claims] 1. An electronic apparatus comprising: a circuit board on which a heat-generating electronic component is mounted on a mounting surface; and a case body for hermetically sealing and housing the circuit board. A radiator having good thermal conductivity, which releases heat from the outer surface side of the case body by holding it in close contact with the inner surface side of the case body, is disposed between the back surface side of the circuit board and the inner surface side of the case body. An electronic device characterized by being interposed in an electronic device. 2. A board holding member having a locking portion formed in the circuit board, a through-hole formed in the radiator, and having a shape portion to be locked to an edge of the locking hole. The radiator is extended from the inner surface side of the case body, and the through-hole portion and the locking hole portion are sequentially inserted into the board holding member, so that the heat radiator is connected to the back surface side of the circuit board and the case. The electronic device according to claim 1, wherein the electronic device is interposed between the inner surfaces of the body. 3. The circuit board according to claim 2, wherein a plurality of said board holding members, said through holes and said locking holes are provided, and said circuit board is brought into close contact with said inner surface side of said case body at multiple points. Item 3. The electronic device according to Item 2. 4. The shape portion further includes a portion for holding the circuit board so as to move to the inner surface side of the case body, and compresses the heat radiator in a thickness direction. The electronic device according to claim 2. 5. The radiator according to claim 1, wherein a lead hole portion for escaping a lead of the electronic component extending from a back surface side of the circuit board is further formed in the radiator. The electronic device according to claim 1. 6. The device according to claim 1, further comprising a component heat radiator for directly radiating the electronic component mounted on the mounting surface side of the circuit board. Electronics. 7. In order to closely contact the component heat radiator between the other inner surface side of the case body and the electronic component,
The electronic device according to claim 6, further comprising a pressing member formed so as not to interfere with the tall electronic component. 8. The electronic device according to claim 6, further comprising a heat radiator having good thermal conductivity interposed between the component heat radiator and the other inner surface of the case body. 9. A radiator provided on a substrate surface side where a tall component is present, wherein a specific portion of the radiator is removed at a position of the tall component. 7. The electronic device according to 6. 10. The heat radiator, the component heat radiator and / or the shape heat radiator are all formed of an elastic body or a viscoelastic body which retains its shape. An electronic device according to claim 8. 11. The heat radiator, the component heat radiator, and / or the shape heat radiator are filled with an electric insulator having high thermal conductivity as a filler.
An electronic device according to claim 1. 12. The apparatus according to claim 10, wherein the elastic body is a silicone elastomer containing silicone rubber.
An electronic device according to claim 1. 13. The electric insulator is made of Al 2 O 3, SI
2. The method according to claim 1, wherein the material is one of C and AlN.
2. The electronic device according to 1. 14. The electronic device according to claim 11, wherein the electric insulator is a filler obtained by applying an insulating coat to a metal. 15. A method of manufacturing an electronic device, comprising: a circuit board on which a heat-generating electronic component is mounted on a mounting surface; and a case body for hermetically sealing and housing the circuit board. A heat-radiating body having good thermal conductivity to release heat from the outer surface side of the case body by holding the heat-dissipating body from the outer surface side of the case body, In order to be interposed between the sides, a locking hole is formed in the circuit board, a through-hole is formed in the radiator, and a shape portion is formed to be locked to an edge of the locking hole. A board holding member is extended from the inner surface side of the case body, and the radiator is inserted through the board holding member in order through the through-hole portion and the locking hole portion, so that the back surface of the circuit board is removed. Characterized by being interposed between the inner side of the case body and the inner side of the case body. Manufacturing method of electronic equipment. 16. A method according to claim 16, wherein a plurality of said board holding members, said through holes and said locking holes are provided, and said circuit board is brought into close contact with said inner surface side of said case body at multiple points. Item 16. A method for manufacturing an electronic device according to item 15. 17. The radiator is further formed by compressing the radiator in a thickness direction, wherein the shape portion further forms a portion for holding the circuit board so as to move to the inner surface side of the case body. 17. The method for manufacturing an electronic device according to claim 15, wherein a variation in the thickness of the electronic device is absorbed. 18. The heat radiator according to claim 15, wherein said heat radiator is provided with a lead hole portion for escaping a lead of said electronic component extending from a back side of said circuit board. A method for manufacturing the electronic device according to claim 1. 19. The electronic device according to claim 15, further comprising a component radiator that directly radiates the electronic component mounted on the mounting surface side of the circuit board. Manufacturing method of electronic equipment. 20. A pressing member, which is formed so as not to interfere with the tall electronic component, in order to closely contact the component heat radiator between the other inner surface of the case body and the electronic component. The method for manufacturing an electronic device according to claim 19, wherein: 21. The electronic apparatus according to claim 19, further comprising a heat radiator having good thermal conductivity interposed between the component heat radiator and the other inner surface of the case body. Production method. 22. An elastic body or a viscoelastic body which holds the self-shape of all or any of the heat radiator, the component heat radiator and the shape heat radiator. 2. The method for manufacturing an electronic device according to claim 1. 23. The radiator according to claim 22, wherein all or any of the radiator, the component radiator, and the shape radiator are filled with a high thermal conductivity electrical insulator as a filler. Manufacturing method of electronic equipment. 24. The method according to claim 22, wherein a silicone elastomer containing silicone rubber is used for the elastic body. 25. The electric insulator, wherein Al 2 O 3, SI
The method for manufacturing an electronic device according to claim 23, wherein one of C and AlN is used. 26. The method for manufacturing an electronic device according to claim 23, wherein a filler obtained by applying an insulating coat to a metal is used for the electric insulator.