JP4676304B2 - Board module and electrical junction box - Google Patents

Board module and electrical junction box Download PDF

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JP4676304B2
JP4676304B2 JP2005304782A JP2005304782A JP4676304B2 JP 4676304 B2 JP4676304 B2 JP 4676304B2 JP 2005304782 A JP2005304782 A JP 2005304782A JP 2005304782 A JP2005304782 A JP 2005304782A JP 4676304 B2 JP4676304 B2 JP 4676304B2
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circuit board
case
terminal
board
electrical junction
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JP2007116808A (en
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文和 内見
哲也 岡田
慎 長谷川
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THE FURUKAW ELECTRIC CO., LTD.
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THE FURUKAW ELECTRIC CO., LTD.
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本発明は自動車の電気接続箱などで使用される、回路基板が収納された基板モジュールと、該基板モジュールを収納してなる電気接続箱に関する。   The present invention relates to a board module that stores a circuit board and is used in an electrical connection box of an automobile and the like, and an electric connection box that houses the board module.

従来、電気接続箱では、回路基板がケースの内部中央に配置されていた(特許文献1参照)。
また近年では、回路基板を小型のケース内に一次収納して基板モジュールとし、該基板モジュールを電気接続箱内にさらに収納する態様も出てきた。
いずれにしても回路基板はケースの内部中央に配置されていた。
Conventionally, in an electrical junction box, a circuit board has been arranged at the center inside the case (see Patent Document 1).
In recent years, there has also been a mode in which a circuit board is temporarily housed in a small case to form a board module, and the board module is further housed in an electrical junction box.
In any case, the circuit board was arranged at the center inside the case.

特開平10−032914号公報Japanese Patent Laid-Open No. 10-032914

しかし近年、例えば自動車の電気接続箱に使用される回路基板上にはリレーやヒューズなどの発熱部品が搭載されるようになっており、このような構成の基板モジュールだと回路基板上で発生した熱をケース外に放出することが困難であった。
またこのような基板モジュールでは小型化の要請が高かったが、回路基板の周囲のスペースが無駄になっていた。
However, in recent years, heat generating parts such as relays and fuses have been mounted on circuit boards used in, for example, electric junction boxes of automobiles. It was difficult to release heat out of the case.
In addition, there is a high demand for miniaturization of such a board module, but the space around the circuit board is wasted.

そこで本発明の目的は、車載に好適で、放熱性が良く小型化が容易な基板モジュールと電気接続箱を提供することにある。 SUMMARY OF THE INVENTION An object of the present invention is to provide a board module and an electrical junction box that are suitable for in-vehicle use, have good heat dissipation and can be easily downsized.

本発明の電気接続箱に用いられる基板モジュールは、メタルコアを備えた回路基板と、該回路基板の該メタルコアに繋がるスルーホールに接続され、先端が前記回路基板の一面から突出した状態に固定された端子と、該回路基板を収納する放熱性を備えたケースを有する基板モジュールであって、前記回路基板の前記端子が突出した一面に絶縁性かつ変形性を有する熱伝導シートが密着固定されるとともに、該熱伝導シートの前記回路基板固定面とは反対側の面には前記ケースが密着固定され、前記ケースには、前記端子の先端の該当位置に該先端から逃げる態様であるとともに、前記端子の先端に押されて変形した前記熱伝導シートが密着固定する凹み部が形成されていることを特徴とする。 The board module used in the electrical junction box of the present invention is connected to a circuit board having a metal core and a through hole connected to the metal core of the circuit board, and the tip is fixed in a state protruding from one surface of the circuit board. a terminal, a substrate module having a case having a heat dissipation for housing the circuit board, wherein the one surface where the terminals are projected in the circuit board, the heat conductive sheet is fixed tight adhesion with insulating and deformability In addition , the case is closely fixed to the surface of the heat conductive sheet opposite to the circuit board fixing surface, and the case has a mode of escaping from the tip to a corresponding position of the tip of the terminal, A concave portion is formed in which the thermally conductive sheet deformed by being pushed by the tip of the terminal is closely attached .

本発明により、車載に好適で、放熱性が良く小型化が容易な基板モジュールと電気接続箱を提供することができる。 According to the present invention, it is possible to provide a board module and an electrical junction box that are suitable for in-vehicle use, have good heat dissipation, and can be easily downsized.

以下本発明の一実施形態となる基板モジュール1について図1に示す。
図1に示すように基板モジュール1は、自動車の電気接続箱に応用した例を示し、回路基板2と、該回路基板2にスルーホール3を介してはんだで接続され先端4aが前記回路基板2の一面2aから突出した端子4と、該回路基板2を収納するケース5を有する。
A substrate module 1 according to an embodiment of the present invention is shown in FIG.
As shown in FIG. 1, the board module 1 shows an example applied to an electric junction box of an automobile. The circuit board 2 is connected to the circuit board 2 with solder through a through hole 3, and the tip 4a is connected to the circuit board 2 as shown in FIG. Terminal 4 projecting from one surface 2a, and a case 5 for housing the circuit board 2.

図2は回路基板2の詳細を示す。
回路基板2はいわゆるメタルコア基板であって、例えば、図2に示すように、銅などの熱伝導性の良好な金属からなる板状の芯材41を、2枚の絶縁被覆42、42でサンドイッチ状に挟み込んだものであり、その一面2aと他の面2bに貫通するスルーホール3を形成し、その表面に銅箔部44を形成するとともに、絶縁被覆42,42上に回路パターン45を適宜形成し、それらを絶縁性のソルダーレジスト48でさらに被覆し、スルーホール3内にコネクタ8等の端子4を挿通し、はんだ47で固定した構造である。
このような回路基板2は均熱化特性に優れ、自動車用の電気接続箱の回路基板2として非常に好適に利用されることができる。
なお絶縁被覆42のところにさらに銅箔からなる内層パターンを形成し、全体としてさらに複雑な回路パターンを形成することで高機能化することも可能である。
FIG. 2 shows details of the circuit board 2.
The circuit board 2 is a so-called metal core board. For example, as shown in FIG. 2, a plate-like core material 41 made of a metal having good thermal conductivity such as copper is sandwiched between two insulating coatings 42 and 42. The through-hole 3 penetrating the one surface 2a and the other surface 2b is formed, the copper foil portion 44 is formed on the surface, and the circuit pattern 45 is appropriately formed on the insulating coatings 42 and 42. In this structure, they are further covered with an insulating solder resist 48, and the terminals 4 such as connectors 8 are inserted into the through holes 3 and fixed with solder 47.
Such a circuit board 2 has excellent temperature-uniforming characteristics, and can be used very suitably as the circuit board 2 of an electric junction box for automobiles.
It is also possible to enhance the function by forming an inner layer pattern made of copper foil at the insulating coating 42 and forming a more complicated circuit pattern as a whole.

図1に示すように、回路基板2の一面2aには抵抗やコンデンサなどの各種搭載部品7が搭載されている。回路基板の他の面2bにはリレー9やコネクタ8が搭載されている。
端子4は例えばコネクタ8と回路基板2に固定され、図示しないヒューズやワイヤーハーネスと回路パターンを電気的に接続するものである。
コネクタ8は回路基板2の他の面2b上に固定され、上記のワイヤーハーネスのコネクタやヒューズと接続されるものである。
回路基板2の一面2aには絶縁性の熱伝導シート6が密着固定され、該熱伝導シート6の回路基板固定面とは反対側の面にはケース5が密着固定されている。
熱伝導シートは絶縁性を有し、熱伝導性が非常に高いシート状物であり、例えばエフコ社製のエフコTMシートなどの樹脂シートである。
熱伝導シート6を絶縁性としていることで、端子4同士がショートすることが防止されている。
図1に示すように、熱伝導シート6は容易に変形可能なので、端子4の先端4aに押されて変形している。
As shown in FIG. 1, various mounting components 7 such as resistors and capacitors are mounted on one surface 2 a of the circuit board 2. A relay 9 and a connector 8 are mounted on the other surface 2b of the circuit board.
The terminal 4 is fixed to the connector 8 and the circuit board 2, for example, and electrically connects a circuit pattern and a fuse or wire harness (not shown).
The connector 8 is fixed on the other surface 2b of the circuit board 2 and is connected to the connector or fuse of the wire harness.
An insulating heat conductive sheet 6 is tightly fixed to one surface 2 a of the circuit board 2, and a case 5 is closely fixed to the surface of the heat conductive sheet 6 opposite to the circuit board fixing surface.
The heat conductive sheet is a sheet-like material having an insulating property and a very high heat conductivity, for example, a resin sheet such as an EFCO TM sheet manufactured by EFCO.
By making the heat conductive sheet 6 insulative, the terminals 4 are prevented from being short-circuited.
As shown in FIG. 1, since the heat conductive sheet 6 can be easily deformed, it is pushed and deformed by the tip 4 a of the terminal 4.

このような構成の基板モジュール1によれば、コネクタ8を介して回路基板2を介して電気が伝送されワイヤーハーネス同士を電気的に接続することが出来るとともにリレー9による回路のスイッチングを行うこともできる。
また本実施形態の基板モジュール1によれば、回路基板2上の例えばリレー9で発生した熱を熱伝導シート6を介してケース5に伝導し、ケース5外に放出することが出来る。
According to the board module 1 having such a configuration, electricity can be transmitted via the circuit board 2 via the connector 8 and the wire harnesses can be electrically connected to each other and the circuit can be switched by the relay 9. it can.
Further, according to the board module 1 of the present embodiment, heat generated by, for example, the relay 9 on the circuit board 2 can be conducted to the case 5 via the heat conductive sheet 6 and released to the outside of the case 5.

ここで自動車用の電気接続箱にこの基板モジュール1を使用することを想定すると、ケース5と端子4の先端4aが直接接触した構造の場合、ケース5の振動が端子4に伝播し、スルーホール3におけるはんだにクラックが入る等の問題が想定される。
またこれを避けるために熱伝導シート6を分厚く構成することでケース5の振動の影響を端子4に伝播しにくくすることも考えられるが、これでは熱伝導シート6の厚さ分、基板モジュール1が大型化してしまったり、もともと高価に流通されている場合が多い熱伝導シート6の供給コストがさらに高くついてしまう。
そこで本実施形態では、ケース5には、端子4の先端4aの該当位置に該先端4aから逃げる態様で凹み部5aが形成されている。したがってケース5の振動の影響が端子4へ伝播する危険性が低減されるとともに熱伝導シート6を薄く形成することが出来る。
しかも凹み部5aを多数ケース5に形成すれば、ケース5の表面積を広くすることが出来るので、放熱性も高くすることが出来る。
なおケース5の材質としては、部品コスト低減のため樹脂を用いても良いし、放熱性向上のため金属を用いても良いが、樹脂を用いる場合は熱伝導シート6と直接接触することを考慮し、耐熱性のものを用いるのが好ましい。
Assuming that this board module 1 is used in an electric junction box for automobiles, in the case where the case 5 and the tip 4a of the terminal 4 are in direct contact with each other, the vibration of the case 5 propagates to the terminal 4 and the through hole Problems such as cracks in the solder in 3 are assumed.
In order to avoid this, it is conceivable that the influence of the vibration of the case 5 is made difficult to propagate to the terminals 4 by configuring the heat conductive sheet 6 to be thick. However, this is equivalent to the thickness of the heat conductive sheet 6 and the board module 1. However, the cost of supplying the heat conductive sheet 6 that is often circulated at high cost is further increased.
Therefore, in the present embodiment, the case 5 is formed with a recessed portion 5a at a corresponding position of the tip 4a of the terminal 4 so as to escape from the tip 4a. Therefore, the risk of the influence of the vibration of the case 5 being propagated to the terminal 4 is reduced, and the heat conductive sheet 6 can be formed thin.
In addition, if a large number of the recessed portions 5a are formed in the case 5, the surface area of the case 5 can be increased, so that heat dissipation can be enhanced.
As the material of the case 5, a resin may be used for reducing the component cost, or a metal may be used for improving heat dissipation. However, in the case of using a resin, it is considered that the resin directly contacts the heat conductive sheet 6. However, it is preferable to use a heat-resistant material.

また本実施形態では、回路基板2の一面2a側には搭載部品7も搭載されているため、ケース5にはこれを逃げる態様の凹み部5aも形成されている。
これによりさらなる基板モジュール1の小型化ができるとともに搭載部品7からの熱も回路基板2を経由することなく直接熱伝導シート6に伝達することができる。
In the present embodiment, since the mounting component 7 is also mounted on the one surface 2 a side of the circuit board 2, the case 5 is also formed with a recess 5 a that escapes the mounting component 7.
As a result, the board module 1 can be further reduced in size, and heat from the mounted component 7 can be directly transmitted to the heat conductive sheet 6 without passing through the circuit board 2.

図3は、本発明の一実施形態となる電気接続箱100を示す。
電気接続箱100は、ロアーケース102内に基板モジュール1やリレーボックス104、コネクタ105,105等を収納し、下側をロアーカバー103で、上側をアッパーカバー101で蓋をしたものである。
基板モジュール1のケース5の凹み部5aが形成されている部分はロアーケース102の開口部102aから露出された状態に配置される。
このように基板モジュール1を凹み部5aが露出した状態で筐体内に収納することで非常に高い放熱性能を達成し、しかも小型化が容易となる。
以上説明したように、本発明によれば、車載に好適で、放熱性が良く小型化が容易な基板モジュールと電気接続箱を提供することができる。
FIG. 3 shows an electrical junction box 100 according to an embodiment of the present invention.
The electrical connection box 100 is configured such that the board module 1, the relay box 104, the connectors 105, 105, etc. are housed in the lower case 102, and the lower side is covered with the lower cover 103 and the upper side is covered with the upper cover 101.
The portion of the case 5 of the substrate module 1 where the recess 5 a is formed is disposed in a state exposed from the opening 102 a of the lower case 102.
Thus, by storing the board module 1 in the housing with the recessed portion 5a exposed, a very high heat dissipation performance is achieved, and the miniaturization is facilitated.
As described above, according to the present invention, it is possible to provide a board module and an electrical junction box that are suitable for in-vehicle use, have good heat dissipation and can be easily downsized.

本発明の実施形態となる基板モジュールを示す一部側断面図である。It is a partial sectional side view which shows the board | substrate module used as embodiment of this invention. 図1の基板モジュールの回路基板の部分を示す一部側断面図である。It is a partial sectional side view which shows the part of the circuit board of the board | substrate module of FIG. 図1の基板モジュールを電気接続箱内で使用する際の部品構成図である。It is a component block diagram at the time of using the board | substrate module of FIG. 1 within an electrical junction box.

1 基板モジュール
2 回路基板
3 スルーホール
4 端子
5 ケース
5a 凹み部
6 熱伝導シート
7 搭載部品
8 コネクタ
9 リレー
41 芯材
42 絶縁被覆
44 銅箔部
45 回路パターン
47 はんだ
48 ソルダーレジスト
100 電気接続箱
101 アッパーカバー
102 ロアーケース
102a 開口部
103 ロアーカバー
104 リレーボックス
105 コネクタ
DESCRIPTION OF SYMBOLS 1 Board | substrate module 2 Circuit board 3 Through hole 4 Terminal 5 Case 5a Recessed part 6 Thermal conductive sheet 7 Mounted part 8 Connector 9 Relay 41 Core material 42 Insulation coating 44 Copper foil part 45 Circuit pattern 47 Solder 48 Solder resist 100 Electrical connection box 101 Upper cover 102 Lower case 102a Opening 103 Lower cover 104 Relay box 105 Connector

Claims (2)

メタルコアを備えた回路基板と、該回路基板の該メタルコアに繋がるスルーホールに接続され、先端が前記回路基板の一面から突出した状態に固定された端子と、該回路基板を収納する放熱性を備えたケースを有する基板モジュールであって、
前記回路基板の前記端子が突出した一面に絶縁性かつ変形性を有する熱伝導シートが密着固定されるとともに、該熱伝導シートの前記回路基板固定面とは反対側の面には前記ケースが密着固定され
前記ケースには、
前記端子の先端の該当位置に該先端から逃げる態様であるとともに、前記端子の先端に押されて変形した前記熱伝導シートが密着固定する凹み部が形成されていることを特徴とする
電気接続箱に用いられる基板モジュール。
A circuit board having a metal core, a terminal connected to a through hole connected to the metal core of the circuit board, and a terminal fixed in a state of protruding from one surface of the circuit board, and a heat dissipation property for housing the circuit board A board module having an open case,
On one surface of the terminal of the circuit board is protruded, thermally conductive sheet having an insulating property and deformability is fixed tightly adhesion Rutotomoni, wherein the case on the opposite side to the circuit board fixing surface of the heat conducting sheet Are closely fixed ,
In the case,
It is a mode in which it escapes from the tip at a corresponding position of the tip of the terminal, and a concave portion is formed to which the thermally conductive sheet deformed by being pushed by the tip of the terminal is tightly fixed.
Board module used for electrical junction boxes .
請求項1記載の基板モジュールを、前記凹み部を露出した状態で筐体内に収納してなる
電気接続箱。
An electrical junction box, wherein the board module according to claim 1 is housed in a housing in a state where the recess is exposed.
JP2005304782A 2005-10-19 2005-10-19 Board module and electrical junction box Active JP4676304B2 (en)

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Families Citing this family (3)

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Publication number Priority date Publication date Assignee Title
JP5268377B2 (en) * 2008-01-29 2013-08-21 三洋電機株式会社 Power supply for vehicle
WO2011162171A1 (en) * 2010-06-21 2011-12-29 矢崎総業株式会社 Distribution board device
JP5432833B2 (en) * 2010-06-21 2014-03-05 矢崎総業株式会社 Distribution board component mounting structure

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07241020A (en) * 1994-02-28 1995-09-12 Yazaki Corp Electric junction box and its manufacture
JPH11163564A (en) * 1997-11-25 1999-06-18 Canon Inc Electronic apparatus and its manufacture
JP2005080354A (en) * 2003-08-29 2005-03-24 Auto Network Gijutsu Kenkyusho:Kk Circuit configuration
JP2005117887A (en) * 2003-09-19 2005-04-28 Auto Network Gijutsu Kenkyusho:Kk Mounting structure of on-vehicle circuit unit, and on-vehicle circuit unit
JP2005143265A (en) * 2003-11-10 2005-06-02 Yazaki Corp Electric connection box
JP2005228799A (en) * 2004-02-10 2005-08-25 Auto Network Gijutsu Kenkyusho:Kk Circuit structure and its manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07241020A (en) * 1994-02-28 1995-09-12 Yazaki Corp Electric junction box and its manufacture
JPH11163564A (en) * 1997-11-25 1999-06-18 Canon Inc Electronic apparatus and its manufacture
JP2005080354A (en) * 2003-08-29 2005-03-24 Auto Network Gijutsu Kenkyusho:Kk Circuit configuration
JP2005117887A (en) * 2003-09-19 2005-04-28 Auto Network Gijutsu Kenkyusho:Kk Mounting structure of on-vehicle circuit unit, and on-vehicle circuit unit
JP2005143265A (en) * 2003-11-10 2005-06-02 Yazaki Corp Electric connection box
JP2005228799A (en) * 2004-02-10 2005-08-25 Auto Network Gijutsu Kenkyusho:Kk Circuit structure and its manufacturing method

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