WO2021096170A1

WO2021096170A1 - Multilayer pcb assembly

Info

Publication number: WO2021096170A1
Application number: PCT/KR2020/015573
Authority: WO
Inventors: 김구용
Original assignee: 주식회사 엠디엠
Priority date: 2019-11-12
Filing date: 2020-11-09
Publication date: 2021-05-20

Abstract

The present application provides a multilayer PCB assembly. A multilayer PCB assembly according to an embodiment of the present invention comprises: an upper PCB including at least one layer of circuit pattern; a lower PCB including at least one layer of circuit pattern; and a plurality of heat dissipation plates interposed between the upper PCB and the lower PCB and arranged adjacent to the lateral sides thereof, wherein each of a first heat dissipation plate and a second heat dissipation plate includes one or more heat poles thermally in contact with an electronic circuit element mounted to the upper PCB or the lower PCB and a first PCB is embedded in a groove formed on a surface on which the first heat dissipation plate comes into contact with the second heat dissipation plate.

Description

Multilayer pcb assembly

The present invention relates to a multilayer PCB assembly, and more particularly, to a multilayer PCB assembly with improved heat dissipation function and capable of supplying high power.

In general, the structure of the multilayer PCB on which the power semiconductor module package is mounted is a circuit made of copper on both sides of the substrate 1a such as FR-4, CEM-1, CEM-3, and Al METAL-PCB as shown in FIG. A plurality of printed circuit boards (PCBs) 1 on which patterns 1a and 1b are printed are stacked in multiple layers, and each PCB 1 is configured to be electrically insulated by a prepreg 2. Electronic circuit devices such as IC chips and power semiconductor module packages are mounted on the outermost circuit pattern of the PCB, and a heat dissipation structure is additionally installed on the surface of the multilayer PCB structure to dissipate heat generated from these electronic circuit devices to the outside. .

However, according to such a general multilayer PCB structure, as each PCB is sequentially multilayered, there is a problem in that heat generated from the circuit pattern of the PCB located inside is not effectively discharged. In addition, due to the heat dissipation structure installed on the surface of the multilayer PCB, there is a disadvantage in that the structure of the PCB module is complicated and the volume is increased, and thus there is a problem that it is an obstacle to the compaction and slimming of the PCB module.

The PCB module has a limit on the number of PCBs that can be stacked due to the heat generated from the circuit pattern. In addition, the size of the PCB modules disposed inside any case also has a limit, so that PCBs cannot be stacked more than a certain number, so there is a limit to the amount of power that can be supplied to the electronic circuit device.

Embodiments of the present invention are intended to provide a multilayer PCB assembly capable of effectively dissipating heat generated from an electronic circuit device and supplying high power.

According to an aspect of the present invention, an upper PCB including a circuit pattern of at least one layer; and a lower PCB including a circuit pattern of at least one layer; And a plurality of heat dissipation plates interposed between the upper and lower PCBs and disposed adjacent to each other in a lateral direction, wherein the first heat dissipation plate and the second heat dissipation plate are thermally provided with electronic circuit devices mounted on the upper or lower PCBs. It includes one or more heat poles in contact, and the first PCB may be embedded in a groove formed on one surface of the first heat dissipation plate and the second heat dissipation plate.

In addition, at least one of the first heat dissipation plate and the second heat dissipation plate may have the heat pole disposed in an upper or lower region of the first PCB arrangement region D.

In addition, the one surface of the first heat dissipation plate and the second heat dissipation plate may include a first boundary surface and a second boundary surface, and the first boundary surface and the second boundary surface may be spaced apart to form an impact dispersion distance (d). .

In addition, the upper or lower PCB may include one or more through-holes through which the heat pole passes, and the heat pole may be formed to protrude to the same height as the surface of the upper or lower PCB.

In addition, the surface of the heat pole may be formed as an electrically conductive surface, and the electronic circuit device and the heat dissipation plate may be electrically connected through the heat pole.

In addition, it may include a first coupling member penetrating the upper and lower PCBs, the first heat dissipation plate and the first PCB, and may include a second coupling member penetrating the upper and lower PCBs and the second heat dissipation plate.

In addition, the first PCB and the first heat dissipation plate may be penetrating, but may further include at least one 1-1 coupling member penetrating through any one of the upper and lower PCBs.

Embodiments of the present invention effectively dissipate heat generated from a energized electronic circuit device, thereby preventing component damage or failure that may occur as a heat member in a multilayer PCB assembly.

In addition, by supplying large power to electronic circuit devices without increasing the volume of the multilayer PCB assembly, it is possible to smoothly supply power to electronic products that are sized and require high-capacity power.

1 is a cross-sectional view of a stacked structure of a conventional general multilayer PCB,

2 is a perspective view of a multilayer PCB assembly according to an embodiment of the present invention,

3 is a cross-sectional view of FIG. 2,

4 is a cross-sectional view showing the flow of heat generated in the above embodiment.

Hereinafter, a multilayer PCB assembly 1000 according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 2 is a perspective view illustrating a multilayer PCB assembly 1000 according to an embodiment of the present invention, and FIG. 3 is a diagram illustrating an exemplary cross-sectional structure of the multilayer PCB assembly 1000. However, FIG. 3 is a schematic and simple representation of the components for understanding the contents of the present invention, and it is noted in advance that they do not coincide with the cross-sectional structure of FIG. 2.

The multilayer PCB assembly 1000 according to an embodiment of the present invention includes an upper PCB 1100 and a lower PCB 1200, and a plurality of heat dissipation plates are interposed therebetween.

The upper PCB 1100 includes at least one layer of circuit pattern, and is generally an organ having a multilayer circuit pattern. In one embodiment, the upper PCB 1100 may be made of a substrate such as FR-4, CEM-1, CEM-3, Al Metal-PCB, and the like, and the type of the substrate is not limited thereto.

The upper PCB 1100 includes one or more through-holes 1110 through which the

heat poles

1316, 1326, and 1316 of the heat dissipation plate can pass. The shape or location of the through-hole may vary depending on the manufacturing type of the PCB. A plurality of electronic circuit elements 1400 are mounted on the upper surface of the upper PCB 1100, and may be electrically coupled to an external electronic device through an electrical connection means such as a pin. Here, the electronic circuit device 1400 may mean, for example, one of various passive devices or active devices, and various types of IC chips integrated therewith.

The lower PCB 1200 has the same or similar structure as the upper PCB 1100. The lower PCB 1200 has at least one layer of circuit pattern. In addition, the lower PCB 1200 includes a through hole 1210 through which the

heat poles

1316 and 1326 of the heat dissipation plate can penetrate, and a plurality of electronic circuit elements 1400 are mounted on the upper surface of the lower PCB 1200. do.

A plurality of heat dissipation plates interposed between the upper PCB 1100 and the lower PCB 1200 are disposed adjacent to each other in a lateral direction to absorb heat generated from each PCB through various paths and discharge them to the outside. To this end, the heat dissipation plate may be made of, for example, one of materials such as copper (Cu), aluminum (Al), silicon nitride (Si3N4), and aluminum nitride (AlN) having excellent thermal conductivity.

The heat dissipation plate includes one or

more heat poles

1316 and 1326 formed on upper and lower surfaces. The

heat poles

1316 and 1326 are pillar-shaped protrusions having a circular or polygonal cross section that protrudes perpendicularly to the upper and lower surfaces of the heat dissipation plate.

When the upper and

lower PCBs

1100 and 1200 are coupled to the heat dissipation plate, the

heat poles

1316 and 1326 are formed to protrude to have the same height as the PCB surface through the through-

holes

1110 and 1210 of the PCB. Alternatively, it is in thermal contact with the electronic circuit device 1400 mounted on the surface of the lower PCB 1200. However, as shown in FIG. 3, the heat pole that does not contact the electronic circuit device 1400 is formed higher than the surface of the PCB and extends to thermally contact the heat sink disposed outside.

The heat dissipation plate may include an electrical insulating layer on the outer surface of the heat dissipation plate so that the surfaces of the upper and

lower PCBs

1100 and 1200 are not electrically shorted to each other.

The heat dissipation plate is formed of aluminum, and in this case, the electrical insulating layer may be an aluminum oxide (Al2O3) layer formed on the surface of the heat dissipation plate by anodizing the heat dissipation plate. However, since it is not necessarily limited thereto, the electrical insulating layer may be formed of any material having electrical insulating properties.

In addition, the heat dissipation plate includes an electrical insulating layer on the surface, but the electrical insulating layer is removed in some areas, and thus the heat dissipation plate can perform not only a heat dissipation function but also a transmission line function.

Specifically, surfaces of the

heat poles

1316 and 1326 in contact with the electronic circuit device 1400 mounted on the upper PCB 1100 are formed as electrically conductive surfaces. For example, after the heat dissipation plate is made of aluminum and the heat dissipation plate is anodized to form an electrical insulating layer of aluminum oxide on the entire surface, the electrical insulating layer on the surfaces of the

heat poles

1316 and 1326 can be removed. have. When the surfaces of the

heat poles

1316 and 1326 are formed as electrically conductive surfaces, the electronic circuit device 1400 attached on the

heat poles

1316 and 1326 may be electrically connected to the heat dissipation plate. In this case, current may be supplied to the electronic circuit device 1400 connected to the

heat poles

1316 and 1326 through the heat dissipation plate. For example, the heat dissipation plate may have a thickness of about 0.5 to 3T, and accordingly, the current capacity is about 100 times larger than that of a general PCB, so that a large current can be supplied.

The embodiment includes a first heat dissipation plate 1310 and a second heat dissipation plate 1320 adjacent to each other as shown in FIG. 3, and a first PCB 1500 is interposed therebetween. That is, one surface of the first heat dissipation plate 1310 and the second heat dissipation plate 1320 includes

grooves

1312 and 1322, and the first PCB 1500 is embedded in the

grooves

1312 and 1322. Therefore, the multilayer PCB assembling 1000 of a certain size can supply high power including a larger number of PCBs by the additional arrangement of the PCB, and the heat generated from the additional PCB embedded in the heat dissipation plate is spread in all directions as shown in FIG. 4. It can be effectively discharged through the arranged heat dissipation plate.

In the first heat dissipation plate 1310 and the second heat dissipation plate 1320, as shown in FIG. 3,

heat poles

1316 and 1326 are disposed above or below the region D where the first PCB 1500 is disposed. Heat generated by the current supplied to the first PCB 1500 is discharged through the

heat poles

1316 and 1326 adjacent to the first PCB 1500 to more effectively discharge heat generated from the first PCB 1500. I can. In the embodiment shown in FIG. 3, the

heat poles

1316 and 1326 are disposed on the upper and lower sides of the placement area D, but are not limited thereto.

Heat poles

1316 and 1326 may be disposed.

In addition, each of the

heat poles

1316 and 1326 disposed above and below the placement region D may have different vertical positions. That is, the

upper heat poles

1316 and 1326 disposed on the upper side of the heat dissipating plate and the

lower heat poles

1316 and 1326 disposed on the lower side of the heat dissipating plate in the arrangement area D are not disposed on the same vertical extension line, respectively. The

heat poles

1316 and 1326 of may dissipate heat of the first PCB 1500 in a distributed region rather than a concentrated region of the first PCB 1500. Therefore, heat generated from the first PCB 1500 is radiated from the distributed regions of the first PCB 1500, so that the heat dissipation plate may perform an effective heat dissipation function with respect to the first PCB 1500.

One surface of the first heat dissipation plate 1310 and the second heat dissipation plate 1320 in contact with each other includes a first interface 1314 and a second interface 1324 as shown in FIG. 3. The first to second heat dissipation plates have one side formed as a single layer, and one side of each heat dissipation plate has a protruding portion and a concave portion, opposing first to second heat dissipation plates for firm coupling of the first to second heat dissipation plates. The position is reversed up and down on the one side of the contact.

As a single layer formed on one surface of the first to second heat dissipating plates, a first boundary surface 1314 and a second boundary surface 1324 having different vertical positions are formed on one surface of the first to second heat dissipating plates. The first boundary surface 1314 and the second boundary surface 1324 are spaced apart to form an impact dispersion distance d as shown in FIG. 3. The first PCB 1500 embedded in the

grooves

1312 and 1322 of the first to second heat dissipating plates may be bent or bent together with the heat dissipating plate due to an external impact. Even if the multilayer PCB assembly 1000 is bent based on one surface, the first PCB 1500 may distribute the supplied shock along the shock dispersion distance d. Therefore, even if the multilayer PCB assembly 1000 is bent or bent due to an external impact, damage to the first PCB 1500 can be prevented.

In addition, as the impact dispersing distance (d) increases, the point of action of the external force on the first PCB 1500 generated by the bending applied to the multilayer PCB assembly 1000 increases. By preventing concentration, it is possible to prevent cutting or damage of the first PCB 1500.

The multilayer PCB assembly 1000 is coupled through the first coupling member 1610 and the second coupling member 1630 passing through the first to second heat dissipating plates. The first coupling member 1610 passes through the upper and

lower PCBs

1100 and 1200, the first heat dissipation plate 1310 and the first PCB 1500, and the second coupling member 1630 is the upper and lower PCBs 1100, 1200) and through the second heat dissipation plate 1320. Accordingly, the first to second heat dissipation plates are coupled and maintained with the upper and

lower PCBs

1100 and 1200 through the first and second coupling members, and in particular, the first PCB 1500 is firmly coupled and maintained through the first coupling member 1610. do. The first to second coupling members are shown as coupling pins in the drawings attached herein, but are not necessarily limited thereto.

In addition, one or more 1-1 coupling members 1620 may additionally penetrate the PCB and the heat dissipation plate to make the multilayer PCB assembly 1000 solid. As shown in FIG. 3, the 1-1 coupling member 1620 penetrates the first PCB 1500 and the first heat dissipation plate 1310, but penetrates the upper PCB 1100 or the lower PCB 1200. That is, the 1-1th coupling member 1620 penetrates only one of the upper PCB 1100 and the lower PCB 1200. The number of coupling members passing through the PCB and the heat dissipation plate should be appropriate. If the multilayer PCB assembly 1000 includes a large number of coupling members, the binding force may be improved, but the heat dissipation function may be deteriorated and the large power supply function may be weakened. Alternatively, if the multilayer PCB assembling 1000 includes a coupling member having less, the heat dissipation function and the large power supply function may be improved, but the binding force may be weakened. Therefore, the 1-1 coupling member 1620 passes through the first PCB 1500 and the first heat dissipation plate 1310, but is coupled to only one of the upper PCB 1100 and the lower PCB 1200. , It is possible to improve the bonding power of the multilayer PCB assembling 1000 and prevent the effect of the heat dissipation function and the large power supply function from being deteriorated.

As described above, one embodiment of the present invention has been described, but those of ordinary skill in the relevant technical field add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. Various modifications and changes can be made to the present invention by means of the like, and this will also be said to be included within the scope of the present invention.

In addition, the above-described terms are terms defined in consideration of functions in the present invention, which may vary according to the custom or intention of users or operators. Therefore, definitions of these terms should be made based on the contents throughout the present specification.

In addition, when referring to "including" a component in the present application, it means that other components may be further included rather than excluding other components unless specifically stated to the contrary.

[Explanation of code]

Multilayer PCB Assembly: 1000

Upper PCB: 1100

Lower PCB: 1200

Through hole: 1110, 1210

1st heat dissipation plate: 1310

Second heat dissipation plate: 1320

Home: 1312, 1322

1st interface: 1314

2nd interface: 1324

Heat pole: 1316, 1326

Electronic circuit device: 1400

1st PCB: 1500

First coupling member: 1610

1-1 coupling member: 1620

Second coupling member: 1630

Claims

An upper PCB including at least one layer of circuit pattern;

A lower PCB including at least one layer of circuit pattern; And a plurality of heat dissipation plates interposed between the upper and lower PCBs and disposed adjacent to each other in a lateral direction, wherein the first heat dissipation plate and the second heat dissipation plate include: electronic circuit elements mounted on the upper or lower PCBs and thermally In contact with

A multilayer PCB assembly including one or more heat poles, wherein the first PCB is embedded in a groove formed on a surface of the first heat dissipation plate and the second heat dissipation plate contacting each other.
The method of claim 1,

At least one of the first heat dissipation plate and the second heat dissipation plate is a multilayer PCB assembly in which the heat pole is disposed in an upper or lower area of the placement area D of the first PCB.
The method of claim 1,

The first heat dissipation plate and the second heat dissipation plate contact the one surface including a first interface and a second interface, the first interface and the second interface are spaced apart to form an impact dispersion distance (d), a multilayer PCB assembly .
The method of claim 1,

The upper or lower PCB includes at least one through hole through which the heat pole passes, and the heat pole is formed to protrude to the same height as a surface of the upper or lower PCB.
The method of claim 1,

The surface of the heat pole is formed as an electrically conductive surface,

The electronic circuit device and the heat dissipation plate are electrically connected to each other through the heat pole.
The method of claim 1,

Including a first coupling member penetrating the upper and lower PCBs, the first heat dissipation plate and the first PCB,

A multilayer PCB assembly comprising a second coupling member passing through the upper and lower PCBs and the second heat dissipation plate.
The method of claim 6,

Through the first PCB and the first heat dissipation plate, the multilayer PCB assembly further comprising at least one 1-1 coupling member penetrating through any one of the upper and lower PCBs.