JPS63197141U - - Google Patents
Info
- Publication number
- JPS63197141U JPS63197141U JP8936787U JP8936787U JPS63197141U JP S63197141 U JPS63197141 U JP S63197141U JP 8936787 U JP8936787 U JP 8936787U JP 8936787 U JP8936787 U JP 8936787U JP S63197141 U JPS63197141 U JP S63197141U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- drive circuit
- head
- lead pattern
- thermal print
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000605 extraction Methods 0.000 claims description 3
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図はこの考案の実施例を示す正面図、第２
図は断面図、第３図、第４図は従来例の正面図で
ある。
１…基板、２…発熱体、３…リードパターン、
４…駆動回路、６…挿抜部、８…ヘツド部、９…
プリント基板、１０…配線、１１…配線部、１２
…放熱板、１３…ワイヤー。
Figure 1 is a front view showing an embodiment of this invention, Figure 2 is a front view showing an embodiment of this invention.
The figure is a sectional view, and FIGS. 3 and 4 are front views of the conventional example. 1... Board, 2... Heating element, 3... Lead pattern,
4... Drive circuit, 6... Insertion/extraction section, 8... Head section, 9...
Printed circuit board, 10... Wiring, 11... Wiring part, 12
...heat sink, 13...wire.
Claims (1)
の表面に設けることによつてヘツド部を構成し、
またプリント基板の表面に、駆動回路と、これに
連なり端部がコネクターへの挿抜部となる配線を
設けて配線部を構成し、前記ヘツド部および配線
部を前記挿抜部を突出させて放熱板上に取り付け
、前記駆動回路とリードパターンおよび配線とを
、ワイヤーボンデイングによつて接続してなるサ
ーマルプリントヘツド。 The head portion is configured by providing a heating element and a lead pattern connected thereto on the surface of the substrate,
Further, on the surface of the printed circuit board, a drive circuit and wiring connected thereto and whose ends become insertion/extraction parts for the connector are provided to form a wiring part, and the head part and the wiring part are made to protrude from the insertion/extraction part to form a heat sink. The thermal print head is mounted on the top of the thermal print head, and the drive circuit is connected to the lead pattern and the wiring by wire bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8936787U JPS63197141U (en) | 1987-06-10 | 1987-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8936787U JPS63197141U (en) | 1987-06-10 | 1987-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63197141U true JPS63197141U (en) | 1988-12-19 |
Family
ID=30948295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8936787U Pending JPS63197141U (en) | 1987-06-10 | 1987-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63197141U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6116869A (en) * | 1984-07-04 | 1986-01-24 | Tokyo Electric Co Ltd | Fixture for thermal head |
| JPS6248571A (en) * | 1985-08-28 | 1987-03-03 | Toshiba Corp | Thermal printing head |
| JPS6248571B2 (en) * | 1982-07-26 | 1987-10-14 | Hitachi Cable |
-
1987
- 1987-06-10 JP JP8936787U patent/JPS63197141U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6248571B2 (en) * | 1982-07-26 | 1987-10-14 | Hitachi Cable | |
| JPS6116869A (en) * | 1984-07-04 | 1986-01-24 | Tokyo Electric Co Ltd | Fixture for thermal head |
| JPS6248571A (en) * | 1985-08-28 | 1987-03-03 | Toshiba Corp | Thermal printing head |
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