JPS62114743U - - Google Patents
Info
- Publication number
- JPS62114743U JPS62114743U JP180586U JP180586U JPS62114743U JP S62114743 U JPS62114743 U JP S62114743U JP 180586 U JP180586 U JP 180586U JP 180586 U JP180586 U JP 180586U JP S62114743 U JPS62114743 U JP S62114743U
- Authority
- JP
- Japan
- Prior art keywords
- board
- heating resistor
- thermal printer
- plating layer
- gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000002386 leaching Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図乃至第３図は、本考案のそれぞれ異なる
実施例を示すサーマルプリンタヘツドの断面図で
ある。
１……サーマルプリンターヘツド、２……絶縁
基板、４……発熱抵抗体、５……導体、６……メ
ツキ層。
1 to 3 are cross-sectional views of thermal printer heads showing different embodiments of the present invention. DESCRIPTION OF SYMBOLS 1...Thermal printer head, 2...Insulating substrate, 4...Heating resistor, 5...Conductor, 6...Plating layer.
Claims (1)
沿つて設けられ金を主材とする導体とからなり、 この導体の少なくとも駆動回路との接続部に耐
ハンダリーチング性を有するメツキ層を形成した
ことを特徴とするサーマルプリンタヘツド。[Claims for Utility Model Registration] Consisting of a heating resistor provided on this board, and a conductor made of gold as a main material and electrically connected to this heating resistor and provided along the board, 1. A thermal printer head characterized in that a plating layer having solder leaching resistance is formed at least at a connection portion with a drive circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP180586U JPS62114743U (en) | 1986-01-10 | 1986-01-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP180586U JPS62114743U (en) | 1986-01-10 | 1986-01-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62114743U true JPS62114743U (en) | 1987-07-21 |
Family
ID=30780053
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP180586U Pending JPS62114743U (en) | 1986-01-10 | 1986-01-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62114743U (en) |
-
1986
- 1986-01-10 JP JP180586U patent/JPS62114743U/ja active Pending
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