JPH0366750U - - Google Patents
Info
- Publication number
- JPH0366750U JPH0366750U JP12814889U JP12814889U JPH0366750U JP H0366750 U JPH0366750 U JP H0366750U JP 12814889 U JP12814889 U JP 12814889U JP 12814889 U JP12814889 U JP 12814889U JP H0366750 U JPH0366750 U JP H0366750U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- insulating material
- electrically insulating
- protective layer
- layer made
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000012777 electrically insulating material Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 3
- 239000011241 protective layer Substances 0.000 claims 3
- 238000013459 approach Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例の断面図、第２図は
第１図に示された実施例の一部の斜視図、第３図
は本考案の他の実施例の断面図、第４図は本考案
のさらに他の実施例の断面図、第５図は第１図に
示される実施例の簡略化した断面図、第６図は先
行技術の断面図である。
２１……サーマルヘツド、２２……基板、２３
……発熱抵抗体、３２……蓄熱層、３４……電極
層、３５……共通電極、３６……個別電極、３７
……プラテン、３８……耐摩耗層、４０……可撓
性配線基板、４１……導体、４２……半田層、４
３，４５……絶縁層、４４……接着剤層。
FIG. 1 is a cross-sectional view of one embodiment of the present invention, FIG. 2 is a perspective view of a part of the embodiment shown in FIG. 1, and FIG. 3 is a cross-sectional view of another embodiment of the present invention. 4 is a sectional view of yet another embodiment of the present invention, FIG. 5 is a simplified sectional view of the embodiment shown in FIG. 1, and FIG. 6 is a sectional view of the prior art. 21...Thermal head, 22...Substrate, 23
... Heat generating resistor, 32 ... Heat storage layer, 34 ... Electrode layer, 35 ... Common electrode, 36 ... Individual electrode, 37
... platen, 38 ... wear-resistant layer, 40 ... flexible wiring board, 41 ... conductor, 42 ... solder layer, 4
3, 45...Insulating layer, 44...Adhesive layer.
Claims (1)
共通電極と、可撓性配線基板に形成されている導
体とを半田層を介して接続し、前記配線基板の発
熱抵抗体側の端部と、その端部よりも発熱抵抗体
側の領域とにわたつて電気絶縁性材料から成る保
護層を形成したサーマルヘツドにおいて、可撓性
配線基板の少なくとも半田層を介して前記共通電
極と接続する部位は、前記導体と電気絶縁性材料
から成る絶縁層とを積層して成ることを特徴とす
るサーマルヘツド。 (2) 前記絶縁層の前記発熱抵抗体側端部が発熱
抵抗体に近づくにつれて薄くなる傾斜面を有する
ことを特徴とする実用新案登録請求の範囲第１項
記載のサーマルヘツド。 (3) 前記保護層と前記絶縁層とは、合成樹脂の
塗布によつて一体的に形成されることを特徴とす
る実用新案登録請求の範囲第１項記載のサーマル
ヘツド。[Claims for Utility Model Registration] (1) A common electrode that commonly connects one end of a plurality of heating resistors and a conductor formed on a flexible wiring board are connected via a solder layer, and the wiring In a thermal head in which a protective layer made of an electrically insulating material is formed over the end of the board on the heat generating resistor side and the region closer to the heat generating resistor than the end, a protective layer made of an electrically insulating material is formed, through at least the solder layer of the flexible wiring board. A thermal head characterized in that a portion connected to the common electrode is formed by laminating the conductor and an insulating layer made of an electrically insulating material. (2) The thermal head according to claim 1, wherein the end portion of the insulating layer on the heating resistor side has an inclined surface that becomes thinner as it approaches the heating resistor. (3) The thermal head according to claim 1, wherein the protective layer and the insulating layer are integrally formed by coating a synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128148U JP2523269Y2 (en) | 1989-10-31 | 1989-10-31 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989128148U JP2523269Y2 (en) | 1989-10-31 | 1989-10-31 | Thermal head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0366750U true JPH0366750U (en) | 1991-06-28 |
| JP2523269Y2 JP2523269Y2 (en) | 1997-01-22 |
Family
ID=31675869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989128148U Expired - Lifetime JP2523269Y2 (en) | 1989-10-31 | 1989-10-31 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2523269Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006062146A (en) * | 2004-08-25 | 2006-03-09 | Kyocera Corp | Thermal head and thermal printer using the same |
| JP2010005897A (en) * | 2008-06-26 | 2010-01-14 | Kyocera Corp | Recording head and its manufacturing method, and recording device equipped with this recording head |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61158283A (en) * | 1984-12-28 | 1986-07-17 | Sony Corp | Time base corrector |
| JPS62183041A (en) * | 1986-01-07 | 1987-08-11 | Mitsubishi Electric Corp | Optical device for optical pickup device for compact disk |
-
1989
- 1989-10-31 JP JP1989128148U patent/JP2523269Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61158283A (en) * | 1984-12-28 | 1986-07-17 | Sony Corp | Time base corrector |
| JPS62183041A (en) * | 1986-01-07 | 1987-08-11 | Mitsubishi Electric Corp | Optical device for optical pickup device for compact disk |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006062146A (en) * | 2004-08-25 | 2006-03-09 | Kyocera Corp | Thermal head and thermal printer using the same |
| JP4659411B2 (en) * | 2004-08-25 | 2011-03-30 | 京セラ株式会社 | Thermal head and thermal printer using this thermal head |
| JP2010005897A (en) * | 2008-06-26 | 2010-01-14 | Kyocera Corp | Recording head and its manufacturing method, and recording device equipped with this recording head |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2523269Y2 (en) | 1997-01-22 |