JPS63144246U - - Google Patents
Info
- Publication number
- JPS63144246U JPS63144246U JP3608687U JP3608687U JPS63144246U JP S63144246 U JPS63144246 U JP S63144246U JP 3608687 U JP3608687 U JP 3608687U JP 3608687 U JP3608687 U JP 3608687U JP S63144246 U JPS63144246 U JP S63144246U
- Authority
- JP
- Japan
- Prior art keywords
- head body
- resin film
- thermal head
- connection
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000002783 friction material Substances 0.000 claims 1
- 229920003055 poly(ester-imide) Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Accessory Devices And Overall Control Thereof (AREA)
Description
第１図は本考案の一実施例であるサーマルヘツ
ドの正面図であり、第２図はその平面図である。
第３図はそのサーマルヘツドを含む電子タイプラ
イタの外観を示す斜視図である。第４図は第１図
および第２図のサーマルヘツドが印字を行う状態
を示す平面図である。第５図および第６図はそれ
ぞれ本考案の別の実施例を示す平面図である。第
７図、第８図および第１０図は従来のサーマルヘ
ツドの具体例を示す正面図であり、第９図は第８
図に示すものの平面図、第１１図は第１０図に示
すものの平面図である。
２：サーマルヘツド、１２：キヤリツジ、１６
：プラテン、２０：印字用紙、２３：ヘツド本体
、２４：サーマルリボン（熱転写リボン）、２６
：ヘツド基板、２８：放熱板、３０：発熱素子、
３２：リード線、３４：接続端子、３６：導線、
３８：接続端部、４０：通電用ケーブル、４２：
導線被覆部、４６：樹脂フイルム、４８：接着剤
。
FIG. 1 is a front view of a thermal head which is an embodiment of the present invention, and FIG. 2 is a plan view thereof.
FIG. 3 is a perspective view showing the external appearance of the electronic typewriter including the thermal head. FIG. 4 is a plan view showing a state in which the thermal head of FIGS. 1 and 2 performs printing. FIGS. 5 and 6 are plan views showing other embodiments of the present invention, respectively. 7, 8 and 10 are front views showing specific examples of conventional thermal heads, and FIG. 9 is a front view of a conventional thermal head.
FIG. 11 is a plan view of what is shown in FIG. 10. 2: Thermal head, 12: Carriage, 16
: Platen, 20: Printing paper, 23: Head body, 24: Thermal ribbon (thermal transfer ribbon), 26
: head board, 28: heat sink, 30: heating element,
32: Lead wire, 34: Connection terminal, 36: Conductor wire,
38: Connection end, 40: Power supply cable, 42:
Conductor covering portion, 46: resin film, 48: adhesive.
Claims (1)
と、ヘツド本体上においてそれら発熱素子にそれ
ぞれ接続されるとともに、各発熱素子から延びた
延長端がヘツド本体上に並んで位置する接続端子
とされたリード線と、それらリード線に対応する
導線を備えてその導線の接続端部が前記リード線
の接続端子にそれぞれ接続される通電用ケーブル
とを含み、前記ヘツド本体と通電用ケーブルの接
続部で熱転写リボンの走行を案内するサーマルヘ
ツドおいて、 前記ヘツド本体と通電用ケーブルとの接続部に
、それらヘツド本体と通電用ケーブルとにまたが
つて、低摩擦係数の樹脂フイルムを固着したこと
を特徴とするサーマルヘツド。 (2) 前記樹脂フイルムの厚さが、０．０１〜０
．１mmである実用新案登録請求の範囲第１項記載
のサーマルヘツド。 (3) 前記樹脂フイルムの表面摩擦係数が、０．
３〜０．５である実用新案登録請求の範囲第１項
または第２項記載のサーマルヘツド。 (4) 前記樹脂フイルムがポリエステルまたはポ
リイミドのいずれかからなる実用新案登録請求の
範囲第１項、第２項または第３項記載のサーマル
ヘツド。[Claims for Utility Model Registration] (1) A plurality of heating elements arranged on the head body, each connected to the heating elements on the head body, and an extension end extending from each heating element on the head body. lead wires serving as connection terminals located side by side; and a current-carrying cable provided with conducting wires corresponding to the lead wires, the connection ends of which are respectively connected to the connection terminals of the lead wires; In a thermal head that guides the running of the thermal transfer ribbon at the connection between the head body and the energizing cable, a low-friction material is installed at the connection between the head body and the energizing cable, spanning the head body and the energizing cable. A thermal head characterized by a fixed resin film of a coefficient. (2) The thickness of the resin film is 0.01 to 0.
．． The thermal head according to claim 1 of the utility model registration claim, which has a diameter of 1 mm. (3) The surface friction coefficient of the resin film is 0.
3 to 0.5, the thermal head according to claim 1 or 2 of the utility model registration claim. (4) The thermal head according to claim 1, 2, or 3, wherein the resin film is made of either polyester or polyimide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3608687U JPH0533347Y2 (en) | 1987-03-12 | 1987-03-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3608687U JPH0533347Y2 (en) | 1987-03-12 | 1987-03-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63144246U true JPS63144246U (en) | 1988-09-22 |
| JPH0533347Y2 JPH0533347Y2 (en) | 1993-08-25 |
Family
ID=30846170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3608687U Expired - Lifetime JPH0533347Y2 (en) | 1987-03-12 | 1987-03-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0533347Y2 (en) |
-
1987
- 1987-03-12 JP JP3608687U patent/JPH0533347Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0533347Y2 (en) | 1993-08-25 |
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