JPS63149731U - - Google Patents
Info
- Publication number
- JPS63149731U JPS63149731U JP4259887U JP4259887U JPS63149731U JP S63149731 U JPS63149731 U JP S63149731U JP 4259887 U JP4259887 U JP 4259887U JP 4259887 U JP4259887 U JP 4259887U JP S63149731 U JPS63149731 U JP S63149731U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- flexible substrate
- substrate
- thermal head
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Accessory Devices And Overall Control Thereof (AREA)
- Electronic Switches (AREA)
Description
第１図はサーマルヘツド正面図、第２図は従来
例のフレキーセラミツク基板接栓部断面図、第３
図は本案の一実施例のフイン部品図、第４図は本
案のフレキーセラミツク基板接栓部断面図、第５
図は熱転写プリンタの印字機構を示す斜視図であ
る。
５……キヤリツジ、１４……被転写紙、１５…
…サーマルヘツド、２１……制御部、３１……発
熱素子列、３２……放熱フイン、３３……セラミ
ツク基板、３４……フレキシブル基板、３５……
接栓(1)、３６……接栓(2)、３７……接着剤(1)
、３８……導体パターン(1)、３９……導体パタ
ーン(2)、４０……基材、４１……導体パターン(
3)、４２……レジスト材、４３……ガイド(1)、
４４……ガイド(2)、４６……接着剤(2)。
Figure 1 is a front view of the thermal head, Figure 2 is a cross-sectional view of the conventional flexible ceramic board connector, and Figure 3 is a front view of the thermal head.
The figure is a fin component diagram of one embodiment of the present invention, FIG. 4 is a cross-sectional view of the flexible ceramic board connection part of the present invention, and FIG.
The figure is a perspective view showing a printing mechanism of a thermal transfer printer. 5...Carriage, 14...Transfer paper, 15...
...Thermal head, 21...Control unit, 31...Heating element array, 32...Radiating fin, 33...Ceramic substrate, 34...Flexible substrate, 35...
Junction (1), 36… Junction (2), 37… Adhesive (1)
, 38... Conductor pattern (1), 39... Conductor pattern (2), 40... Base material, 41... Conductor pattern (
3), 42...Resist material, 43...Guide (1),
44...Guide (2), 46...Adhesive (2).
Claims (1)
と、該セラミツク基板との接続用の接栓を有する
フレキシブル基板と、前記セラミツク基板とフレ
キシブル基板の両方を固定する放熱フインから成
るシリアル熱転写プリンタ用サーマルヘツドにお
いて、前記セラミツク基板とフレキシブル基板の
接続用接栓部近傍と対向する放熱フイン側に、絶
縁性の接着剤又は充てん材の塗布用ガイドを設け
た事を特徴とするサーマルヘツド。 A thermal head for a serial thermal transfer printer comprising a ceramic substrate having a plurality of heating elements and plugs, a flexible substrate having a plug for connection to the ceramic substrate, and a heat dissipation fin that fixes both the ceramic substrate and the flexible substrate. A thermal head according to the invention, characterized in that a guide for applying an insulating adhesive or filler is provided on the side of the heat dissipation fin facing the vicinity of the connecting plug between the ceramic substrate and the flexible substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4259887U JPS63149731U (en) | 1987-03-25 | 1987-03-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4259887U JPS63149731U (en) | 1987-03-25 | 1987-03-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149731U true JPS63149731U (en) | 1988-10-03 |
Family
ID=30858661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4259887U Pending JPS63149731U (en) | 1987-03-25 | 1987-03-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149731U (en) |
-
1987
- 1987-03-25 JP JP4259887U patent/JPS63149731U/ja active Pending
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