JPH03100438U - - Google Patents

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Publication number
JPH03100438U
JPH03100438U JP889290U JP889290U JPH03100438U JP H03100438 U JPH03100438 U JP H03100438U JP 889290 U JP889290 U JP 889290U JP 889290 U JP889290 U JP 889290U JP H03100438 U JPH03100438 U JP H03100438U
Authority
JP
Japan
Prior art keywords
line head
thermal line
heat sink
substrate
heating resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP889290U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP889290U priority Critical patent/JPH03100438U/ja
Publication of JPH03100438U publication Critical patent/JPH03100438U/ja
Pending legal-status Critical Current

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Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示す一部断面した
概略斜視図、第2図および第3図はそれぞれ従来
例を示す概略斜視図である。 20……サーマルラインヘツド装置、21……
基板、22……発熱抵抗体、23……サーマルラ
インヘツド、24……放熱板、24a……溝、2
5……フレキシブルプリント回路基板、26……
コネクタ、27……サーミスタ、28……スルー
ホール。
FIG. 1 is a partially sectional schematic perspective view showing an embodiment of the present invention, and FIGS. 2 and 3 are schematic perspective views showing conventional examples, respectively. 20... thermal line head device, 21...
Substrate, 22... Heat generating resistor, 23... Thermal line head, 24... Heat sink, 24a... Groove, 2
5...Flexible printed circuit board, 26...
Connector, 27...thermistor, 28...through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板と、該基板に配設されたライン状の発熱抵
抗体とからなるサーマルラインヘツドと、該サー
マルラインヘツドに接合された放熱板と、該放熱
板上で該サーマルラインヘツドに導通接続された
フレキシブルプリント回路基板と、該サーマルラ
インヘツドの発熱抵抗体が位置する背面と該放熱
板との間に配設された温度センサ素子とから構成
されたことを特徴とするサーマルラインヘツド装
置。
A thermal line head consisting of a substrate, a line-shaped heating resistor disposed on the substrate, a heat sink joined to the thermal line head, and a thermal line head electrically connected to the thermal line head on the heat sink. 1. A thermal line head device comprising a flexible printed circuit board and a temperature sensor element disposed between a back surface of the thermal line head where a heating resistor is located and the heat sink.
JP889290U 1990-01-31 1990-01-31 Pending JPH03100438U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP889290U JPH03100438U (en) 1990-01-31 1990-01-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP889290U JPH03100438U (en) 1990-01-31 1990-01-31

Publications (1)

Publication Number Publication Date
JPH03100438U true JPH03100438U (en) 1991-10-21

Family

ID=31512505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP889290U Pending JPH03100438U (en) 1990-01-31 1990-01-31

Country Status (1)

Country Link
JP (1) JPH03100438U (en)

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