JPH0280453U - - Google Patents
Info
- Publication number
- JPH0280453U JPH0280453U JP15992488U JP15992488U JPH0280453U JP H0280453 U JPH0280453 U JP H0280453U JP 15992488 U JP15992488 U JP 15992488U JP 15992488 U JP15992488 U JP 15992488U JP H0280453 U JPH0280453 U JP H0280453U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- board
- thermal print
- head
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本願考案の実施例に係るサーマルプリ
ントヘツドの分解斜視図、第２図は実施例のサー
マルプリントヘツドの断面図、第３図はサーマル
プリントヘツドを第２図の矢視方向から見た図
、第４図および第５図は他の実施例を示した図、
第６図は従来例の断面図である。
１……放熱板、２……発熱ドツト、４……ヘツ
ド基板、５……接続用基板、９……押さえカバー
、１１……中空部、１２……基板載置部、１３…
…昇温遅延部。
FIG. 1 is an exploded perspective view of a thermal print head according to an embodiment of the invention, FIG. 2 is a sectional view of the thermal print head of the embodiment, and FIG. 3 is a view of the thermal print head in the direction of the arrow in FIG. Figures 4 and 5 are diagrams showing other embodiments,
FIG. 6 is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Heat generating dot, 4... Head board, 5... Connection board, 9... Holding cover, 11... Hollow part, 12... Board mounting part, 13...
...Temperature rise delay section.
Claims (1)
るヘツド基板と、一側部裏面に形成された端子部
を上記ヘツド基板の一側部表面に形成された端子
部に重ね合わされる接続用基板とを固定するとと
もに、上記端子部の重合部を押圧する押さえカバ
ーを上記接続用基板の上から上記放熱板にねじ止
めしてなるサーマルプリントヘツドにおいて、 上記放熱板は、基板載置部の下方に長手方向に
形成される中空部をはさんで位置する昇温遅延部
を備えていることを特徴とする、サーマルプリン
トヘツド。[Claims for Utility Model Registration] A head board having heating dots arranged in a row on a heat sink, a terminal portion formed on the back surface of one side, and a terminal formed on the surface of one side of the head board. In the thermal print head, a holding cover for pressing the overlapping part of the terminal part is fixed to the connecting board overlapped with the terminal part, and a presser cover that presses the overlapping part of the terminal part is screwed to the heat sink from above the connecting board. 1. A thermal print head comprising a temperature rise delay section positioned across a hollow section formed in the longitudinal direction below a substrate mounting section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15992488U JPH0280453U (en) | 1988-12-08 | 1988-12-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15992488U JPH0280453U (en) | 1988-12-08 | 1988-12-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0280453U true JPH0280453U (en) | 1990-06-21 |
Family
ID=31441557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15992488U Pending JPH0280453U (en) | 1988-12-08 | 1988-12-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0280453U (en) |
-
1988
- 1988-12-08 JP JP15992488U patent/JPH0280453U/ja active Pending