JPH0282536U - - Google Patents
Info
- Publication number
- JPH0282536U JPH0282536U JP1988161496U JP16149688U JPH0282536U JP H0282536 U JPH0282536 U JP H0282536U JP 1988161496 U JP1988161496 U JP 1988161496U JP 16149688 U JP16149688 U JP 16149688U JP H0282536 U JPH0282536 U JP H0282536U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- terminal
- board
- thermal print
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
Description
第1図は本願考案の実施例に係るサーマルプリ
ントヘツドの分解斜視図、第2図は第1図の−
線断面に相当する図、第3図は従来例を示した
図である。
1……放熱板、2……発熱ドツト、4……ヘツ
ド基板、5……接続用基板、9……押さえカバー
、10……補助部材。
FIG. 1 is an exploded perspective view of a thermal print head according to an embodiment of the present invention, and FIG.
A diagram corresponding to a line cross section, FIG. 3, is a diagram showing a conventional example. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Heat generating dot, 4... Head board, 5... Connection board, 9... Holder cover, 10... Auxiliary member.
Claims (1)
るヘツド基板と、一側部裏面に形成された端子部
を上記ヘツド基板の一側部表面に形成された端子
部に重ね合わされる接続用基板とを固定するとと
もに、上記端子部の重合部を押圧する押さえカバ
ーを上記接続用基板の上から上記放熱板にねじ止
めしてなるサーマルプリントヘツドにおいて、 上記放熱板の下面に、線膨張率が放熱板より小
さい材質で形成された補助部材を、放熱板の長手
方向に沿つて添設したことを特徴とする、サーマ
ルプリントヘツド。[Claims for Utility Model Registration] A head board having heating dots arranged in a row on a heat sink, a terminal portion formed on the back surface of one side, and a terminal formed on the surface of one side of the head board. In the thermal print head, a holding cover for pressing the overlapping part of the terminal part is fixed to the connection board overlapped with the terminal part, and is screwed to the heat sink from above the connection board, the heat sink. A thermal print head characterized in that an auxiliary member made of a material having a coefficient of linear expansion smaller than that of the heat sink is attached to the lower surface of the heat sink along the longitudinal direction of the heat sink.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16149688U JPH088828Y2 (en) | 1988-12-13 | 1988-12-13 | Thermal print head |
US07/443,319 US4972205A (en) | 1988-12-08 | 1989-11-30 | Thermal printing head |
DE3940545A DE3940545C2 (en) | 1988-12-08 | 1989-12-07 | Thermal print head |
KR1019890018209A KR920009861B1 (en) | 1988-12-08 | 1989-12-07 | Thermal printing head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16149688U JPH088828Y2 (en) | 1988-12-13 | 1988-12-13 | Thermal print head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0282536U true JPH0282536U (en) | 1990-06-26 |
JPH088828Y2 JPH088828Y2 (en) | 1996-03-13 |
Family
ID=31444481
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16149688U Expired - Lifetime JPH088828Y2 (en) | 1988-12-08 | 1988-12-13 | Thermal print head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH088828Y2 (en) |
-
1988
- 1988-12-13 JP JP16149688U patent/JPH088828Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH088828Y2 (en) | 1996-03-13 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |