JPS63161734U - - Google Patents
Info
- Publication number
- JPS63161734U JPS63161734U JP5281687U JP5281687U JPS63161734U JP S63161734 U JPS63161734 U JP S63161734U JP 5281687 U JP5281687 U JP 5281687U JP 5281687 U JP5281687 U JP 5281687U JP S63161734 U JPS63161734 U JP S63161734U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- substrate
- printing head
- thermal printing
- heating elements
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 4
- 238000007651 thermal printing Methods 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011810 insulating material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例を示す断面図であり
、第２図は第１図の平面図であり、第３図及び第
４図は従来の熱印字ヘツドを示す斜視図及び断面
図である。
符号の説明、１……基板、２……発熱体、３，
４……導体、６……放熱器、１０……発熱体保持
部材、１１……充填材、１２……補助放熱部材。
FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a plan view of FIG. 1, and FIGS. 3 and 4 are a perspective view and a sectional view of a conventional thermal printing head. It is. Explanation of symbols, 1...Substrate, 2...Heating element, 3,
4...Conductor, 6...Radiator, 10...Heating element holding member, 11...Filler, 12...Auxiliary heat radiation member.
Claims (1)
々に接続された導体を基板上に配設し、この基板
を放熱器に装着した熱印字ヘツドにおいて、 前記発熱体と前記基板間に熱伝導率の高い補助
放熱部材を配設すると共に、この部材の前記発熱
体に対向する部位に設けた開口に熱伝導率の低い
材料を充填したことを特徴とする熱印字ヘツド。 (2) 前記補助放熱部材と前記発熱体との間に絶
縁材による発熱体保持部材を設け、その厚みを発
熱体間隙以下にすることを特徴とする前記実用新
案登録請求の範囲第１項記載の熱印字ヘツド。[Scope of Claim for Utility Model Registration] (1) In a thermal printing head in which heating elements with predetermined dot spacing and conductors connected to each of the heating elements are arranged on a substrate, and this substrate is attached to a heat sink, the above-mentioned: An auxiliary heat radiating member having high thermal conductivity is disposed between the heating element and the substrate, and an opening provided in a portion of this member facing the heating element is filled with a material having low thermal conductivity. Thermal printing head. (2) A heating element holding member made of an insulating material is provided between the auxiliary heat radiating member and the heating element, and the thickness of the heating element holding member is set to be equal to or less than the gap between the heating elements. thermal printing head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5281687U JPS63161734U (en) | 1987-04-08 | 1987-04-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5281687U JPS63161734U (en) | 1987-04-08 | 1987-04-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63161734U true JPS63161734U (en) | 1988-10-21 |
Family
ID=30878323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5281687U Pending JPS63161734U (en) | 1987-04-08 | 1987-04-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63161734U (en) |
-
1987
- 1987-04-08 JP JP5281687U patent/JPS63161734U/ja active Pending
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