JPS61186446U - - Google Patents
Info
- Publication number
- JPS61186446U JPS61186446U JP7031385U JP7031385U JPS61186446U JP S61186446 U JPS61186446 U JP S61186446U JP 7031385 U JP7031385 U JP 7031385U JP 7031385 U JP7031385 U JP 7031385U JP S61186446 U JPS61186446 U JP S61186446U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat generating
- generating resistor
- thermal head
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011521 glass Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005338 heat storage Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Electronic Switches (AREA)
- Non-Adjustable Resistors (AREA)
Description
第1図は本考案の一実施例を示す断面図、第2
図は第1図の実施例の平面図、第3図は従来の厚
膜型サーマルヘツドの一例を示す断面図。
符号の説明、11……アルミナ基板、12……
ガラス蓄熱層、13……金導体、14……メツキ
膜、15……発熱抵抗体、16……半導体素子、
17……ボンデイングワイヤ、18……ガラス耐
摩耗層。
Fig. 1 is a sectional view showing one embodiment of the present invention;
1 is a plan view of the embodiment shown in FIG. 1, and FIG. 3 is a sectional view showing an example of a conventional thick-film thermal head. Explanation of symbols, 11...Alumina substrate, 12...
Glass heat storage layer, 13... Gold conductor, 14... Plated film, 15... Heat generating resistor, 16... Semiconductor element,
17...Bonding wire, 18...Glass wear-resistant layer.
Claims (1)
に電極としての導体層および発熱抵抗体を形成し
、記録信号に応じて前記発熱抵抗体に通電し、そ
の発熱により感熱記録紙の発色、あるいはインク
ドナーフイルムによる転写を行なわせるサーマル
ヘツドにおいて、 前記導体層は、メタロオーガニツク金ペースト
を用いて形成した第1層と、該第1層の少なくと
も前記発熱抵抗体の下部およびその近傍を除く下
部に金のパターンメツキによるメツキ膜の第2層
を有することを特徴とするサーマルヘツド。[Claims for Utility Model Registration] A conductive layer as an electrode and a heat generating resistor are formed on a substrate made of alumina or the like on which a glass heat storage layer is formed, and the heat generating resistor is energized according to a recording signal, and the heat generated by the heat generating resistor is In a thermal head that performs color development on thermal recording paper or transfer using an ink donor film, the conductor layer includes a first layer formed using a metallo-organic gold paste, and at least a portion of the heating resistor in the first layer. 1. A thermal head comprising a second layer of plating film formed by pattern plating of gold on the lower part except for the lower part and the vicinity thereof.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7031385U JPS61186446U (en) | 1985-05-13 | 1985-05-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7031385U JPS61186446U (en) | 1985-05-13 | 1985-05-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61186446U true JPS61186446U (en) | 1986-11-20 |
Family
ID=30606779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7031385U Pending JPS61186446U (en) | 1985-05-13 | 1985-05-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61186446U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02249658A (en) * | 1988-09-06 | 1990-10-05 | Fuji Xerox Co Ltd | Preparation of thermal head |
JP2014201030A (en) * | 2013-04-08 | 2014-10-27 | アオイ電子株式会社 | Circuit board and thermal print head using the same |
-
1985
- 1985-05-13 JP JP7031385U patent/JPS61186446U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02249658A (en) * | 1988-09-06 | 1990-10-05 | Fuji Xerox Co Ltd | Preparation of thermal head |
JP2014201030A (en) * | 2013-04-08 | 2014-10-27 | アオイ電子株式会社 | Circuit board and thermal print head using the same |
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