JPS61192847U - - Google Patents
Info
- Publication number
- JPS61192847U JPS61192847U JP7864785U JP7864785U JPS61192847U JP S61192847 U JPS61192847 U JP S61192847U JP 7864785 U JP7864785 U JP 7864785U JP 7864785 U JP7864785 U JP 7864785U JP S61192847 U JPS61192847 U JP S61192847U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- insulating substrate
- chip
- printing head
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007651 thermal printing Methods 0.000 claims description 4
- 238000005259 measurement Methods 0.000 claims 1
Landscapes
- Electronic Switches (AREA)
Description
第１図ないし第３図は、本考案の実施例を示し
、第１図はこの実施例に係る熱印字ヘツドの平面
図、第２図はその要部拡大平面図、第３図は第２
図における切断線―に沿う断面図、第４図は
他の実施例の要部拡大断面図、第５図は従来例の
要部拡大断面図である。
１…絶縁基板、２…発熱抵抗体、４…ＩＣチツ
プ、５…リード電極、６…リード電極の引出端部
、７…ＩＣチツプの電極、９…ボンデイングパツ
ド、１０…測定用パツド、１１…ボンデイングワ
イヤ。
1 to 3 show an embodiment of the present invention, in which FIG. 1 is a plan view of a thermal printing head according to this embodiment, FIG. 2 is an enlarged plan view of its main parts, and FIG.
4 is an enlarged sectional view of a main part of another embodiment, and FIG. 5 is an enlarged sectional view of a main part of a conventional example. DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Heating resistor, 4... IC chip, 5... Lead electrode, 6... Leading end of lead electrode, 7... Electrode of IC chip, 9... Bonding pad, 10... Measuring pad, 11 ...Bonding wire.
Claims (1)
を形成すると共に、前記絶縁基板上の前記発熱抵
抗体から離れた位置に該発熱抵抗体を駆動するＩ
Ｃチツプを取り付け、このＩＣチツプと前記発熱
抵抗体とを電気的に接続してなる熱印字ヘツドで
あつて、前記絶縁基板上に前記発熱抵抗体からＩ
Ｃチツプの近傍にわたつて複数のリード電極を形
成し、各リード電極の引出端部と前記ＩＣチツプ
の電極とをボンデイングワイヤを介して接続して
なる熱印字ヘツドのリード電極の構造において、 前記各リード電極の引出端部にそれぞれ、前記
ボンデイングワイヤが接続されるボンデイングパ
ツドと測定用パツドとを別々に分離形成したこと
を特徴とする熱印字ヘツドのリード電極の構造。[Claims for Utility Model Registration] An insulating substrate is provided, a heating resistor is formed on the insulating substrate, and the heating resistor is driven to a position away from the heating resistor on the insulating substrate.
A thermal printing head is provided with a C chip attached thereto, and the IC chip and the heat generating resistor are electrically connected to each other, and the heat generating resistor is printed on the insulating substrate.
In the structure of the lead electrode of a thermal printing head, in which a plurality of lead electrodes are formed near the C chip, and the lead-out end of each lead electrode is connected to the electrode of the IC chip via a bonding wire, A structure of a lead electrode of a thermal printing head, characterized in that a bonding pad to which the bonding wire is connected and a measurement pad are separately formed at the lead-out end of each lead electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7864785U JPS61192847U (en) | 1985-05-27 | 1985-05-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7864785U JPS61192847U (en) | 1985-05-27 | 1985-05-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61192847U true JPS61192847U (en) | 1986-12-01 |
Family
ID=30622813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7864785U Pending JPS61192847U (en) | 1985-05-27 | 1985-05-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61192847U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347758A (en) * | 1989-03-31 | 1991-02-28 | Canon Inc | Recording head substrate and recording head |
| JP2012116064A (en) * | 2010-11-30 | 2012-06-21 | Rohm Co Ltd | Thermal printing head |
| CN102529416A (en) * | 2010-11-30 | 2012-07-04 | 罗姆股份有限公司 | Thermal print head |
| JP2015096338A (en) * | 2015-01-28 | 2015-05-21 | ローム株式会社 | Thermal printing head |
| JP2017043013A (en) * | 2015-08-27 | 2017-03-02 | 京セラ株式会社 | Thermal head and thermal printer |
| WO2020196078A1 (en) | 2019-03-26 | 2020-10-01 | 京セラ株式会社 | Thermal head and thermal printer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6013767B2 (en) * | 1980-11-12 | 1985-04-09 | 厚木機械株式会社 | Thread groove grinding method for internal threads |
-
1985
- 1985-05-27 JP JP7864785U patent/JPS61192847U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6013767B2 (en) * | 1980-11-12 | 1985-04-09 | 厚木機械株式会社 | Thread groove grinding method for internal threads |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0347758A (en) * | 1989-03-31 | 1991-02-28 | Canon Inc | Recording head substrate and recording head |
| JP2012116064A (en) * | 2010-11-30 | 2012-06-21 | Rohm Co Ltd | Thermal printing head |
| CN102529416A (en) * | 2010-11-30 | 2012-07-04 | 罗姆股份有限公司 | Thermal print head |
| JP2015096338A (en) * | 2015-01-28 | 2015-05-21 | ローム株式会社 | Thermal printing head |
| JP2017043013A (en) * | 2015-08-27 | 2017-03-02 | 京セラ株式会社 | Thermal head and thermal printer |
| WO2020196078A1 (en) | 2019-03-26 | 2020-10-01 | 京セラ株式会社 | Thermal head and thermal printer |
| US11772387B2 (en) | 2019-03-26 | 2023-10-03 | Kyocera Corporation | Thermal head and thermal printer |
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