JPS61199046U - - Google Patents

Info

Publication number
JPS61199046U
JPS61199046U JP1985081939U JP8193985U JPS61199046U JP S61199046 U JPS61199046 U JP S61199046U JP 1985081939 U JP1985081939 U JP 1985081939U JP 8193985 U JP8193985 U JP 8193985U JP S61199046 U JPS61199046 U JP S61199046U
Authority
JP
Japan
Prior art keywords
resin coating
semiconductor device
electrode
utility
model registration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985081939U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985081939U priority Critical patent/JPS61199046U/ja
Publication of JPS61199046U publication Critical patent/JPS61199046U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の半導体素子の実施例を示す縦
断面図、第２図は平面図、第３図はその半導体素
子にワイヤボンデイングを施した状態を示す縦断
面図、第４図は第３図の―線に沿う断面図、
第５図は従来の半導体素子のワイヤボンデイング
の状態を示す説明図、第６図は剥離状態を示す説
明図である。 １……半導体チツプ、２……電極、２ａ……一
部、３……樹脂被膜、４……金線、４ａ……ボー
ル、１０……半導体素子。 FIG. 1 is a vertical cross-sectional view showing an embodiment of the semiconductor device of the present invention, FIG. 2 is a plan view, FIG. 3 is a vertical cross-sectional view showing the semiconductor device after wire bonding, and FIG. A cross-sectional view along the - line in Figure 3,
FIG. 5 is an explanatory diagram showing the state of wire bonding of a conventional semiconductor element, and FIG. 6 is an explanatory diagram showing the state of peeling. DESCRIPTION OF SYMBOLS 1... Semiconductor chip, 2... Electrode, 2a... Part, 3... Resin coating, 4... Gold wire, 4a... Ball, 10... Semiconductor element.

Claims (1)

【実用新案登録請求の範囲】 (1) 上面にワイヤボンデイング用の電極を有す
る半導体素子において、上記上面における上記電
極の少なくとも一部を残す他の部分全面に樹脂被
膜を形成して成る半導体素子。 (2) 上記樹脂被膜が、透明かつ耐熱性のもので
あることを特徴とする実用新案登録請求の範囲第
(1)項記載の半導体素子。 (3) 上記樹脂被膜が、ポリイミドであることを
特徴とする実用新案登録請求の範囲第(2)項帰記
載の半導体素子。[Claims for Utility Model Registration] (1) A semiconductor element having an electrode for wire bonding on its upper surface, which is formed by forming a resin coating over the entire surface of the upper surface, except for at least a portion of the electrode. (2) The scope of the utility model registration claim is characterized in that the resin coating is transparent and heat resistant.
The semiconductor device described in (1). (3) The semiconductor device according to claim (2), wherein the resin coating is made of polyimide.
JP1985081939U 1985-05-31 1985-05-31 Pending JPS61199046U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985081939U JPS61199046U (en) 1985-05-31 1985-05-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985081939U JPS61199046U (en) 1985-05-31 1985-05-31

Publications (1)

Publication Number Publication Date
JPS61199046U true JPS61199046U (en) 1986-12-12

Family

ID=30629199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985081939U Pending JPS61199046U (en) 1985-05-31 1985-05-31

Country Status (1)

Country Link
JP (1) JPS61199046U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04271132A (en) * 1991-01-29 1992-09-28 Mitsubishi Electric Corp Semiconductor device
JP2006120882A (en) * 2004-10-22 2006-05-11 Sony Corp Semiconductor light emitting device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100965A (en) * 1973-01-29 1974-09-24

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49100965A (en) * 1973-01-29 1974-09-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04271132A (en) * 1991-01-29 1992-09-28 Mitsubishi Electric Corp Semiconductor device
JP2006120882A (en) * 2004-10-22 2006-05-11 Sony Corp Semiconductor light emitting device

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