JPS6455042U - - Google Patents
Info
- Publication number
- JPS6455042U JPS6455042U JP15065587U JP15065587U JPS6455042U JP S6455042 U JPS6455042 U JP S6455042U JP 15065587 U JP15065587 U JP 15065587U JP 15065587 U JP15065587 U JP 15065587U JP S6455042 U JPS6455042 U JP S6455042U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- substrate
- wiring board
- pads
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図Ａは一実施例を示す部分平面図、同図Ｂ
は同図ＡのＣ―Ｃ線位置での断面図、第２図はサ
ーマルヘツドの一例を示す概略平面図、第３図Ａ
は従来のサーマルヘツドのパツド部分を示す部分
平面図、同図Ｂは同図ＡのＡ―Ａ線位置での断面
図、第４図Ａは従来の他のサーマルヘツドのパツ
ド部分を示す部分平面図、同図Ｂは同図ＡのＢ―
Ｂ線位置での断面図、第５図は従来のパツドと隣
接選択電極の関係を示す断面図、第６図は一実施
例のパツドと隣接選択電極の関係を示す断面図で
ある。
１…セラミツク基板、１ａ…一辺、２…発熱抵
抗体素子、４…選択電極、５―１，５―２ａ，５
―３，５―４ａ…パツド、９…ワイヤ。
Fig. 1A is a partial plan view showing one embodiment, Fig. 1B
is a sectional view taken along line C-C in Figure A, Figure 2 is a schematic plan view showing an example of a thermal head, and Figure 3 is A.
4A is a partial plan view showing the pad portion of a conventional thermal head, FIG. 4B is a sectional view taken along line A-A in FIG. Figure, B of the same figure is B- of the same figure A.
FIG. 5 is a sectional view showing the relationship between a conventional pad and an adjacent selection electrode, and FIG. 6 is a sectional view showing the relationship between a pad and an adjacent selection electrode in one embodiment. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 1a... One side, 2... Heating resistor element, 4... Selection electrode, 5-1, 5-2a, 5
-3,5-4a...pad, 9...wire.
Claims (1)
続される選択電極が形成され、この選択電極の先
端のパツドが前記基板の一辺に沿つて配列されて
おり、パツドが配列された一辺に沿つて前記基板
に平行に配線基板が配置され、この配線基板には
駆動用ＩＣチツプが搭載され、前記パツドとこの
駆動用ＩＣチツプの間がワイヤボンデイング法に
より接続されている電子装置において、前記パツ
ドを基板の配線基板側の一辺に対して遠い側と近
い側とに交互に配置し、かつ、遠い側のパツドの
高さを近い側のパツドの高さよりも高くしたこと
を特徴とする電子装置。 A selection electrode connected to each functional element is formed on the substrate on which the functional elements are formed, and pads at the tips of the selection electrodes are arranged along one side of the substrate. In the electronic device, a wiring board is disposed parallel to the substrate, a driving IC chip is mounted on the wiring board, and the pad and the driving IC chip are connected by a wire bonding method. An electronic device characterized in that the pads are arranged alternately on the far side and the near side with respect to one side of the wiring board side of the board, and the height of the pad on the far side is higher than the height of the pad on the near side. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15065587U JPS6455042U (en) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15065587U JPS6455042U (en) | 1987-09-30 | 1987-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6455042U true JPS6455042U (en) | 1989-04-05 |
Family
ID=31423993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15065587U Pending JPS6455042U (en) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6455042U (en) |
-
1987
- 1987-09-30 JP JP15065587U patent/JPS6455042U/ja active Pending