JPS6238154U - - Google Patents
Info
- Publication number
- JPS6238154U JPS6238154U JP12944485U JP12944485U JPS6238154U JP S6238154 U JPS6238154 U JP S6238154U JP 12944485 U JP12944485 U JP 12944485U JP 12944485 U JP12944485 U JP 12944485U JP S6238154 U JPS6238154 U JP S6238154U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- heat generating
- generating resistor
- flip
- print head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案サーマルプリントヘツドの一実
施例を示す部分切欠平面図、第２図は同実施例に
おけるＩＣチツプの拡大裏面図、第３図は第１図
の―線拡大縦断面図、第４図は従来のＩＣチ
ツプの第２図同様図である。
（符号の説明）、１……基板、２……発熱抵抗
体、３……フリツプチツプ型ＩＣチツプ、３０…
…側辺部、３１……出力端子、４……リード線、
５……外部接続端子。
FIG. 1 is a partially cutaway plan view showing an embodiment of the thermal print head of the present invention, FIG. 2 is an enlarged back view of an IC chip in the same embodiment, and FIG. 3 is an enlarged vertical cross-sectional view taken along the line - FIG. 4 is a diagram similar to FIG. 2 of a conventional IC chip. (Explanation of symbols), 1...Substrate, 2...Heating resistor, 3...Flip-chip type IC chip, 30...
...Side part, 31...Output terminal, 4...Lead wire,
5...External connection terminal.
Claims (1)
び外部接続端子に接続されるリード線を被着形成
すると共に該リード線に上記発熱抵抗体を選択的
に発熱させるためのフリツプチツプ型駆動用ＩＣ
チツプをワイヤレスボンデイングにより接続して
成るサーマルプリントヘツドに於いて、前記フリ
ツプチツプ型駆動用ＩＣチツプの出力端子を該Ｉ
Ｃチツプの一側辺で千鳥状に配列して成ることを
特徴とするサーマルプリントヘツド。 A flip-chip drive device for forming lead wires connected to the heat generating resistor and external connection terminals on a substrate provided with the heat generating resistor, and selectively causing the heat generating resistor to generate heat on the lead wires. IC
In a thermal print head in which chips are connected by wireless bonding, the output terminal of the flip-chip type driving IC chip is connected to the I
A thermal print head characterized by C chips arranged in a staggered manner on one side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12944485U JPS6238154U (en) | 1985-08-23 | 1985-08-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12944485U JPS6238154U (en) | 1985-08-23 | 1985-08-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6238154U true JPS6238154U (en) | 1987-03-06 |
Family
ID=31026018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12944485U Pending JPS6238154U (en) | 1985-08-23 | 1985-08-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6238154U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60176245A (en) * | 1984-02-23 | 1985-09-10 | Toshiba Corp | Wire bonding method |
-
1985
- 1985-08-23 JP JP12944485U patent/JPS6238154U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60176245A (en) * | 1984-02-23 | 1985-09-10 | Toshiba Corp | Wire bonding method |