JPS61206457U - - Google Patents
Info
- Publication number
- JPS61206457U JPS61206457U JP9088985U JP9088985U JPS61206457U JP S61206457 U JPS61206457 U JP S61206457U JP 9088985 U JP9088985 U JP 9088985U JP 9088985 U JP9088985 U JP 9088985U JP S61206457 U JPS61206457 U JP S61206457U
- Authority
- JP
- Japan
- Prior art keywords
- board
- resistor
- thermal head
- integrated circuit
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electronic Switches (AREA)
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の一実施例を示す概略図、第２
図は従来のサーマルヘツドの一例を示す概略図で
ある。
２１……抵抗基板、２４……フレキシブル回路
基板、２５……ＩＣチツプ。
Figure 1 is a schematic diagram showing one embodiment of the present invention;
The figure is a schematic diagram showing an example of a conventional thermal head. 21...Resistor board, 24...Flexible circuit board, 25...IC chip.
Claims (1)
抵抗基板上に接着されたフレキシブル回路基板と
、前記抵抗基板と前記フレキシブル回路基板とを
接続するボンデイングワイヤとを少なくとも備え
たことを特徴とするサーマルヘツド。 (2) 前記抵抗基板はリード線を有し、また前記
フレキシブル回路基板は集積回路を有し、この集
積回路と前記リード線とをボンデイングワイヤで
接続したことを特徴とする実用新案登録請求の範
囲第１項記載のサーマルヘツド。 (3) 前記集積回路の配設部に対応して、前記リ
ード線が存在することを特徴とする実用新案登録
請求の範囲第２項記載のサーマルヘツド。[Claims for Utility Model Registration] (1) A resistor board provided with a heating resistor, a flexible circuit board bonded onto the resistor board, and a bonding wire connecting the resistor board and the flexible circuit board. A thermal head comprising at least the following: (2) The scope of the utility model registration claim, characterized in that the resistor board has a lead wire, the flexible circuit board has an integrated circuit, and the integrated circuit and the lead wire are connected with a bonding wire. The thermal head according to item 1. (3) The thermal head according to claim 2, characterized in that the lead wire is present in correspondence to the disposed portion of the integrated circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9088985U JPS61206457U (en) | 1985-06-18 | 1985-06-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9088985U JPS61206457U (en) | 1985-06-18 | 1985-06-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61206457U true JPS61206457U (en) | 1986-12-26 |
Family
ID=30646291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9088985U Pending JPS61206457U (en) | 1985-06-18 | 1985-06-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61206457U (en) |
-
1985
- 1985-06-18 JP JP9088985U patent/JPS61206457U/ja active Pending
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