JPS62145361U - - Google Patents
Info
- Publication number
- JPS62145361U JPS62145361U JP3125186U JP3125186U JPS62145361U JP S62145361 U JPS62145361 U JP S62145361U JP 3125186 U JP3125186 U JP 3125186U JP 3125186 U JP3125186 U JP 3125186U JP S62145361 U JPS62145361 U JP S62145361U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- circuit board
- printed circuit
- component
- wire connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004048 modification Effects 0.000 claims 1
- 238000012986 modification Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の実施例を示す図、第２図は本
考案の実施例の使用方法を示す図、第３図は従来
の印刷回路基板を示す図である。
第１図、第２図において、１０はフラツトリー
ド部品、１１はフラツトリード部品のリード、１
２は部品接合用パツド、１３はワイヤ接続用パツ
ド、１４はグランド用パツド、１５はシングルワ
イヤ、１６はツインワイヤである。
FIG. 1 is a diagram showing an embodiment of the present invention, FIG. 2 is a diagram showing a method of using the embodiment of the present invention, and FIG. 3 is a diagram showing a conventional printed circuit board. In FIGS. 1 and 2, 10 is a flat lead component, 11 is a lead of the flat lead component, and 1 is a flat lead component.
2 is a pad for joining parts, 13 is a pad for wire connection, 14 is a ground pad, 15 is a single wire, and 16 is a twin wire.
Claims (1)
る部品接合用パツド１２と、その延長上に改造用
のワイヤ接続用パツド１３を有する印刷回路基板
において、 上記ワイヤ接続用パツド１３が部品接合用パツ
ド１２と同じ幅を有し且つ規則的な引き出し角度
を有することを特徴とした印刷回路基板の構造。[Claims for Utility Model Registration] A printed circuit board having a component bonding pad 12 for bonding the leads 11 of a flat lead component 10, and a wire connection pad 13 for modification on an extension thereof, wherein the wire connection pad 13 is A structure of a printed circuit board characterized by having the same width as a component bonding pad 12 and a regular drawing angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3125186U JPS62145361U (en) | 1986-03-06 | 1986-03-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3125186U JPS62145361U (en) | 1986-03-06 | 1986-03-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62145361U true JPS62145361U (en) | 1987-09-12 |
Family
ID=30836813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3125186U Pending JPS62145361U (en) | 1986-03-06 | 1986-03-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62145361U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004006637A1 (en) * | 2002-07-08 | 2004-01-15 | Shinko Electric Industries Co., Ltd. | Wiring pattern structure and method for forming bump |
-
1986
- 1986-03-06 JP JP3125186U patent/JPS62145361U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004006637A1 (en) * | 2002-07-08 | 2004-01-15 | Shinko Electric Industries Co., Ltd. | Wiring pattern structure and method for forming bump |