JPS61136572U - - Google Patents
Info
- Publication number
- JPS61136572U JPS61136572U JP1771285U JP1771285U JPS61136572U JP S61136572 U JPS61136572 U JP S61136572U JP 1771285 U JP1771285 U JP 1771285U JP 1771285 U JP1771285 U JP 1771285U JP S61136572 U JPS61136572 U JP S61136572U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- type electronic
- lead wire
- height
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
Landscapes
- Non-Adjustable Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第３図は夫々本考案に係わるチツプ型
電子部品の構造の実施例を示す図で、夫々Ａは平
面図、Ｂは正面図、第４図は本考案に係わるチツ
プ型電子部品において、フローソルダ法により半
田付けを行う場合を示す概略図、第５図Ａ，Ｂは
夫々従来のチツプ型電子部品において、リフロー
ソルダ法により半田付けを行う場合を示す概略図
、第６図は従来のチツプ型電子部品において、フ
ローソルダ法により半田付けを行う場合を示す概
略図である。
８……チツプ型電子部品、８ａ……部品本体、
９……リード線。
1 to 3 are diagrams showing examples of the structure of a chip-type electronic component according to the present invention, respectively, where A is a plan view, B is a front view, and FIG. 4 is a chip-type electronic component according to the present invention. 5A and 5B are schematic diagrams illustrating the case in which soldering is performed using the reflow soldering method in conventional chip-type electronic components, and FIG. FIG. 2 is a schematic diagram showing a case where soldering is performed using a flow soldering method in a chip-type electronic component of FIG. 8... Chip type electronic component, 8a... Part body,
9... Lead wire.
Claims (1)
にしたチツプ型電子部品の構造であつて、部品本
体の該本体と同等の高さ以上の高さ位置から前記
リード線を取り出す構成としたことを特徴とする
チツプ型電子部品の構造。 A structure of a chip-type electronic component in which a lead wire is connected to a printed wiring board by soldering, characterized in that the lead wire is taken out from a position of the component body at a height equal to or higher than the height of the main body. The structure of chip-type electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1771285U JPS61136572U (en) | 1985-02-13 | 1985-02-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1771285U JPS61136572U (en) | 1985-02-13 | 1985-02-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61136572U true JPS61136572U (en) | 1986-08-25 |
Family
ID=30505672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1771285U Pending JPS61136572U (en) | 1985-02-13 | 1985-02-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136572U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016449A (en) * | 1984-06-25 | 1985-01-28 | Hitachi Ltd | Miniature electronic component |
-
1985
- 1985-02-13 JP JP1771285U patent/JPS61136572U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6016449A (en) * | 1984-06-25 | 1985-01-28 | Hitachi Ltd | Miniature electronic component |