JPS6357739U - - Google Patents
Info
- Publication number
- JPS6357739U JPS6357739U JP15076986U JP15076986U JPS6357739U JP S6357739 U JPS6357739 U JP S6357739U JP 15076986 U JP15076986 U JP 15076986U JP 15076986 U JP15076986 U JP 15076986U JP S6357739 U JPS6357739 U JP S6357739U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- mounted substrate
- bonding
- package
- abutted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Die Bonding (AREA)
Description
第１図はこの考案の一実施例を示す側部断面図
、第２図は従来の接合法を示す側部断面図である
。
図中、１はＩＣ等が搭載された基板、２はパツ
ケージ、３はシアノアクリル系樹脂である。尚、
図中同一符号は同一または相当部分を示す。
FIG. 1 is a side sectional view showing an embodiment of this invention, and FIG. 2 is a side sectional view showing a conventional joining method. In the figure, 1 is a substrate on which IC etc. are mounted, 2 is a package, and 3 is a cyanoacrylic resin. still,
The same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
るものにおいて、シアノアクリル系樹脂により接
合することを特徴とする電子部品搭載基板の接合
構造。 A bonding structure for an electronic component-mounted substrate, in which the electronic component-mounted substrate is abutted to a package, etc., and is characterized in that the bonding is performed using a cyanoacrylic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15076986U JPS6357739U (en) | 1986-09-30 | 1986-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15076986U JPS6357739U (en) | 1986-09-30 | 1986-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6357739U true JPS6357739U (en) | 1988-04-18 |
Family
ID=31067211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15076986U Pending JPS6357739U (en) | 1986-09-30 | 1986-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6357739U (en) |
-
1986
- 1986-09-30 JP JP15076986U patent/JPS6357739U/ja active Pending