JPS62109459U - - Google Patents

Info

Publication number
JPS62109459U
JPS62109459U JP20238085U JP20238085U JPS62109459U JP S62109459 U JPS62109459 U JP S62109459U JP 20238085 U JP20238085 U JP 20238085U JP 20238085 U JP20238085 U JP 20238085U JP S62109459 U JPS62109459 U JP S62109459U
Authority
JP
Japan
Prior art keywords
semiconductor device
circuit board
leads
heated
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20238085U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP20238085U priority Critical patent/JPS62109459U/ja
Publication of JPS62109459U publication Critical patent/JPS62109459U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の第1の実施例を示す半導体装
置の要部拡大図、第2図は従来の半導体装置の側
面図、第3図は本考案の第2の実施例を示す半導
体装置の要部拡大図である。 10……半導体装置、11,20……リード、
15……回路基板、16……熱溶融性導電材。
FIG. 1 is an enlarged view of main parts of a semiconductor device showing a first embodiment of the present invention, FIG. 2 is a side view of a conventional semiconductor device, and FIG. 3 is a semiconductor device showing a second embodiment of the present invention. It is an enlarged view of the main part. 10...Semiconductor device, 11,20...Lead,
15...Circuit board, 16...Thermofusible conductive material.

Claims (1)

【実用新案登録請求の範囲】 加熱により回路基板上に熱溶融性導電材で接続
される複数本のリードを有する半導体装置におい
て、 前記リードは前記加熱時に前記回路基板方向に
熱変形する導電部材で形成したことを特徴とする
半導体装置。
[Claims for Utility Model Registration] A semiconductor device having a plurality of leads that are connected to a circuit board by heat-melting conductive material when heated, wherein the leads are conductive members that are thermally deformed toward the circuit board when heated. A semiconductor device characterized in that:
JP20238085U 1985-12-27 1985-12-27 Pending JPS62109459U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20238085U JPS62109459U (en) 1985-12-27 1985-12-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20238085U JPS62109459U (en) 1985-12-27 1985-12-27

Publications (1)

Publication Number Publication Date
JPS62109459U true JPS62109459U (en) 1987-07-13

Family

ID=31166705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20238085U Pending JPS62109459U (en) 1985-12-27 1985-12-27

Country Status (1)

Country Link
JP (1) JPS62109459U (en)

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