JPS61131864U - - Google Patents
Info
- Publication number
- JPS61131864U JPS61131864U JP1614785U JP1614785U JPS61131864U JP S61131864 U JPS61131864 U JP S61131864U JP 1614785 U JP1614785 U JP 1614785U JP 1614785 U JP1614785 U JP 1614785U JP S61131864 U JPS61131864 U JP S61131864U
- Authority
- JP
- Japan
- Prior art keywords
- submount
- insulator
- semiconductor laser
- electrode
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012212 insulator Substances 0.000 claims description 3
Description
第１図及び第２図は斜視図である。
符号の説明、１：半導体レーザ素子（レーザチ
ツプ）、２：導電性サブマウント、３：ヒートシ
ンク、４：ピン、５：ボンデイングワイヤ、１１
：半導体レーザ素子（レーザチツプ）、１２：絶
縁体を用いたサブマウント、１３，１４：電極、
１５：ヒートシンク、１６：ピン、１７：ボンデ
イングワイヤ。
1 and 2 are perspective views. Explanation of symbols, 1: semiconductor laser element (laser chip), 2: conductive submount, 3: heat sink, 4: pin, 5: bonding wire, 11
: semiconductor laser element (laser chip), 12: submount using insulator, 13, 14: electrode,
15: heat sink, 16: pin, 17: bonding wire.
Claims (1)
トを設けると共に、該絶縁体を用いたサブマウン
ト表面に相互に分離された２つの電極を設け、一
方の電極上に半導体レーザ素子をボンデイングす
る構成としたことを特徴とする半導体レーザ装置
。 A submount using an insulator is provided as a submount, two electrodes separated from each other are provided on the surface of the submount using the insulator, and a semiconductor laser element is bonded onto one electrode. A semiconductor laser device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1614785U JPS61131864U (en) | 1985-02-06 | 1985-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1614785U JPS61131864U (en) | 1985-02-06 | 1985-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61131864U true JPS61131864U (en) | 1986-08-18 |
Family
ID=30502642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1614785U Pending JPS61131864U (en) | 1985-02-06 | 1985-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61131864U (en) |
-
1985
- 1985-02-06 JP JP1614785U patent/JPS61131864U/ja active Pending
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