JPS62161744U - - Google Patents
Info
- Publication number
- JPS62161744U JPS62161744U JP5117186U JP5117186U JPS62161744U JP S62161744 U JPS62161744 U JP S62161744U JP 5117186 U JP5117186 U JP 5117186U JP 5117186 U JP5117186 U JP 5117186U JP S62161744 U JPS62161744 U JP S62161744U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- land
- bonding wire
- electrodes provided
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
Description
第１図乃至第３図は、この考案の一実施例チツ
プヒユーズを示し、第１図は同チツプヒユーズの
上面図、第２図は同側面図、第３図は同下面図、
第４図は、同チツプヒユーズの実装例を示す図、
第５図は同チツプヒユーズの他の実施例を示す図
である。
２：セラミツク基板、４・５：電極、６ａ・６
ｂ・６ｃ：ランド電極（第１）、７ａ・７ｂ・７
ｃ：ランド電極（第２）、９ａ・９ｂ・９ｃ：ワ
イヤ（第１）、１０ａ・１０ｂ・１０ｃ：ワイヤ
（第２）、１１：透明弾性樹脂。
1 to 3 show a chip fuse according to an embodiment of the invention, in which FIG. 1 is a top view of the chip fuse, FIG. 2 is a side view of the same, and FIG. 3 is a bottom view of the chip fuse.
FIG. 4 is a diagram showing an example of implementation of the chip fuse,
FIG. 5 is a diagram showing another embodiment of the same chip fuse. 2: Ceramic substrate, 4/5: Electrode, 6a/6
b/6c: Land electrode (first), 7a/7b/7
c: land electrode (second), 9a, 9b, 9c: wire (first), 10a, 10b, 10c: wire (second), 11: transparent elastic resin.
Claims (1)
成される一対の電極と、 前記基板の上面に設けられる１個以上のランド
電極と、 前記基板の上面で前記電極及び第１のランド電
極間を適宜結んで接続する第１のボンデイングワ
イヤと、 前記基板の下面に設けられる１個以上の第２の
ランド電極と、 前記基板の下面で前記電極及び第２のランド電
極間を適宜結んで接続する第２のボンデイングワ
イヤと、 前記基板の上面及び下面において、前記第１、
第２のボンデイングワイヤを被覆する弾力性を有
する樹脂材とからなるチツプヒユーズ。[Claims for Utility Model Registration] A hard insulating substrate; a pair of electrodes formed over the upper surface, side surfaces, and lower surfaces of both ends of the substrate; one or more land electrodes provided on the upper surface of the substrate; a first bonding wire connecting the electrode and a first land electrode as appropriate on the upper surface of the substrate; one or more second land electrodes provided on the lower surface of the substrate; and one or more second land electrodes provided on the lower surface of the substrate. a second bonding wire that connects the electrode and the second land electrode as appropriate;
A chip fuse made of an elastic resin material covering a second bonding wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5117186U JPS62161744U (en) | 1986-04-04 | 1986-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5117186U JPS62161744U (en) | 1986-04-04 | 1986-04-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62161744U true JPS62161744U (en) | 1987-10-14 |
Family
ID=30875184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5117186U Pending JPS62161744U (en) | 1986-04-04 | 1986-04-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62161744U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006210353A (en) * | 2005-01-28 | 2006-08-10 | Littelfuse Inc | Dual fuse-link thin-film fuse |
-
1986
- 1986-04-04 JP JP5117186U patent/JPS62161744U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006210353A (en) * | 2005-01-28 | 2006-08-10 | Littelfuse Inc | Dual fuse-link thin-film fuse |
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