JPS61196561U - - Google Patents
Info
- Publication number
- JPS61196561U JPS61196561U JP1985075874U JP7587485U JPS61196561U JP S61196561 U JPS61196561 U JP S61196561U JP 1985075874 U JP1985075874 U JP 1985075874U JP 7587485 U JP7587485 U JP 7587485U JP S61196561 U JPS61196561 U JP S61196561U
- Authority
- JP
- Japan
- Prior art keywords
- bond part
- base
- wire bond
- probe
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案実施例の発光素子の斜視図、第
２図は従来の発光素子の平面図である。
１…（化合物半導体の）基台、１′…表面、２
…ｐｎ接合、３…電極、４…ワイヤボンド部、５
…プローブ部、６…裏面電極。
FIG. 1 is a perspective view of a light emitting device according to an embodiment of the present invention, and FIG. 2 is a plan view of a conventional light emitting device. 1... (compound semiconductor) base, 1'... surface, 2
... pn junction, 3... electrode, 4... wire bond part, 5
...Probe part, 6...Back electrode.
Claims (1)
の基台と、その基台の表面に設けられ、円形又は
角形のワイヤボンド部と、ワイヤボンド部の輪郭
の１０％未満の領域に連接され、ワイヤボンド部
に比べ充分小さい面積のプローブ部とを有した電
極とを具備した事を特徴とする発光素子。 A compound semiconductor base having a PN junction substantially parallel to the surface, a circular or square wire bond part provided on the surface of the base, and a wire connected to an area less than 10% of the outline of the wire bond part. A light emitting element characterized by comprising an electrode having a probe part and a probe part having a sufficiently smaller area than a bond part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985075874U JPS61196561U (en) | 1985-05-22 | 1985-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985075874U JPS61196561U (en) | 1985-05-22 | 1985-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61196561U true JPS61196561U (en) | 1986-12-08 |
Family
ID=30617500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985075874U Pending JPS61196561U (en) | 1985-05-22 | 1985-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61196561U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998034285A1 (en) * | 1997-01-31 | 1998-08-06 | Matsushita Electronics Corporation | Light emitting element, semiconductor light emitting device, and method for manufacturing them |
-
1985
- 1985-05-22 JP JP1985075874U patent/JPS61196561U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998034285A1 (en) * | 1997-01-31 | 1998-08-06 | Matsushita Electronics Corporation | Light emitting element, semiconductor light emitting device, and method for manufacturing them |