JPS62109477U - - Google Patents
Info
- Publication number
- JPS62109477U JPS62109477U JP20078085U JP20078085U JPS62109477U JP S62109477 U JPS62109477 U JP S62109477U JP 20078085 U JP20078085 U JP 20078085U JP 20078085 U JP20078085 U JP 20078085U JP S62109477 U JPS62109477 U JP S62109477U
- Authority
- JP
- Japan
- Prior art keywords
- bonding pads
- die bonding
- bonding pad
- resistor
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Description
第１図は本考案の回路基板の一実施例の要部を
示すたいら面図、第２図はそれを用いて形成され
たＮＯＴ回路の回路図、第３図は従来の回路基板
の上面図である。
１，５……絶縁基板、２……共通電極、４，１
０……印刷抵抗、６……ダイボンデイングパツド
、７……ワイヤボンデイングパツド、８……電源
用ボンデイングパツド、９……グランド用ボンデ
イングパツド。
Fig. 1 is a top view showing the essential parts of an embodiment of the circuit board of the present invention, Fig. 2 is a circuit diagram of a NOT circuit formed using the circuit board, and Fig. 3 is a top view of a conventional circuit board. It is. 1, 5... Insulating substrate, 2... Common electrode, 4, 1
0... Printed resistor, 6... Die bonding pad, 7... Wire bonding pad, 8... Bonding pad for power supply, 9... Bonding pad for ground.
Claims (1)
るためのダイボンデイングパツドをそれぞれ形成
し、前記ダイボンデイングパツドの周辺に複数の
ボンデイングパツドを設けるとともに、片側電極
が共通電極に接続された印刷抵抗が形成されてな
る回路基板において、前記印刷抵抗を、前記ダイ
ボンデイングパツドとボンデイングパツド間に形
成して成ることを特徴とする回路基板。 A printing method in which a die bonding pad for mounting a conductor circuit and a circuit element is formed on an insulating substrate, a plurality of bonding pads are provided around the die bonding pad, and an electrode on one side is connected to a common electrode. 1. A circuit board on which a resistor is formed, characterized in that the printed resistor is formed between the die bonding pads and the bonding pads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20078085U JPS62109477U (en) | 1985-12-27 | 1985-12-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20078085U JPS62109477U (en) | 1985-12-27 | 1985-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62109477U true JPS62109477U (en) | 1987-07-13 |
Family
ID=31163616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20078085U Pending JPS62109477U (en) | 1985-12-27 | 1985-12-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62109477U (en) |
-
1985
- 1985-12-27 JP JP20078085U patent/JPS62109477U/ja active Pending