JPS61168636U - - Google Patents

Info

Publication number
JPS61168636U
JPS61168636U JP1985052329U JP5232985U JPS61168636U JP S61168636 U JPS61168636 U JP S61168636U JP 1985052329 U JP1985052329 U JP 1985052329U JP 5232985 U JP5232985 U JP 5232985U JP S61168636 U JPS61168636 U JP S61168636U
Authority
JP
Japan
Prior art keywords
semiconductor device
face
down mounting
wiring board
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985052329U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985052329U priority Critical patent/JPS61168636U/ja
Publication of JPS61168636U publication Critical patent/JPS61168636U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161Disposition
    • H01L2224/16151Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案による半導体装置のフエイス
ダウン実装構造の断面図、第2図は従来の半導体
装置のフエイスダウン実装構造の断面図である。 1……半導体装置、2……バンプ、3……印刷
配線板導体パターン、4……絶縁体のスペーサ。
FIG. 1 is a sectional view of a face-down mounting structure for a semiconductor device according to the present invention, and FIG. 2 is a sectional view of a conventional face-down mounting structure for a semiconductor device. DESCRIPTION OF SYMBOLS 1...Semiconductor device, 2...Bump, 3...Printed wiring board conductor pattern, 4...Insulator spacer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置のフエイスダウン実装に於いて、半
導体装置を搭載し、接合する印刷配線板の導体パ
ターンと、該半導体装置の間に、絶縁体のスペー
サを入れたことを特徴とする半導体装置のフエイ
スダウン実装構造。
Face-down mounting of a semiconductor device, characterized in that an insulating spacer is inserted between the semiconductor device and a conductor pattern of a printed wiring board on which the semiconductor device is mounted and bonded. Implementation structure.
JP1985052329U 1985-04-09 1985-04-09 Pending JPS61168636U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985052329U JPS61168636U (en) 1985-04-09 1985-04-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985052329U JPS61168636U (en) 1985-04-09 1985-04-09

Publications (1)

Publication Number Publication Date
JPS61168636U true JPS61168636U (en) 1986-10-20

Family

ID=30572185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985052329U Pending JPS61168636U (en) 1985-04-09 1985-04-09

Country Status (1)

Country Link
JP (1) JPS61168636U (en)

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