JPS61168636U - - Google Patents
Info
- Publication number
- JPS61168636U JPS61168636U JP1985052329U JP5232985U JPS61168636U JP S61168636 U JPS61168636 U JP S61168636U JP 1985052329 U JP1985052329 U JP 1985052329U JP 5232985 U JP5232985 U JP 5232985U JP S61168636 U JPS61168636 U JP S61168636U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- face
- down mounting
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000012212 insulator Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Wire Bonding (AREA)
Description
第１図は、本考案による半導体装置のフエイス
ダウン実装構造の断面図、第２図は従来の半導体
装置のフエイスダウン実装構造の断面図である。
１……半導体装置、２……バンプ、３……印刷
配線板導体パターン、４……絶縁体のスペーサ。
FIG. 1 is a sectional view of a face-down mounting structure for a semiconductor device according to the present invention, and FIG. 2 is a sectional view of a conventional face-down mounting structure for a semiconductor device. DESCRIPTION OF SYMBOLS 1...Semiconductor device, 2...Bump, 3...Printed wiring board conductor pattern, 4...Insulator spacer.
Claims (1)
導体装置を搭載し、接合する印刷配線板の導体パ
ターンと、該半導体装置の間に、絶縁体のスペー
サを入れたことを特徴とする半導体装置のフエイ
スダウン実装構造。 Face-down mounting of a semiconductor device, characterized in that an insulating spacer is inserted between the semiconductor device and a conductor pattern of a printed wiring board on which the semiconductor device is mounted and bonded. Implementation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985052329U JPS61168636U (en) | 1985-04-09 | 1985-04-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985052329U JPS61168636U (en) | 1985-04-09 | 1985-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61168636U true JPS61168636U (en) | 1986-10-20 |
Family
ID=30572185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985052329U Pending JPS61168636U (en) | 1985-04-09 | 1985-04-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61168636U (en) |
-
1985
- 1985-04-09 JP JP1985052329U patent/JPS61168636U/ja active Pending