JPH01122946U - - Google Patents
Info
- Publication number
- JPH01122946U JPH01122946U JP1952688U JP1952688U JPH01122946U JP H01122946 U JPH01122946 U JP H01122946U JP 1952688 U JP1952688 U JP 1952688U JP 1952688 U JP1952688 U JP 1952688U JP H01122946 U JPH01122946 U JP H01122946U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- board
- base
- driving integrated
- base substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 239000002470 thermal conductor Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第1図は本願考案の一実施例の断面図、第2図
はベース基板の部分拡大断面図、第3図は従来例
の断面図である。
21……プリントヘツド、22……ベース基板
、23……ヘツド基板、24……発熱体、25…
…集積回路、27……母材、28……第一絶縁層
、29……回路パターン、30……第二絶縁層、
31……薄状回路。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a partially enlarged sectional view of a base substrate, and FIG. 3 is a sectional view of a conventional example. 21...Print head, 22...Base board, 23...Head board, 24...Heating element, 25...
... integrated circuit, 27 ... base material, 28 ... first insulating layer, 29 ... circuit pattern, 30 ... second insulating layer,
31...Thin circuit.
Claims (1)
の駆動集積回路を備えるヘツド基板を固着し、か
つ、上記ベース基板の上面他側部に、上記駆動集
積回路上にオーバハングするカバー部を備える保
護カバーを固定してなるプリントヘツドであつて
、上記ベース基板は、熱良導体である金属を母材
とするとともに、少くともその上面他側部に、第
一絶縁層と導体回路パターンを積層してなり、か
つ外部回路とヘツド基板上の回路とを仲介する多
層回路部が一体形成してあることを特徴とする、
プリントヘツド。 A protective cover that has a head board that includes a printing medium and its driving integrated circuit fixed to one side of the upper surface of the base substrate, and has a cover portion that overhangs the driving integrated circuit on the other side of the upper surface of the base substrate. The base board is made of metal, which is a good thermal conductor, as a base material, and has a first insulating layer and a conductive circuit pattern laminated on at least the other side of the upper surface thereof. , and a multilayer circuit section that mediates between the external circuit and the circuit on the head board is integrally formed.
print head.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988019526U JP2518559Y2 (en) | 1988-02-17 | 1988-02-17 | Print head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988019526U JP2518559Y2 (en) | 1988-02-17 | 1988-02-17 | Print head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01122946U true JPH01122946U (en) | 1989-08-21 |
JP2518559Y2 JP2518559Y2 (en) | 1996-11-27 |
Family
ID=31235114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988019526U Expired - Lifetime JP2518559Y2 (en) | 1988-02-17 | 1988-02-17 | Print head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2518559Y2 (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60206673A (en) * | 1984-03-30 | 1985-10-18 | Seiko Keiyo Kogyo Kk | Thermal head |
JPS6195957A (en) * | 1984-10-17 | 1986-05-14 | Fuji Xerox Co Ltd | Thermal recorder |
JPS6267746U (en) * | 1985-10-19 | 1987-04-27 |
-
1988
- 1988-02-17 JP JP1988019526U patent/JP2518559Y2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60206673A (en) * | 1984-03-30 | 1985-10-18 | Seiko Keiyo Kogyo Kk | Thermal head |
JPS6195957A (en) * | 1984-10-17 | 1986-05-14 | Fuji Xerox Co Ltd | Thermal recorder |
JPS6267746U (en) * | 1985-10-19 | 1987-04-27 |
Also Published As
Publication number | Publication date |
---|---|
JP2518559Y2 (en) | 1996-11-27 |
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