JPS63154237U - - Google Patents
Info
- Publication number
- JPS63154237U JPS63154237U JP4678487U JP4678487U JPS63154237U JP S63154237 U JPS63154237 U JP S63154237U JP 4678487 U JP4678487 U JP 4678487U JP 4678487 U JP4678487 U JP 4678487U JP S63154237 U JPS63154237 U JP S63154237U
- Authority
- JP
- Japan
- Prior art keywords
- thermal head
- heat dissipation
- dissipation base
- flexible printed
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Electronic Switches (AREA)
Description
第1図は本考案の一実施例の組立図、第2図は
本考案の一実施例の分解図、第3図は従来のサー
マルヘツドユニツトの組立図、第4図は従来のサ
ーマルヘツドユニツトの分解図である。
11……放熱ベース、13……サーマルヘツド
位置決め足、14……ユニツト取付足、15……
引出穴、16……内部空間、17……サーマルヘ
ツド基板、18……フレキシブル・プリント配線
板、19……電子部品、20……コネクタ。
Figure 1 is an assembly diagram of an embodiment of the present invention, Figure 2 is an exploded view of an embodiment of the invention, Figure 3 is an assembly diagram of a conventional thermal head unit, and Figure 4 is an assembly diagram of a conventional thermal head unit. FIG. 11... Heat dissipation base, 13... Thermal head positioning foot, 14... Unit mounting foot, 15...
Drawing hole, 16...internal space, 17...thermal head board, 18...flexible printed wiring board, 19...electronic component, 20...connector.
Claims (1)
の放熱ベースと、多数の微小な発熱体が配設され
たサーマルヘツドと、リード線パターンが形設さ
れるか、或いは、配線パターンが形設され且つ各
種電子部品が実装されたフレキシブル・プリント
配線板とで構成されており、前記放熱ベースの内
部空間に収容された前記フレキシブル・プリント
配線板の先端部は、前記引出穴から引き出されて
、前記放熱ベースの壁の外側に取り付けた前記サ
ーマルヘツドに接続されることを特徴とするサー
マルヘツドユニツト。 (2) 前記放熱ベースは、ユニツト位置決め手段
及びユニツト取付手段が一体に形設されているこ
とを特徴とする実用新案登録請求の範囲第(1)項
記載のサーマルヘツドユニツト。 (3) 前記フレキシブル・プリント配線板は、他
端にコネクタが取り付けられていることを特徴と
する実用新案登録請求の範囲第(1)項記載のサー
マルヘツドユニツト。[Claims for Utility Model Registration] (1) At least a hollow heat dissipation base with a draw-out hole in the wall, a thermal head in which a large number of minute heating elements are arranged, and a lead wire pattern are formed. Alternatively, the flexible printed wiring board is formed with a wiring pattern and mounted with various electronic components, and the tip of the flexible printed wiring board is housed in the internal space of the heat dissipation base. . A thermal head unit, which is pulled out from the draw-out hole and connected to the thermal head attached to the outside of the wall of the heat dissipation base. (2) The thermal head unit according to claim 1, wherein the heat dissipation base has unit positioning means and unit mounting means integrally formed. (3) The thermal head unit according to claim 1, wherein the flexible printed wiring board has a connector attached to the other end.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987046784U JPH078206Y2 (en) | 1987-03-31 | 1987-03-31 | Thermal head unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987046784U JPH078206Y2 (en) | 1987-03-31 | 1987-03-31 | Thermal head unit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63154237U true JPS63154237U (en) | 1988-10-11 |
JPH078206Y2 JPH078206Y2 (en) | 1995-03-01 |
Family
ID=30866770
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987046784U Expired - Lifetime JPH078206Y2 (en) | 1987-03-31 | 1987-03-31 | Thermal head unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH078206Y2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4447672C2 (en) * | 1993-12-20 | 1998-12-10 | Ricoh Kk | Facsimile image scanner with recording head and thermal paper feed |
JP2012020775A (en) * | 2010-07-16 | 2012-02-02 | Hosokawa Yoko Co Ltd | Filling/packaging machine |
JP2015009395A (en) * | 2013-06-27 | 2015-01-19 | 京セラ株式会社 | Thermal head and thermal printer |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5630880A (en) * | 1979-08-24 | 1981-03-28 | Hitachi Ltd | Positioning mechanism for heat-sensitive recorder |
JPS58160163A (en) * | 1982-03-19 | 1983-09-22 | Canon Inc | Thermal head |
JPS6241549U (en) * | 1985-08-28 | 1987-03-12 | ||
JPS62185044U (en) * | 1986-05-14 | 1987-11-25 | ||
JPS62292452A (en) * | 1986-06-11 | 1987-12-19 | Nec Corp | Thermal head |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5731974A (en) * | 1980-08-05 | 1982-02-20 | Toyo Kohan Co Ltd | Production of adhesive for polyolefin resin-coated metal plate |
-
1987
- 1987-03-31 JP JP1987046784U patent/JPH078206Y2/en not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5630880A (en) * | 1979-08-24 | 1981-03-28 | Hitachi Ltd | Positioning mechanism for heat-sensitive recorder |
JPS58160163A (en) * | 1982-03-19 | 1983-09-22 | Canon Inc | Thermal head |
JPS6241549U (en) * | 1985-08-28 | 1987-03-12 | ||
JPS62185044U (en) * | 1986-05-14 | 1987-11-25 | ||
JPS62292452A (en) * | 1986-06-11 | 1987-12-19 | Nec Corp | Thermal head |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4447672C2 (en) * | 1993-12-20 | 1998-12-10 | Ricoh Kk | Facsimile image scanner with recording head and thermal paper feed |
JP2012020775A (en) * | 2010-07-16 | 2012-02-02 | Hosokawa Yoko Co Ltd | Filling/packaging machine |
JP2015009395A (en) * | 2013-06-27 | 2015-01-19 | 京セラ株式会社 | Thermal head and thermal printer |
Also Published As
Publication number | Publication date |
---|---|
JPH078206Y2 (en) | 1995-03-01 |