JPS58160163A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS58160163A JPS58160163A JP4294582A JP4294582A JPS58160163A JP S58160163 A JPS58160163 A JP S58160163A JP 4294582 A JP4294582 A JP 4294582A JP 4294582 A JP4294582 A JP 4294582A JP S58160163 A JPS58160163 A JP S58160163A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat sink
- fitting groove
- thermal head
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
本発明はサーマルヘッドに係り、更に詳しくは複数の発
熱抵抗体を表面に形成した基板を備えたサーマルヘッド
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal head, and more particularly to a thermal head equipped with a substrate having a plurality of heating resistors formed on its surface.
一般に印字〜ラドを記録紙の紙幅方向に走査して記録紙
に印字を行なうシリアル方式のサーマルプリンター等に
用いられるサーマルヘッドは第１図に示すような構造に
なっている。Generally, a thermal head used in a serial type thermal printer or the like which prints on a recording paper by scanning the print-rad in the paper width direction of the recording paper has a structure as shown in FIG.
即ち、両側に取付穴４，４を形成されたヒートシンク５
の上面に基板１が接着固定されており、基板１の上面に
は１×７のドツト状に配列された発熱抵抗体７と、発熱
抵抗体２に電流を供給するための導体パター′ン３とが
設けられている。That is, the heat sink 5 has mounting holes 4, 4 formed on both sides.
A substrate 1 is adhesively fixed to the upper surface of the substrate 1, and on the upper surface of the substrate 1 are heating resistors 7 arranged in a 1×7 dot shape and a conductor pattern 3 for supplying current to the heating resistors 2. is provided.
このような従来の構造のサーマルヘッドの組み立て工程
は、ヒートシンク５の上面に基板１を接着固定するもの
であるが、その接着剤にエポキシ系の接着剤を用いる方
法とシアノアクリレート系なｋの瞬間接着剤を用いる方
法とがある。エポキシ系接着剤による組み立て工程は、
最初に基板１の裏面に接着剤を塗布した後、ヒートシン
ク５の上面の所定の固定位置に重ね合わせ、接着剤が硬
化して基板１がヒートシンク５に接着固定されるまで、
基板１を治具により位置決め固定しておく。The process of assembling a thermal head with such a conventional structure is to adhesively fix the substrate 1 to the top surface of the heat sink 5. There is a method using adhesive. The assembly process using epoxy adhesive is
First, adhesive is applied to the back surface of the substrate 1, and then the substrate 1 is placed on a predetermined fixing position on the top surface of the heat sink 5, until the adhesive hardens and the substrate 1 is adhesively fixed to the heat sink 5.
The substrate 1 is positioned and fixed using a jig.
この方法では基板１を治具により位置決め固定しなけれ
ばならず、それだけ工程が複雑になる上に、治具が必要
となる。In this method, the substrate 1 must be positioned and fixed using a jig, which complicates the process accordingly and requires the jig.
瞬間接着剤による組み立て工程は、最初に基板１をヒー
トシンク５の上面の所定の固定位置に重ね合わせた後、
治具により基板１を位置決め固定し、基板１の端面から
基板１とヒートシンク５の接触接着面に接着剤を注入す
る。接着剤は瞬間的に硬化して基板１はヒートシンク５
上に接着固定される。この方法には治具な用いる点で先
に述べた方法と同じ欠点があるばかりでなく、接着剤の
注入時にしばしば接着剤が基板１の接着面から漏洩し、
基板１の上面にまで流出して、基板１の上面に設けられ
た発熱抵抗体２や導体パターン３の表面に付着してしま
い、その結果印字不良や信号ケーブルとの接触不良等の
原因となる。In the assembly process using instant adhesive, first, the substrate 1 is placed on top of the heat sink 5 at a predetermined fixed position, and then
The substrate 1 is positioned and fixed using a jig, and an adhesive is injected from the end surface of the substrate 1 to the contact adhesive surface between the substrate 1 and the heat sink 5. The adhesive hardens instantly and the substrate 1 becomes the heat sink 5.
It is glued and fixed on top. This method not only has the same disadvantages as the previously mentioned method in terms of the use of jigs, but also the adhesive often leaks from the bonding surface of the substrate 1 during injection of the adhesive.
It leaks to the top surface of the board 1 and adheres to the surface of the heating resistor 2 and conductor pattern 3 provided on the top surface of the board 1, resulting in poor printing and poor contact with the signal cable. .
本発明は以上のような欠点を解消するためになされたも
ので、基板をヒートシンク上に接着固定するサーマルヘ
ッドの組み立て工程において、治具を用いずに基板を正
確にしかも容易に位置決めすることが可能で、組み立て
が容易であり、しがも接着剤の漏洩の無いように構成さ
れたサーマルヘッドを提供することを目的としている。The present invention has been made in order to eliminate the above-mentioned drawbacks, and it is possible to accurately and easily position a board without using a jig in the assembling process of a thermal head in which a board is adhesively fixed on a heat sink. It is an object of the present invention to provide a thermal head that is easy to assemble, and that is configured to prevent adhesive from leaking.
上記の目的を達成するために本発明によるサーマルヘッ
ドにおいては、ヒートシンクに嵌合溝とこの嵌合溝に通
じる貫通孔を形成し、嵌合溝に基板をはめ込んだ後に貫
通孔から接着剤を注入してヒートシンクに基板を接着固
定する構成を採用した。In order to achieve the above object, in the thermal head according to the present invention, a fitting groove and a through hole communicating with the fitting groove are formed in the heat sink, and after a substrate is fitted into the fitting groove, an adhesive is injected through the through hole. We adopted a configuration in which the board is glued and fixed to the heat sink.
以下図面に従って本発明の詳細な説明する。The present invention will be described in detail below with reference to the drawings.
各図中第１図と相当する部分には同一符号を付しその説
明は省略する。第２図には本発明によるサーマルヘッド
が図示されている。基板１の構造は従来のサーマルヘッ
ドのものと同等であるが、ヒートシンク５′にはその上
面の基板１の取り付は位置に、基板１の幅寸法にほぼ等
しい嵌合溝６が、また、嵌合溝６の底面の略中央部には
細長の貫通孔１が形成されている。In each figure, parts corresponding to those in FIG. 1 are designated by the same reference numerals, and their explanation will be omitted. FIG. 2 shows a thermal head according to the invention. The structure of the substrate 1 is the same as that of a conventional thermal head, but the heat sink 5' has a fitting groove 6 approximately equal to the width of the substrate 1 at the position where the substrate 1 is attached on the top surface, and An elongated through hole 1 is formed approximately at the center of the bottom surface of the fitting groove 6 .
以上のような構造による本発明のサーマルヘッドの組み
立て工程は、最初に基板１を嵌合溝６にはめ込み、位置
決めした後、第３図に示すヒートシンク５′の背面側か
ら貫通孔７へ接着剤撒された接着剤が基板１の裏面と嵌
合溝６の底面との接触面に広がり硬化して基板１はヒー
トシンク５′に接着固定される。この工程中基板１の位
置決めは基板１が嵌合溝６にはめ込まれることにより、
治具を用いずに正確にしかも容易に行なうことが口」月
乞である。又、按層舜Ｊの圧入はヒートシンク５′の背
面側の貫通孔７から行なわれるので接着剤が接着面から
漏洩することは皆無となる。The process of assembling the thermal head of the present invention with the above structure is to first fit the substrate 1 into the fitting groove 6 and position it, and then apply adhesive from the back side of the heat sink 5' to the through hole 7 as shown in FIG. The spread adhesive spreads over the contact surface between the back surface of the substrate 1 and the bottom surface of the fitting groove 6 and hardens, so that the substrate 1 is adhesively fixed to the heat sink 5'. During this process, the substrate 1 is positioned by fitting the substrate 1 into the fitting groove 6.
The technique of performing accurately and easily without using any jigs is Kuchi'geki. Further, since the press-fitting of the heat sink J is carried out through the through hole 7 on the back side of the heat sink 5', there is no possibility that the adhesive will leak from the adhesive surface.
以下の説明から明きらかなように本発明によるサーマル
ヘッドにおいては、ヒートシンクに基板の幅寸法にほぼ
等しい幅寸法の嵌合溝と、そこの嵌合溝に通じる貫通孔
が形成されており、その溝に基板をはめ込み、ヒートシ
ンクの背面側がら貫通孔に接着剤を注入して基板をヒー
トシンクに接着固定させる構成を採用しているため、接
着固定によるサーマルヘッドの組立工程において、治具
を用いずに正確にしかも容易に基板の位置決めがなされ
、接着剤の漏洩も皆無となり、接着剤の発熱抵抗体や導
体パターンへの付着による印字不良や接触不良が防がれ
信頼性が高くなるという優れた効果が得られる。As is clear from the following description, in the thermal head according to the present invention, a fitting groove having a width approximately equal to the width of the substrate and a through hole communicating with the fitting groove are formed in the heat sink. The circuit board is fitted into the groove, and adhesive is injected into the through-hole from the back side of the heat sink to adhesively fix the board to the heat sink. This eliminates the need for jigs in the process of assembling the thermal head using adhesive fixation. The board can be positioned accurately and easily, there is no adhesive leakage, and printing and contact failures caused by adhesive adhesion to heating resistors and conductor patterns are prevented, increasing reliability. Effects can be obtained.
第１図は従来のサーマルヘッドの構造を示す斜視図、第
２図は本発明によるサーマルヘッドの基板とヒートシン
クの構成を示す斜視図、第３図は本発明によるサーマル
ヘッドの背面斜視図である。
１・・・基板 ２・・・発熱抵抗体３・・
・導体パターン ４・・・取付穴５′・・・ヒート
シンク ６・・・嵌合溝１・・・貫通孔
特許出願人 キャノン株式会社
代理人 弁理士加藤 卓
３６７−FIG. 1 is a perspective view showing the structure of a conventional thermal head, FIG. 2 is a perspective view showing the structure of the substrate and heat sink of the thermal head according to the present invention, and FIG. 3 is a rear perspective view of the thermal head according to the present invention. . 1... Board 2... Heat generating resistor 3...
・Conductor pattern 4...Mounting hole 5'...Heat sink 6...Fitting groove 1...Through hole Patent applicant Canon Co., Ltd. agent Patent attorney Taku Kato 367-
Claims (1)
してなるサーマルヘッドにおいて、前記ヒートシンクに
基板の嵌合溝とこの嵌合溝（二連じる接着剤注入孔を形
成し、基板な嵌合溝に嵌合させて前記孔を介して基板を
ヒートシンクに接着固定することを特徴とするサーマル
ヘッド。In a thermal head formed by fixing a substrate on which a plurality of heating resistors are formed to a heat sink, the heat sink has a fitting groove of the substrate and this fitting groove (two continuous adhesive injection holes are formed, and a fitting groove of the substrate is formed). A thermal head characterized in that a substrate is adhesively fixed to a heat sink through the hole by fitting into a groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4294582A JPS58160163A (en) | 1982-03-19 | 1982-03-19 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4294582A JPS58160163A (en) | 1982-03-19 | 1982-03-19 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58160163A true JPS58160163A (en) | 1983-09-22 |
Family
ID=12650144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4294582A Pending JPS58160163A (en) | 1982-03-19 | 1982-03-19 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58160163A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6211638U (en) * | 1985-07-08 | 1987-01-24 | ||
| JPS63154237U (en) * | 1987-03-31 | 1988-10-11 | ||
| JPH06195919A (en) * | 1991-01-01 | 1994-07-15 | Fuji Photo Film Co Ltd | Magnetic disk cartridge and its production |
-
1982
- 1982-03-19 JP JP4294582A patent/JPS58160163A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6211638U (en) * | 1985-07-08 | 1987-01-24 | ||
| JPS63154237U (en) * | 1987-03-31 | 1988-10-11 | ||
| JPH078206Y2 (en) * | 1987-03-31 | 1995-03-01 | 株式会社リコー | Thermal head unit |
| JPH06195919A (en) * | 1991-01-01 | 1994-07-15 | Fuji Photo Film Co Ltd | Magnetic disk cartridge and its production |
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