JPH02137094U - - Google Patents
Info
- Publication number
- JPH02137094U JPH02137094U JP4374189U JP4374189U JPH02137094U JP H02137094 U JPH02137094 U JP H02137094U JP 4374189 U JP4374189 U JP 4374189U JP 4374189 U JP4374189 U JP 4374189U JP H02137094 U JPH02137094 U JP H02137094U
- Authority
- JP
- Japan
- Prior art keywords
- frame base
- screw insertion
- insertion hole
- screw
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 7
- 238000003780 insertion Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第1図は本考案に係る高周波機器の一具体例を
分解状態で示す概略斜視図、第2図は本考案装置
要部の部分縦断面図、第3図は第1のビス挿通孔
の形状を例示する連結片の上面図である。第4図
は従来の高周波機器の斜視図、第5図はシールド
仕切構体の斜視図、ームベース、6…メインプリ
ント基板、7…高周波機器、8…シールド仕切構
体、9…連結片、13…締付ビス、14…第1の
ビス挿通孔、15…第2のビス挿通孔、16…雌
ネジ孔。
Fig. 1 is a schematic perspective view showing a specific example of the high frequency device according to the present invention in an exploded state, Fig. 2 is a partial vertical sectional view of the main part of the device of the present invention, and Fig. 3 is the shape of the first screw insertion hole. It is a top view of the connection piece which illustrates. Fig. 4 is a perspective view of a conventional high-frequency device, and Fig. 5 is a perspective view of a shield partition structure. Attached screw, 14...first screw insertion hole, 15...second screw insertion hole, 16...female screw hole.
Claims (1)
レームベース内にプリント配線体を組込み、この
フレームベースをメインプリント基板上に直付け
してなる高周波機器に於いて、 前記フレームベースの角隅部に形成された連結
片に締付ビスの頭部よりも大径の第1のビス挿通
孔を形成し、この第1のビス挿通孔の真下に位置
するプリント配線体に前記締付ビスの頭部よりも
小径の第2のビス挿通孔を穿設し、これらのビス
挿通孔を貫通する締付ビスによつて、フレームベ
ースの下端周縁面をその下方に位置するメインプ
リント基板の上面に密着させて接合螺着したこと
を特徴とする高周波機器。[Claim for Utility Model Registration] In a high-frequency device, a printed wiring body is built into a frame base formed by bending a metal sheet into a rectangular frame shape, and this frame base is directly attached to a main printed circuit board. A first screw insertion hole having a diameter larger than the head of the tightening screw is formed in the connecting piece formed at the corner of the frame base, and a print located directly below the first screw insertion hole is formed. A second screw insertion hole with a smaller diameter than the head of the tightening screw is bored in the wiring body, and the lower end peripheral surface of the frame base is inserted downward by the tightening screw passing through these screw insertion holes. A high-frequency device characterized by being closely attached and screwed to the top surface of the main printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4374189U JPH02137094U (en) | 1989-04-13 | 1989-04-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4374189U JPH02137094U (en) | 1989-04-13 | 1989-04-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02137094U true JPH02137094U (en) | 1990-11-15 |
Family
ID=31556411
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4374189U Pending JPH02137094U (en) | 1989-04-13 | 1989-04-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02137094U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005527114A (en) * | 2002-05-23 | 2005-09-08 | シーメンス インフォメーション アンド コミュニケーション モービル エルエルシイ | Radio wave shield for electronic devices |
-
1989
- 1989-04-13 JP JP4374189U patent/JPH02137094U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005527114A (en) * | 2002-05-23 | 2005-09-08 | シーメンス インフォメーション アンド コミュニケーション モービル エルエルシイ | Radio wave shield for electronic devices |