JPH024231U - - Google Patents
Info
- Publication number
- JPH024231U JPH024231U JP8225988U JP8225988U JPH024231U JP H024231 U JPH024231 U JP H024231U JP 8225988 U JP8225988 U JP 8225988U JP 8225988 U JP8225988 U JP 8225988U JP H024231 U JPH024231 U JP H024231U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- core wire
- feedthrough capacitor
- shield plate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000011900 installation process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案の一実施例を示す断面図、第
２図は要部を示す図、第３図はその側面図、第４
図は取り付けの工程を示す図、第５図は従来の取
付構造を示す図、第６図は枠とシールド板の構造
を示す斜視図、第７図は従来例の取り付け工程を
示す図である。
２……シールド板、３……貫通孔、４……貫通
コンデンサ、５……芯線、６……プリント回路基
板、１０……接続部材、１１……基端、１２……
先端、１３……挾着部。
Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a view showing the main parts, Fig. 3 is a side view thereof, and Fig. 4 is a sectional view showing an embodiment of the invention.
Figure 5 is a diagram showing the installation process, Figure 5 is a diagram showing the conventional installation structure, Figure 6 is a perspective view showing the structure of the frame and shield plate, and Figure 7 is a diagram showing the installation process of the conventional example. . 2... Shield plate, 3... Through hole, 4... Through capacitor, 5... Core wire, 6... Printed circuit board, 10... Connection member, 11... Base end, 12...
Tip, 13... clamping part.
Claims (1)
ント回路基板が設けられ、このプリント回路基板
どうしを接続する芯線とこの芯線とシールド板と
の間に静電容量を構成するコンデンサとからなる
貫通コンデンサが上記貫通孔に嵌装されてなる貫
通コンデンサの取付構造において、上記芯線とプ
リント回路基板の間には、基端においてプリント
回路基板に固着されるとともに先端において上記
芯線を挾着する接続部材が設けられていることを
特徴とする貫通コンデンサの取付構造。 A pair of printed circuit boards are provided on both sides of a shield plate having a through hole, and a feedthrough capacitor is formed of a core wire that connects the printed circuit boards and a capacitor that forms a capacitance between the core wire and the shield plate. In the mounting structure of the feedthrough capacitor fitted in the through hole, a connecting member is provided between the core wire and the printed circuit board, the connecting member being fixed to the printed circuit board at the base end and clamping the core wire at the distal end. A mounting structure for a feedthrough capacitor characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8225988U JPH024231U (en) | 1988-06-21 | 1988-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8225988U JPH024231U (en) | 1988-06-21 | 1988-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH024231U true JPH024231U (en) | 1990-01-11 |
Family
ID=31307021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8225988U Pending JPH024231U (en) | 1988-06-21 | 1988-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH024231U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009145190A1 (en) * | 2008-05-27 | 2009-12-03 | 日本電気株式会社 | High frequency module and wireless device |
-
1988
- 1988-06-21 JP JP8225988U patent/JPH024231U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009145190A1 (en) * | 2008-05-27 | 2009-12-03 | 日本電気株式会社 | High frequency module and wireless device |
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