JPH0180432U - - Google Patents
Info
- Publication number
- JPH0180432U JPH0180432U JP1987175603U JP17560387U JPH0180432U JP H0180432 U JPH0180432 U JP H0180432U JP 1987175603 U JP1987175603 U JP 1987175603U JP 17560387 U JP17560387 U JP 17560387U JP H0180432 U JPH0180432 U JP H0180432U
- Authority
- JP
- Japan
- Prior art keywords
- heating element
- control circuit
- element control
- substrate
- thermal head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例の構成図、第２図は
従来例の構成図である。
１……放熱板、２……発熱体、３……発熱体列
の形成基板、４……発熱体制御回路、５……補強
板、６……ＦＰＣ、７……外部接続部、８……カ
バー。
FIG. 1 is a block diagram of an embodiment of the present invention, and FIG. 2 is a block diagram of a conventional example. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Heat generating element, 3... Heat generating element array formation board, 4... Heat generating element control circuit, 5... Reinforcement plate, 6... FPC, 7... External connection part, 8... …cover.
Claims (1)
成した基板を、それぞれ放熱板上の相互にある角
度を有する異なつた面上に装着したサーマルヘツ
ドにおいて、少なくとも発熱体と発熱体制御回路
との接続用回路と、発熱体制御回路を含む半導体
チツプを同一のフレキシブルプリント回路上に配
置することを特徴とするサーマルヘツド。 In a thermal head in which a substrate on which a heating element is formed and a substrate on which a heating element control circuit is formed are mounted on different sides of a heat sink that are at a certain angle to each other, at least the connection between the heating element and the heating element control circuit is achieved. A thermal head characterized in that a semiconductor chip including a connection circuit and a heating element control circuit are arranged on the same flexible printed circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175603U JPH0180432U (en) | 1987-11-17 | 1987-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987175603U JPH0180432U (en) | 1987-11-17 | 1987-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0180432U true JPH0180432U (en) | 1989-05-30 |
Family
ID=31467388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987175603U Pending JPH0180432U (en) | 1987-11-17 | 1987-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0180432U (en) |
-
1987
- 1987-11-17 JP JP1987175603U patent/JPH0180432U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0180432U (en) | ||
| JPH0180433U (en) | ||
| JPS60194533U (en) | thermal head | |
| JPS58147271U (en) | Enamel substrate with insulation | |
| JPH01165248U (en) | ||
| JPH0299646U (en) | ||
| JPS63149544U (en) | ||
| JPH0330440U (en) | ||
| JPS58107844U (en) | thermal head | |
| JPS6439648U (en) | ||
| JPS6022841U (en) | radiator | |
| JPS6075995U (en) | fever panel | |
| JPH02108033U (en) | ||
| JPS60168947U (en) | thermal print head | |
| JPH0365308U (en) | ||
| JPS61135657U (en) | ||
| JPS6050713U (en) | floor heating system | |
| JPS61127693U (en) | ||
| JPS6212948U (en) | ||
| JPH0234251U (en) | ||
| JPS59164739U (en) | thermal head | |
| JPS62134744U (en) | ||
| JPS60194534U (en) | thermal printing head | |
| JPS60152440U (en) | thermal print head | |
| JPS6327335U (en) |