JPS59146138U - thermal printing head - Google Patents

thermal printing head

Info

Publication number
JPS59146138U
JPS59146138U JP4075183U JP4075183U JPS59146138U JP S59146138 U JPS59146138 U JP S59146138U JP 4075183 U JP4075183 U JP 4075183U JP 4075183 U JP4075183 U JP 4075183U JP S59146138 U JPS59146138 U JP S59146138U
Authority
JP
Japan
Prior art keywords
print head
thermal print
insulating substrate
head according
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4075183U
Other languages
Japanese (ja)
Inventor
三原　嘉久雄
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP4075183U priority Critical patent/JPS59146138U/en
Publication of JPS59146138U publication Critical patent/JPS59146138U/en
Pending legal-status Critical Current

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  • Electronic Switches (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の感熱印字ヘッドを示す斜視図、第２図及
び第３図は従来の感熱印字ヘッドを用いて印字すること
を示す模式口、第４図は本考案の感熱印字ヘッドの一実
施例を示す斜視図、第５図は本考案の感熱印字ヘッドの
他の実施例を示す斜視図である。 １・・・感熱印字ヘッド、２・・・高熱伝導性絶縁基板
、３・・・グレーズ層、４・・・発熱抵抗体、５・・・
放熱板、５０１・・・突出部、１１・・・突起。 二 ｍ−− ′１　　　　− ア ＼５　　　　−１− ４　　゛と’ｆ”ｆ’八へ（／FIG. 1 is a perspective view showing a conventional thermal print head, FIGS. 2 and 3 are schematic diagrams showing printing using a conventional thermal print head, and FIG. 4 is a perspective view of a thermal print head of the present invention. FIG. 5 is a perspective view showing another embodiment of the thermal print head of the present invention. DESCRIPTION OF SYMBOLS 1...Thermal print head, 2...High thermal conductivity insulating substrate, 3...Glaze layer, 4...Heating resistor, 5...
Heat dissipation plate, 501...Protrusion, 11...Protrusion. 2 m-- '1 - A\5 -1- 4 ゛ and 'f'f' eight (/

Claims (7)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）　　放熱板上に配置された絶縁基板と、この絶縁
基板上に形成された複数個の発熱抵抗体とからなる感熱
印字ヘッドにおいて、複数個の前記発熱抵抗体の並び方
向に沿い前記放熱板上に突起を配置したことを特徴とす
る感熱印字ヘッド。(1) In a thermal print head consisting of an insulating substrate placed on a heat sink and a plurality of heat generating resistors formed on the insulating substrate, the heat dissipation occurs along the direction in which the plural heat generating resistors are arranged. A thermal print head characterized by projections arranged on a plate. （２）前記突起の高さは、前記絶縁基板の厚さと実質的
に同等かまたは絶縁基板の厚さより大であることを特徴
とする実用新案登録請求の範囲第１項記載の感熱印字ヘ
ッド。(2) The thermal print head according to claim 1, wherein the height of the protrusion is substantially equal to or greater than the thickness of the insulating substrate. （３）　　前記発熱抵抗体はグレーズ層上に配置されて
いることを特徴とする実用新案登録請求の範囲第１項記
載の感熱印字ヘッド。(3) The thermal print head according to claim 1, wherein the heating resistor is disposed on a glaze layer. （４）　　前記突起の高さの範囲は、前記絶縁基板の厚
さから前記グレーズ層の間にあることを特徴とする実用
新案登録請求の範囲第３項記載の感熱印字ヘッド。(4) The thermal print head according to claim 3, wherein the range of the height of the protrusion is between the thickness of the insulating substrate and the glaze layer. （５）複数個の前記発熱抵抗体の並びに沿って前記放熱
板の周縁部に突出部を形成したことを特徴とする実用新
案登録請求の範囲第１項記載の感熱印字ヘッド。(5) The thermal print head according to claim 1, which is a registered utility model, characterized in that a protrusion is formed on the peripheral edge of the heat sink along the alignment of the plurality of heating resistors. （６）前記突出部の高さは前記絶縁基板の厚さと実質的
に等しいことを特徴とする実用新案登録請求の範囲第５
項記載の感熱印字ヘッド。(6) Utility model registration claim 5, characterized in that the height of the protrusion is substantially equal to the thickness of the insulating substrate.
Thermal print head described in section. （７）前記突起は前記絶縁基板を挾むように前記放熱板
上に配置されていることを特徴とする実用新案登録請求
の範囲第１項記載の感熱印字ヘッド。(7) The thermal print head according to claim 1, wherein the projections are arranged on the heat sink so as to sandwich the insulating substrate.
JP4075183U 1983-03-23 1983-03-23 thermal printing head Pending JPS59146138U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4075183U JPS59146138U (en) 1983-03-23 1983-03-23 thermal printing head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4075183U JPS59146138U (en) 1983-03-23 1983-03-23 thermal printing head

Publications (1)

Publication Number Publication Date
JPS59146138U true JPS59146138U (en) 1984-09-29

Family

ID=30171363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4075183U Pending JPS59146138U (en) 1983-03-23 1983-03-23 thermal printing head

Country Status (1)

Country Link
JP (1) JPS59146138U (en)

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