JPS6343745U - - Google Patents
Info
- Publication number
- JPS6343745U JPS6343745U JP13878186U JP13878186U JPS6343745U JP S6343745 U JPS6343745 U JP S6343745U JP 13878186 U JP13878186 U JP 13878186U JP 13878186 U JP13878186 U JP 13878186U JP S6343745 U JPS6343745 U JP S6343745U
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- insulating layer
- heating resistor
- lower insulating
- conductor lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 230000001681 protective effect Effects 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Description
第１図は本考案の一実施例によるサーマルヘツ
ドを示す断面側面図、第２図は従来のサーマルヘ
ツドを示す断面側面図である。
図において、１は発熱基板、２は下部絶縁層、
３は導体リード、４は発熱抵抗体、５は保護膜で
ある。なお、図中同一符号は同一又は相当部分を
示す。
FIG. 1 is a sectional side view showing a thermal head according to an embodiment of the present invention, and FIG. 2 is a sectional side view showing a conventional thermal head. In the figure, 1 is a heat generating substrate, 2 is a lower insulating layer,
3 is a conductor lead, 4 is a heating resistor, and 5 is a protective film. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
導体リード以下の厚みの下部絶縁層を形成し、そ
の上に発熱抵抗体を形成したことを特徴とするサ
ーマルヘツド。 (2) 発熱抵抗体が形成される下層の導体リード
の厚みを他の部分の導体リードの厚みより薄くし
たことを特徴とする実用新案登録請求の範囲第１
項記載のサーマルヘツド。 (3) 下部絶縁層を写真製版法を用いて形成した
ことを特徴とする実用新案登録請求の範囲第１項
記載のサーマルヘツド。 (4) 下部絶縁層の厚みを導体リードの厚みと発
熱抵抗体の厚みの和以下にしたことを特徴とする
実用新案登録請求の範囲第１項乃至第３項記載の
サーマルヘツド。[Claims for Utility Model Registration] (1) A thermal device characterized by forming a lower insulating layer on the surface of a heating substrate with a length equal to the length of the heating resistor and a thickness less than the conductor lead, and forming the heating resistor on top of the lower insulating layer. Head. (2) Claim 1 of the utility model registration, which is characterized in that the thickness of the conductor lead in the lower layer where the heating resistor is formed is thinner than the thickness of the conductor lead in other parts.
Thermal head described in section. (3) The thermal head according to claim 1, wherein the lower insulating layer is formed using a photolithography method. (4) The thermal head according to any of claims 1 to 3, wherein the thickness of the lower insulating layer is less than or equal to the sum of the thickness of the conductor lead and the thickness of the heating resistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13878186U JPS6343745U (en) | 1986-09-09 | 1986-09-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13878186U JPS6343745U (en) | 1986-09-09 | 1986-09-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6343745U true JPS6343745U (en) | 1988-03-24 |
Family
ID=31044070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13878186U Pending JPS6343745U (en) | 1986-09-09 | 1986-09-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343745U (en) |
-
1986
- 1986-09-09 JP JP13878186U patent/JPS6343745U/ja active Pending
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