JPS6382987U - - Google Patents
Info
- Publication number
- JPS6382987U JPS6382987U JP17690386U JP17690386U JPS6382987U JP S6382987 U JPS6382987 U JP S6382987U JP 17690386 U JP17690386 U JP 17690386U JP 17690386 U JP17690386 U JP 17690386U JP S6382987 U JPS6382987 U JP S6382987U
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- view
- board
- circuit board
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案の回路基板の第１実施例を示
す斜視図、第２図は第１実施例の回路基板の正面
図、第３図ａは第１実施例のセラミツク基板の正
面図、第３図ｂはこの基板の右側面図、第３図ｃ
はこの基板の背面図、第３図ｄはこの基板の底面
図、第４図はこの実施例の回路基板の放熱効果を
示すグラフ、第５図ａはこの考案の他の実施例の
放熱部を示す図、第５図ｂはこの考案のさらに他
の実施例の放熱部を示す図、第５図ｃはこの考案
のさらに他の実施例の放熱部を示す図、第５図ｄ
はこの考案のさらに他の実施例の放熱部を示す図
、第６図は従来の抵抗体基板を示す斜視図である
。
１０……セラミツク基板、１０ｂ……放熱部。
FIG. 1 is a perspective view showing the first embodiment of the circuit board of this invention, FIG. 2 is a front view of the circuit board of the first embodiment, FIG. 3a is a front view of the ceramic board of the first embodiment, Figure 3b is a right side view of this board, Figure 3c
is a rear view of this board, FIG. 3d is a bottom view of this board, FIG. 4 is a graph showing the heat radiation effect of the circuit board of this embodiment, and FIG. 5a is a heat radiation part of another embodiment of this invention. FIG. 5b is a diagram showing a heat radiating part of still another embodiment of this invention, FIG. 5 c is a diagram showing a heat radiating part of still another embodiment of this invention, and FIG. 5 d
6 is a diagram showing a heat dissipation section of still another embodiment of this invention, and FIG. 6 is a perspective view showing a conventional resistor board. 10... Ceramic substrate, 10b... Heat dissipation section.
Claims (1)
の基板表面の回路が設けられている部分以外の部
分に、凹凸を有する放熱部を形成したことを特徴
とする回路基板。 1. A circuit board having a circuit provided on its surface, characterized in that a heat radiating portion having projections and depressions is formed on a portion of the surface of the substrate other than the portion where the circuit is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17690386U JPS6382987U (en) | 1986-11-18 | 1986-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17690386U JPS6382987U (en) | 1986-11-18 | 1986-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6382987U true JPS6382987U (en) | 1988-05-31 |
Family
ID=31117596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17690386U Pending JPS6382987U (en) | 1986-11-18 | 1986-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6382987U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS619866B2 (en) * | 1980-08-06 | 1986-03-26 | Mitsubishi Electric Corp | |
| JPS6138997B2 (en) * | 1981-06-24 | 1986-09-01 | Uerukutsuoiku Mas Fab Eerikon Byuure Ag |
-
1986
- 1986-11-18 JP JP17690386U patent/JPS6382987U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS619866B2 (en) * | 1980-08-06 | 1986-03-26 | Mitsubishi Electric Corp | |
| JPS6138997B2 (en) * | 1981-06-24 | 1986-09-01 | Uerukutsuoiku Mas Fab Eerikon Byuure Ag |