JPH0359660U - - Google Patents

Info

Publication number
JPH0359660U
JPH0359660U JP12004489U JP12004489U JPH0359660U JP H0359660 U JPH0359660 U JP H0359660U JP 12004489 U JP12004489 U JP 12004489U JP 12004489 U JP12004489 U JP 12004489U JP H0359660 U JPH0359660 U JP H0359660U
Authority
JP
Japan
Prior art keywords
dividing
depth
grooves
ceramic
deeper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12004489U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12004489U priority Critical patent/JPH0359660U/ja
Publication of JPH0359660U publication Critical patent/JPH0359660U/ja
Pending legal-status Critical Current

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  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例に係るセラミツク親
基板の部分拡大正面図、第２図はセラミツク親基
板の外観斜視図、第３図ａは従来例の分割用溝を
示す部分拡大正面図、第３図ｂはその分割面を示
す説明図、第４図ａは他の従来例の分割用溝を示
す部分拡大正面図、第４図ｂはその分割面を示す
説明図である。 １……アルミナ親基板、２……分割用溝、３…
…分割用溝。 FIG. 1 is a partially enlarged front view of a ceramic parent board according to an embodiment of the present invention, FIG. 2 is an external perspective view of the ceramic parent board, and FIG. 3a is a partially enlarged front view showing dividing grooves of a conventional example. , FIG. 3b is an explanatory view showing the dividing surface, FIG. 4a is a partially enlarged front view showing another conventional dividing groove, and FIG. 4b is an explanatory view showing the dividing surface. 1...Alumina parent board, 2...Dividing groove, 3...
...Dividing groove.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 分割線に沿つてセラミツク親基板の表裏両面に
分割用溝を凹設し、表裏の分割用溝のうち一方の
分割用溝の深さを他方の分割用溝の深さよりも深
くし、両分割用溝の深さ比を１．２以上としたこ
とを特徴とするセラミツク親基板の構造。 Dividing grooves are formed on both the front and back sides of the ceramic motherboard along the dividing line, and the depth of one of the dividing grooves on the front and back is deeper than the depth of the other dividing groove. A structure of a ceramic parent substrate characterized in that the depth ratio of the grooves is 1.2 or more.
JP12004489U 1989-10-12 1989-10-12 Pending JPH0359660U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12004489U JPH0359660U (en) 1989-10-12 1989-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12004489U JPH0359660U (en) 1989-10-12 1989-10-12

Publications (1)

Publication Number Publication Date
JPH0359660U true JPH0359660U (en) 1991-06-12

Family

ID=31668135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12004489U Pending JPH0359660U (en) 1989-10-12 1989-10-12

Country Status (1)

Country Link
JP (1) JPH0359660U (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031731A (en) * 2001-07-16 2003-01-31 Toshiba Corp Ceramic substrate, its manufacturing method, and ceramic circuit board
JP2006013318A (en) * 2004-06-29 2006-01-12 Hitachi Metals Ltd Laminated board and high-frequency electronic part, and method for manufacturing the same
JP2006269725A (en) * 2005-03-24 2006-10-05 Matsushita Electric Ind Co Ltd Ceramic device and its manufacturing method
JP2009212319A (en) * 2008-03-05 2009-09-17 Ngk Spark Plug Co Ltd Method of manufacturing multiple patterning wiring board
JP2012084642A (en) * 2010-10-08 2012-04-26 Stanley Electric Co Ltd Manufacturing method of ceramic multilayer wiring board

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031731A (en) * 2001-07-16 2003-01-31 Toshiba Corp Ceramic substrate, its manufacturing method, and ceramic circuit board
JP2006013318A (en) * 2004-06-29 2006-01-12 Hitachi Metals Ltd Laminated board and high-frequency electronic part, and method for manufacturing the same
JP4505803B2 (en) * 2004-06-29 2010-07-21 日立金属株式会社 Manufacturing method of high-frequency electronic components
JP2006269725A (en) * 2005-03-24 2006-10-05 Matsushita Electric Ind Co Ltd Ceramic device and its manufacturing method
JP2009212319A (en) * 2008-03-05 2009-09-17 Ngk Spark Plug Co Ltd Method of manufacturing multiple patterning wiring board
JP2012084642A (en) * 2010-10-08 2012-04-26 Stanley Electric Co Ltd Manufacturing method of ceramic multilayer wiring board

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