JPS6226043U - - Google Patents
Info
- Publication number
- JPS6226043U JPS6226043U JP11715985U JP11715985U JPS6226043U JP S6226043 U JPS6226043 U JP S6226043U JP 11715985 U JP11715985 U JP 11715985U JP 11715985 U JP11715985 U JP 11715985U JP S6226043 U JPS6226043 U JP S6226043U
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor cooler
- brazed
- groove
- registration request
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005219 brazing Methods 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 1
Description
第１図はこの考案の第１実施例を示す半導体用
冷却器の部分斜視図、第２図は第１図の冷却器の
部分拡大縦断面図、第３図はこの考案の第２実施
例の半導体用冷却器の部分斜視図、第４図と第５
図はそれぞれこの考案の変形例を示す冷却器の部
分拡大縦断面図、第６図は従来例を示す部分拡大
断面図である。
１…ベース、３…プレート・フイン（放熱体）
、４…ろう材流下防止用凹溝、５…周側面、６…
接合板、７…放熱体。
Fig. 1 is a partial perspective view of a semiconductor cooler showing a first embodiment of this invention, Fig. 2 is a partially enlarged vertical sectional view of the cooler shown in Fig. 1, and Fig. 3 is a second embodiment of this invention. Partial perspective views of semiconductor coolers, Figures 4 and 5
The figures are partially enlarged vertical sectional views of coolers showing modified examples of this invention, and FIG. 6 is partially enlarged sectional views showing a conventional example. 1...Base, 3...Plate fin (heat sink)
, 4...concave groove for preventing brazing metal from flowing down, 5...peripheral side surface, 6...
Joint plate, 7... Heat sink.
Claims (1)
ウム製半導体用冷却器のベースであつて、周側面
５のうち所要の側面５ａに、ろう付けのさいろう
材の流下を防止する凹溝４が設けられている半導
体用冷却器のベース。 This is a base of an aluminum semiconductor cooler to which heat sinks 3 and 7 are brazed on the upper surface, and a groove 4 is provided on a required side surface 5a of the circumferential side surface 5 to prevent the flow of solder metal during brazing. The base of the semiconductor cooler provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11715985U JPH0337236Y2 (en) | 1985-07-30 | 1985-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11715985U JPH0337236Y2 (en) | 1985-07-30 | 1985-07-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6226043U true JPS6226043U (en) | 1987-02-17 |
| JPH0337236Y2 JPH0337236Y2 (en) | 1991-08-07 |
Family
ID=31002416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11715985U Expired JPH0337236Y2 (en) | 1985-07-30 | 1985-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0337236Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059713A (en) * | 2015-09-17 | 2017-03-23 | 株式会社日立国際電気 | Method of manufacturing radiator |
-
1985
- 1985-07-30 JP JP11715985U patent/JPH0337236Y2/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017059713A (en) * | 2015-09-17 | 2017-03-23 | 株式会社日立国際電気 | Method of manufacturing radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0337236Y2 (en) | 1991-08-07 |
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