JPS61162060U - - Google Patents
Info
- Publication number
- JPS61162060U JPS61162060U JP4500585U JP4500585U JPS61162060U JP S61162060 U JPS61162060 U JP S61162060U JP 4500585 U JP4500585 U JP 4500585U JP 4500585 U JP4500585 U JP 4500585U JP S61162060 U JPS61162060 U JP S61162060U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dissipation structure
- fins
- fin
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
Description
第1図乃至第3図は従来の放熱構造体を示すも
のであり、第1図及び第3図は正面図、第2図は
平面図である。又第4図は本考案放熱構造体にお
ける金属シヤーシーに切込部を設けた平面図、第
5図乃至第8図は本考案放熱構造体の1例を示す
ものであり、第5図及び第7図は平面図、第6図
及び第8図は正面図である。
1……金属シヤーシー、2……ヒートパイプ、
3……放熱フイン、4……ブロツク、5……半導
体、6……取付金具、7……半導体取付板、10
,10′,10″…フイン。
1 to 3 show a conventional heat dissipation structure, in which FIGS. 1 and 3 are front views, and FIG. 2 is a plan view. Further, FIG. 4 is a plan view of the heat dissipation structure of the present invention in which a notch is provided in the metal chassis, and FIGS. 5 to 8 show an example of the heat dissipation structure of the present invention. FIG. 7 is a plan view, and FIGS. 6 and 8 are front views. 1...Metal chassis, 2...Heat pipe,
3... Heat dissipation fin, 4... Block, 5... Semiconductor, 6... Mounting bracket, 7... Semiconductor mounting plate, 10
, 10', 10''...fin.
Claims (1)
金属シヤーシに伝熱する放熱構造体において、該
シヤーシーの表面に設けるフインを、その形状に
応じて断面コ字型状の切込部を所定間隔毎に設け
、該切込部を引き起してフインを形成したことを
特徴とする放熱構造体。 In a heat dissipation structure that transfers heat generated from a semiconductor to a metal chassis via a heat sink, fins provided on the surface of the chassis are provided with cut portions having a U-shaped cross section at predetermined intervals according to the shape of the fins. A heat dissipation structure characterized in that the cut portion is raised to form a fin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4500585U JPS61162060U (en) | 1985-03-29 | 1985-03-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4500585U JPS61162060U (en) | 1985-03-29 | 1985-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS61162060U true JPS61162060U (en) | 1986-10-07 |
Family
ID=30558110
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4500585U Pending JPS61162060U (en) | 1985-03-29 | 1985-03-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS61162060U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009283648A (en) * | 2008-05-22 | 2009-12-03 | Furukawa Electric Co Ltd:The | Heat sink |
-
1985
- 1985-03-29 JP JP4500585U patent/JPS61162060U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009283648A (en) * | 2008-05-22 | 2009-12-03 | Furukawa Electric Co Ltd:The | Heat sink |
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